• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.165-172
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• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.372-373
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• 2006

Modern business trends call for miniaturization of electronic systems. One of the major impedances in this miniaturization is the conductive and inductive components in chips and circuit boards. Direct Write Technology can write these soft magnetic materials, thus allowing for further miniaturization of inductor devices. Another obstacle in electronics fabrication is the size limitations of thick screen-printing and the material limitations in ink jet printing. Direct Write Technologies address both of these limitations by providing feature sizes less than 20 microns with a wide range of materials possibilities. A discussion of the application of these nano-particulate materials by Direct Write Technologies will be presented.

• Applied Chemistry for Engineering
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• v.34 no.4
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• pp.444-449
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• 2023

As electronic devices become smaller and more integrated, the demand for manufacturing thin, flexible printed circuit boards (FPCBs) has increased. Although FPCBs are conventionally manufactured by a photolithography method using dry film resist, this process is complicated, and the mask is specifically designed to obtain the precision of the desired circuit line width. In this regard, manufacturing FPCBs with fine patterns through the direct printing method of photocurable inks has gained growing attention. Since the manufacturing process of FPCBs is based on the direct printing method that includes etching and stripping processes utilizing acid and basic chemicals, controlling the adhesion strength, the etching resistance, and the strippability of photocured inks has drawn a lot of attention for the fabrication of fine patterns through photocurable inks. In this study, acrylic ink with various types and contents of the photoinitiator was prepared, and the curing behavior was analyzed. Also, the adhesion strength, etching resistance, and strippability were analyzed to evaluate the applicability of developed photocurable etching resist inks.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.1
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• pp.470-476
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• 2019

The braking force for a train is generally provided by compressed air. The pressure valve system that is used to apply appropriate braking forces to trains has a complex flow circuit. It is possible to make a channel shape that can increase the flow efficiency by 3D printing. There are restrictions on the flow shape design when using general machining. Therefore, in this study, the compressed air flow was analyzed in a pressure valve system by comparing flow paths made with conventional manufacturing methods and 3D printing. An analysis was done to examine the curvature magnitude of the flow path, the diameter of the flow path, the magnitude of the inlet and reservoir pressure, and the initial temperature of the compressed air when the flow direction changes. The minimization of pressure loss and the uniformity of the flow characteristics influenced the braking efficiency. The curvilinear flow path made through 3D printing was advantageous for improving the braking efficiency compared to the rectangular shape manufactured by general machining.

• Current Photovoltaic Research
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• v.9 no.1
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• pp.6-10
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• 2021

The mesh mask screen, which is generally used for screen printing metallization of silicon solar cell, requires high squeegee pressure and low printing speed. These requirements are acting as a limiting factor in production yield in photovoltaic industries. In order to improve the productivity, a metal mask, which has high durability and high printing speed, has been researched. In this paper, the characteristics of each solar cell, in which electrodes were formed by using a metal mask and a mesh mask, were analyzed through recombination current density. In particular, the metal-induced recombination current density (Jom) representing the recombination of the emitter-metal interface was calculated using the shading method, and the resulting efficiency and open-circuit voltage were analyzed through the diode equation. As a result of analyzing the proportion of the metal-induced recombination current density to the total emitter recombination current density, it was analyzed that the reduction of the metal-induced recombination current density through the metal mask is an important factor in reducing the total recombination current density of the solar cell.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.11 s.188
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• pp.17-23
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• 2006

• Proceedings of the KIEE Conference
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• 2000.11c
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• pp.428-430
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• 2000

In this paper, the Flexible information display was implemented using AC powder electroluminescent device. ZnS:Cu and $BaTiO_3$ was used as a phosphor and dielectric respectively. The preparation of phosphor and dielectric layer was performed with screen printing. The implemented system of the Flexible information display was divided as following; EL display, driving circuit, software for driving. The properties of fabricated devices was measured with EL spectrum and brightness.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1382-1383
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• 2011

결정질 실리콘 태양전지에서 전극 형성 공정은 Voc(Open-circuit voltage), Isc(Short-circuit current), Rser(Series resistance), Rshunt(Shunt resistance), FF(Fill factor) 특성에 영향을 주기 때문에 매우 중요하다. 하지만 paste와 선 공정에서의 조건에 따라 특성이 바뀌기 때문에 소성 공정을 최적화하기는 쉽지 않다. 본 연구에서는 Gravure Off-set printing 방식을 이용하여 결정질 실리콘 기판 표면에 미세 전극 형성 공정을 하고 소성 조건 최적화를 위해 peak 온도와 ramp-up 속도를 변화시켜 각 조건별 특성을 비교하였다. Peak 온도가 커질수록, contact resistance의 감소에 따라 Rser가 줄어들었다. 본 연구를 통해 Voc는 619mV, FF는 77.9%로 측정되는 Gravure Off-set 태양전지에 최적화된 소성 공정 조건을 확보하였다.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.455-460
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• 2007

A self-sensing circuit for piezo inkjet has been designed in order to monitor the operating condition during printing. In order to verify the circuit, both ink droplet images from strobe LED and vibration signals from the laser vibrometer were measured and compared with self-sensing signal. Experimental results show that self-sensing signal was effective in detecting the pressure wave change due to the bubble trapped in inkjet printhead.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.5
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• pp.207-210
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• 2001

In this paper, the Flexible information display was implemented uing AC powder electroluminescent device. ZnS:Cu and $BaTiO_3$ were used as a phosphor and dielectric respectively. The growth of phosphor and dielectric layer was performed with screen printing. The flexible information display in this paper was categorized as following; EL display, driving circuit, software for driving. EL spectrum and brightness was measured as the device properties.