• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.749-750
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• 2008

• 한국신뢰성학회지:신뢰성응용연구
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• 제7권1호
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• pp.23-29
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• 2007

Probe card is a test component which is to classify the known good die with electrical contact before the packaging in the ATE (automatic testing equipment). Conventional probe tip was mostly needle type, it has been difficult to meet with conventional type, because of decreasing chip size, pad to pad pitch and pads size increasingly. For that reason, probe cards using MEMS (micro electro mechanical system) technology have been developed for various semiconductor chips. In this paper, Area Array type MEMS Probe tip was designed,, fabricated, and characterized its mechanical and electrical properties. The authors found that good electrical characteristics under $1{\Omega}$ were acquired with gold (Au) and aluminium (Al) pad contact test over 0.5gf and 4gf respectively. And, contact resistance variation under $0.1{\Omega}$ were achieved with 100,000 times of repetition test. And, insertion loss (IS) for high frequency operation was ascertained over 300MHz at -3dB loss.

• 한국의학물리학회:학술대회논문집
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• 한국의학물리학회 2004년도 제29회 추계학술대회 발표논문집
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• pp.85-87
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• 2004

원격조정 아프터로딩 시스템에 사용하는 폴리에틸렌 삽입관에 금박을 입혀 라디오파(RF) 안테나로도 병행사용할수 있는 열 방사선 병용삽입관 을 제작하였다. 30W의 RF 전력으로 15분간 한천 판톰에 가열하였을 때 폴리에틸렌관은 약 5oC 상승하였으나 금박으로 코팅 된 폴리에틸렌관은 약 20${\circ}$C 상승하여 RF 안테나로 대용할 수가 있었다. 한천 팬텀 중앙부에 길이가 2 cm 인 4개의 전극을 1 cm 간격으로 정사각형이 되도록 삽입하여 가열하였을 때 90%등온곡선이 반경 1.25 cm 의 원형으로 균일하게 분포되었고 2 cm 간격으로 삽일 하였을 때 1.75 cm 반경으로 거의 4 각형의 균일한 분포를 얻었다. 개의 뇌 실질에 정방형의 중심을 43${\circ}$C로 50분간 온열 요법을 시행한 후 관찰한 조직병리학적 소견에서 의미있는 변화를 보였다.

• 한국전기전자재료학회논문지
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• 제23권6호
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• pp.481-486
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• 2010

ENIG (electroless Ni immersion gold) is one of surface finishing which has been most widely used in fine pitch SMT (surface mount technology) and BGA (ball grid array) packaging process. The reliability for package bondability is mainly affected by interfacial reaction between solder and surface finishing. Since the behavior of IMC (intermetallic compound), or the interfacial reaction between Ni and solder, affects to some product reliabilities such as solderability and bondability, understanding behavior of IMC should be important issue. Thus, we studied the properties of ENIG with P contents (9 wt% and 13 wt%), where the P contents is one of main factors in formation of IMC layer. The effect of P content was discussed using the results obtained from FE-SEM(field-emission scanning electron microscope), EPMA(electron probe micro analyzer), EDS(energy dispersive spectroscopy) and Dual-FIB(focused ion beam). Especially, we observed needle type irregular IMC layer with decreasing Ni contents under high P contents (13 wt%). Also, we found how IMC layer affects to bondability with forming continuous Kirkendall voids and thick P-rich layer.