• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.9
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• pp.825-831
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• 2006

As an increase of chip complexity and level of chip integration, chip input/output (I/O) pad pitches are also drastically reduced. With arrival of high complexity SoC (System on Chip) and SiP (System in Package) products, conventional horizontal type probe card showed its limitation on probing density for wafer level test. To enhance probing density, we proposed new vertical type probe card that has the $70{\mu}m$ probe needle with tungsten wire in $80{\mu}m$ micro-drilled hole in ceramic board. To minimize alignment error, micro-drilling conditions are optimized and epoxy-hardening conditions are also optimized to minimize planarity changes. To apply wafer level test for target devices (T5365 256M SDRAM), designed probe card was characterized by probe needle tension for test, contact resistance measurement, leakage current measurement and the planarity test. Compare to conventional probe card with minimum pitch of $50{\sim}125{\mu}m\;and\;2\;{\Omega}$ of average contact resistance, designed probe card showed only $22{\mu}$ of minimum pitch and $1.5{\Omega}$ of average contact resistance. And also, with the nature of vertical probing style, it showed comparably small contact scratch and it can be applied to bumping type chip test.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.5 no.1
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• pp.25-31
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• 2009

Steam Generator(SG) tube is an important component of Nuclear Power Plant(NPP), which comprises of the pressure boundary of primary system. The integrity of SG tube has been confirmed by the eddy current test every outage. In Korea, Bobbin probe and MRPC probe have been generally used for the eddy current test. Meanwhile the usage of Array probe has gradually increased in U.S., Japan and other countries. In this study, we investigated the defect detection capability of the Array probe through its preliminary application to SG tube inspection. The Array probe has the equivalent capability in the defect detection and sizing as the conventional methods. Thus it is desirable that the Array probe is generally applied to SG tube inspection in the domestic NPPs.

• Progress in Superconductivity
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• v.4 no.1
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• pp.74-79
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• 2002

High-speed probe made to test single flux quantum(SFQ) circuits was comprised of semi-rigid coaxial cables and microstrip lines. The impedance was set at 50 $\Omega$to carry high-speed signals without much loss. To do performance test of high-speed probe, we have attempted to fabricate a test chip which has a coplanar waveguide(CPW) structure. Electromagnetic simulation was done to optimize the dimension of CPW so that the CPW structure has an impedance of 50$\Omega$, matching in impedance with the probe. We also used the simulation to investigate the effect of the width of signal line and the gap between signal line and ground plane to the characteristics of CPW structure. We fabricated the CPW structure with a gold film deposited on Si wafer whose resistivity was above $1.5\times$10$_4$$\Omega$.cm. The magnitudes of S／sub 21／ of CPW at 6 ㎓ in simulations and in the actual measurements done with a network analyzer were: -0.1 ㏈ and -0.33 ㏈ (type A),-0.2 ㏈ and -0.48 ㏈ (type B), respectively. Using the test chip, we have successfully tested the performance of high-speed probe made for SFQ circuits. The probe showed the good performance overthe bandwidth of 10 ㎓.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1718-1723
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• 2007

The Probe Card is a test component which is to classify the good semiconductor chips before the packaging. The yield of semiconductor product can be better from analysis of probe test information. Recently the technology of the probe card needs narrow width and large amount of probe tip. In this research, the probe tip based on the MEMS(micro electro mechanical system) technology was designed and fabricated to improve the reliability of the test and to meet 2-dimensional Array of tip. The mechanical and electrical properties of proposed tip were evaluated and it has over 100,000 of repetition times in the condition of 5gf, $20{\mu}m$ Over Drive.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.5
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• pp.641-649
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• 2016

In this paper, a novel time-domain measurement technique on a high parallelism probe card with protection resistors installed is proposed. The measured signal amplitude decreases when the measurement is performed by Needle Auto Calibration (NAC) probing on a high parallelism probe card with installed resistors. Therefore, the original signals must be carefully reconstructed, and the compensation coefficient, which is related to the number of channel branches and the value of protection resistors, must be introduced. The accuracy of the reconstructed signals is analyzed based on the varying number of channel branches and various protection resistances. The results demonstrate that the proposed technique is appropriate for evaluating the overall signal performance of probe cards with Automatic Test Equipment (ATE), which enhances the efficiency of probe card performance test dramatically.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.10
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• pp.324-329
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• 2018

This study examined the effects of the contact position and structure of the test probe on its signal transmission characteristics. The contact position in the operating of the test probe was considered and then divided into the plunger inner contact and barrel inlet contact. The high frequency performance of the test probes was investigated for both contact positions. The signal transmission characteristics of the test probes with the structures of double, single, and out-spring was also analyzed. The insertion and return losses were calculated using the HFSS and the characteristic impedance of the test probes was analyzed using a Q3D simulation. The insertion loss of the barrel inlet contact was smaller than that of the plunger inner contact. The contact position of the test probe may result in a change in the high frequency performance. The out-spring probe has better frequency characteristics at -1 dB insertion loss and -10 dB return loss. The double probe and single probe have the same characteristic impedance with $30.8{\Omega}$. On the other hand, the out-spring probe has an impedance of $47.1{\Omega}$. The out-spring probe is closer to $50{\Omega}$ than the other probes and then shows higher signal transmission characteristics. The out-spring probe has superior high-frequency characteristics and is expected to be suitable for high-speed applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.9
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• pp.749-755
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• 2007

Recently, novel MEMS probe cards can support reliable wafer level chip test with high density probing capacity. However, manufacturing cost and process complexity are crucial weak points for low cost mass production. To overcome these limitations, we have developed micro spring structured MEMS probe card. For fabrication of micro spring module, a wire bonder and electrolytic polished gold wires are used. In this case, stringent tension force control is essential to guarantee the low level contact resistance of micro spring for reliable probing performance. For this, relation between tension force of fabricated probe card and contact resistance is characterized. Compare to conventional probe cards, developed MEMS probe card requires fewer fabrication steps and it can be manufactured with lower cost than other MEMS probe cards. Also, due to the small contact scratch patterns, we expect that it can be applied to bumping types chip test which require higher probing density.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.1
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• pp.1-6
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• 2011

We have developed the process of forming one body S-type cantilever probe in the recessed trench for fine-pitched MEMS probe card. The probe (cantilever beam and pyramid tip) was formed using Deep RIE etching and wet etching. The pyramid tip was formed by the wet etching using KOH and TMAH. The process of forming the curved probe was also developed by the wet etching. Therefore, the fabricated probe is applicable for the probe card for DRAM, Flash memory and RF devices tests and probe tip for IC test socket.

• Journal of Ocean Engineering and Technology
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• v.36 no.1
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• pp.1-10
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• 2022

Recently, as the offshore structures are operated in the deep-sea oil fields, interest in the analysis of relative wave elevation around platforms is increased. In this study, it is examined how the analysis results differ depending on the characteristics of the wave probe when interpreting the relative wave elevation in the model test. First, by conducting the wave probe comparison experiment in the two-dimensional wave tank, it is confirmed how the measured values differ according to the type of wave probe for the same physical phenomenon. Two types of wave probe are selected, the resistance type and the capacitance type, and the causes of the difference in measured values is studied. After that, the model test of the semi-submersible platform is conducted to investigate the relative wave elevation. Relative wave elevation is measured with the wave probes used in the wave probe comparison experiment and analyzed to estimate the asymmetric factor and the extreme upwell. The results between the two types of wave probes are compared, and qualitative study for the cause of the difference is conducted by photographing the physical phenomenon using a high-speed camera. Through the above study, it is confirmed that the capacitance type wave probe shows a larger measured value than the resistance type under the breaking-wave condition, and the same results are obtained for the asymmetric factor and the extreme upwell. These results is thought to be due to the difference in the measurement principle between wave probes, which is whether or not they measured water bubbles. This implies that the model test should be conducted using appropriate wave probes by considering the physical phenomenon to be analyzed.

• Geotechnical Engineering
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• v.3 no.4
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• pp.31-40
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• 1987

A helical probe test (HPT) suitable for in.situ soil exploration to a shallow depth and compaction control were developed and tested in different soils alongside traditional in-situ tests, including Standard Penetration Test (SPT), Cone Penetration Test (CPT) and in-situ density test. The helical probe test is economical and can be performed by a single person. The torque necessary to insert the probe Is used as a measure of soil characteristics. It was found that: the HPT test correlates well with the SPT test and the correlation is not sensitive to the soil type; the HPT test correlates well with the CPT test, but the correlation is sensitive to the soil type; the HPT torque provides a sensitive measure of relative compaction rind in-situ dry density of compacted soils; the reverse torque ratio decreases with increasing average grain sloe.