• Journal of the Semiconductor & Display Technology
• /
• v.23 no.1
• /
• pp.52-55
• /
• 2024

In this paper, a state change study was conducted through Frequency Domain Reflectometry (FDR) technology for the process chamber of plasma equipment for semiconductor manufacturing. In the experiment, by direct connecting the network analyzer to the RF matcher input of the 300 mm plasma enhanced chemical vapor deposition (PECVD) chamber, S11 was measured in a situation where plasma was not applied, and the frequency domain reacting to the chamber state change was searched. Response factors to changes in the status, such as temperature, spacing of the heating chuck, internal pressure difference, and process gas supply state were confirmed. Through this, the frequency domain in which a change in the reflection value was detected through repeated experiments. The reliability of the measured micro-displacement was verified through reproducibility experiments.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.262.2-262.2
• /
• 2014

Plasma processing is an essential process for pattern etching and thin film deposition in nanoscale semiconductor device fabrication. It is necessary to maintain plasma chamber in steady-state in production. In this study, we determined plasma chamber state with residual gas analysis with self-plasma optical emission spectroscopy. Residual gas monitoring of fluorocarbon plasma etching chamber was performed with self-plasma optical emission spectroscopy (SPOES) and various chemical elements was identified with a SPOES system which is composed of small inductive coupled plasma chamber for glow discharge and optical emission spectroscopy monitoring system for measuring optical emission. This work demonstrates that chamber state can be monitored with SPOES and this technique can potentially help maintenance in production lines.

• Journal of the Speleological Society of Korea
• /
• no.78
• /
• pp.29-31
• /
• 2007

This paper is devoted to a study of the characterization of the plasma state. For the purpose of monitoring plasma condition, we experiment on reactive ion etching (RIE) process. Without actual etch process, generated oxygen plasma, measurement of plasma emission intensity. Changing plasma process parameters, oxygen flow, RF power and chamber pressure have controlled. Using the optical emission spectroscopy (OES), we conform to the unique oxygen wavelength (777nm), the most powerful intensity region of the designated range. Increase of RF power and chamber pressure, emission intensity is increased. oxygen flow is not affect to emission intensity.

• Proceedings of the Korean Society of Propulsion Engineers Conference
• /
• 2008.03a
• /
• pp.680-685
• /
• 2008

The ejector is a simple device which can transport a low-pressure secondary flow by using a high-pressure primary flow. In general, it consists of a primary driving nozzle, a mixing section, and a diffuser. The ejector system entrains the secondary flow through a shear action generated by the primary jet. Until now, a large number of researches have been made to design and evaluate the ejector systems, where it is assumed that the ejector system has an infinite secondary chamber which can supply mass infinitely. However, in almost all of the practical applications, the ejector system has a finite secondary chamber implying steady flow can be possible only after the flow inside ejector has reached an equilibrium state after the starting process. To the authors' best knowledge, there are no reports on the starting characteristics of the ejector systems and none of the works to date discloses the detailed flow process until the secondary chamber flow reaches an equilibrium state. The objective of the present study is to investigate the starting process of an ejector-diffuser system. The present study is also planned to identify the operating range of ejector-diffuser systems where the steady flow assumption can be applied without uncertainty. The results obtained show that the one and only condition in which an infinite mass entrainment is possible is the generation of a recirculation zone near the primary nozzle exit. The flow in the secondary chamber attains a state of dynamic equilibrium at this point.

• Journal of Advanced Marine Engineering and Technology
• /
• v.21 no.3
• /
• pp.302-310
• /
• 1997

In this paper, we find a method to improve ignitability using methanol which is prospective as an alternative fuel. The constant volume combuster is divided into main chamber and sub-cham¬ber. These two chambers are linked by an adapter which is shaped like a cup. We also compare CDI to HIS that is revised in our laboratory for making a scrutiny into the effects of ignition char¬acteristics. Besides, we analyze a flame propagation process in the main and sub-chamber through taking pictures 10, 000 frames per second by high speed camera at the state being fabricated quartz glass aside main and sub-chamber.

• Journal of the Korea Furniture Society
• /
• v.20 no.6
• /
• pp.599-604
• /
• 2009

For the search of unified law of moisture movement in wood, moisture distribution of Korean red pine at non-steady state was investigated. We assume that the equilibrium moisture content (EMC) in wood depends on only temperature and relative humidity, it can be control in temperature and humidity chamber. If temperature is constant and humidity or vapor pressure is changed with sin curve shape at adequate cycles, EMC in chamber can be changed as well with sin-curve shape. The setup condition of a non-steady state in humidity control chambers is a constant temperature at $20^{\circ}C$ and 15+10 sin ${\omega}t$ percent EMC. It can be found that the distribution of moisture in the specimen with varying relative humidity are illustrated various types. Moisture in wood is complicated and vibrates with the moisture sorption process. Considering a unified law of moisture movement in wood, it is considered that the most important fact is to search the method of precise diffusion & transfer coefficients.

• Journal of the Korean Society for Precision Engineering
• /
• v.20 no.5
• /
• pp.66-72
• /
• 2003

In case of hollow cylinder extrusion using porthole die, the effects of extrusion parameters-temperature, the speed of extrusion, the shape of the die and mandrel-on metal flow in porthole die extrusion of aluminum have been investigated. However, there have been few studies about condenser tube extruded by porthole die. Original metal flow of condenser tube by porthole die extrusion is similar to hollow cylinder extrusion but the estimation of metal flow for extrusion parameters is different. For example, variation of chamber length in hollow extrusion only affects the welding pressure, however, the welding chamber length in condenser tube extrusion influences to the welding pressure as well as the deflection of mandrel. This study was designed to evaluate metal flow, welding pressure, extrusion load, tendency of mandrel deflection according to angular variation in the bottom of chamber in porthole die. Estimation was carried out using finite element method in as non-steady state. Analytical results can provide useful information the optimal design of porthole die.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2002.11a
• /
• pp.33-41
• /
• 2002

In case of hollow cylinder extrusion using porthole die, the effects of extrusion parameters-temperature, the speed of extrusion, the shape of the die and mandrel-on metal flow in porthole die extrusion of aluminum have been investigated. However, there have been few studies about condenser tube extruded by porthole die. This study was designed to evaluate metal flow, welding pressure, extrusion load, tendency of mandrel deflection according to variation of chamber length. in porthole die. Estimation was carried out using finite element method. Porthole die is analyzed in as non-steady state. Analytical results provide useful information the optimal design of porthole die.

• Journal of Power System Engineering
• /
• v.9 no.2
• /
• pp.73-80
• /
• 2005

Both theoretical and experimental investigations were conducted to analyze defrosting behavior of a window heater operating in the low outdoor temperature($-20^{\circ}C$). To achieve this purpose, first a warm-chamber experiment($23^{\circ}C$) was performed to measure inner and outer surface temperature of the rear window(heated by the electric heater supplying 195 W) as functions of both time and position. Secondly, a cold chamber experiment was made to continuously record defrosting process of the frosted window. From the comparisons of the two experimental results, it was found that there was a similarity between the spatial distributions of both temperature and remaining frost. Thus, the temperature data from the warm-chamber experiments can be utilized to predict an expected zone covered with remaining frosts, and this approach can also be adopted in the inspection process in order to economically guarantee optimized performance of the window heater. Finally, an analytical model based on one-dimensional, steady-state heat transfer theories was proposed and successfully predicted the outer surface temperature of the rear window surrounded by cold air($-20^{\circ}C$) for the given operating conditions(heater power, inside and outside heat transfer coefficients, and surrounding air temperature, etc.).

• Journal of IKEEE
• /
• v.22 no.2
• /
• pp.302-308
• /
• 2018

Multi-Layer Sputtering is aim to develop desired thickness thin film multi-layer with different materials. The multi-layer thin film deposition process occupies a relatively large portion in the process time, because the main reason is that it takes much time to move the substrate to be deposited and to make the chamber into a high vacuum state compared to the process time. Most of semiconductor and display industries sputter a single substance in one chamber and move boards through multi-continuous robots to another chamber to sputter other materials. This will inevitably require multiple chambers, vacuum pumps, and multi-contamination robots within the process facility. To solve these problems, this paper proposes a control system for multi-layer thin film sputtering devices that deposit different materials within a single vacuum chamber and is applied in TFT process. The manufacture and experiment of the control system proved its validity.