• Title/Summary/Keyword: Printing Design

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The Implementation and Design of Printing System using Informal Extension Tag (비정규 확장 태그를 이용한 출력 시스템의 설계 및 구현)

  • Yoo, Ju-Hyun;Hwang, In-Moon;Kim, Won-Jung
    • Proceedings of the Korean Information Science Society Conference
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    • 2005.07a
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    • pp.643-645
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    • 2005
  • 인터넷 상에서 제공되는 웹 문서는 사용자들에게 다양한 정보를 제공한다. 그러나 웹 문서를 실제 출력하는 경우, 사용자가 웹에서 보는 것과 같은 화면이 출력 용지에 맞게 출력되지 않는다. 이는 웹 문서가 사용자가 원하는 정보 외에 부가적인 정보들을 표현하고 있으며, 또한 웹 사이트에서 사용하는 길이의 측정 단위는 ‘pixel’이고 프린터에서 사용하는 길이의 단위는 ‘Cm’나 ‘Inch'이기 때문이다. 이에 본 논문에서는 웹 문서를 사용자가 원하는 형태로 출력할 수 있도록 지원하는 시스템을 설계, 구현하였다.

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Review of Recent Trends and Technology for Additive Manufacturing (적층제조기술 응용사례 및 최신기술동향)

  • Lee, Jaehyang;Park, Sung-Jun
    • Journal of Institute of Convergence Technology
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    • v.6 no.1
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    • pp.1-5
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    • 2016
  • Additive manufacturing is converting a digitally designed object into a tangible three dimensional solid using an additive process where materials are applied in successive layers with no or very limited material waste. It can be distinguished form traditional manufacturing which begins with a fixed amount of raw material and removes excess to arrive at the final product. Generally there are five stages to the additive manufacturing supply chain, namely materials, systems, software, application design and production. In this paper, recent market trends and technology about additive manufacturing based on supply chain are analyzed and reviewed.

A study on the injection mold design application method of CAE mold analysis data (CAE 성형해석 데이터의 사출금형 설계 활용 방법에 관한 연구)

  • Nam, Seung-Don
    • Design & Manufacturing
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    • v.13 no.3
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    • pp.29-34
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    • 2019
  • Cell phone injection is characterized by its small size and thinness. In addition, the product has a short cycle time, requiring a very short production schedule. To produce more accurate products faster, data from experience in producing similar products is required. In this study, two mobile phone models are presented. In this study, the quality problems caused by molding analysis and actual injection molding were analyzed and made into a database. As a result, it was considered that all the defects in the molding analysis do not affect the product in some cases, rather than appear as defects in the actual product. All defects shown in the molding analysis can be made into a database, and based on this data, it will be possible to obtain an effect that can predict more accurately whether it will cause problems after injection.

Capillary Breakup of Viscoelastic Fluid and its Extensional Rheology (점탄성유체의 Capillary Breakup 가시화 및 신장유변물성 측정)

  • Jeon, Hyun Woo;Choi, Chan Hyuck;Kim, Byung Hoon;Park, Jinsoo
    • Journal of the Korean Society of Visualization
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    • v.19 no.1
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    • pp.81-87
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    • 2021
  • Extensional flow of viscoelastic fluids is widely utilized in various industrial processes such as electrospinning, 3D printing and plastic injection molding. Extensional rheological properties, such as apparent viscosity and relaxation time, play an important role in the design and evaluation of the viscoelastic fluid-involved processes. In this work, we propose a lab-built capillary breakup extensional rheometer (CaBER) based on flow image processing to investigate the capillary breakup of polyethylene oxide (PEO) solution and its extensional rheological properties. We found that the apparent extensional viscosity and extensional relaxation time of the PEO solution are independent of the strike time. The proposed CaBER is expected to be applied to characterization of the extensional rheological properties of viscoelastic fluids at low cost with high precision.

Maxillary space closure using a digital manufactured Mesialslider in a single appointment workflow

  • Wilhelmy, Lynn;Willmann, Jan H.;Tarraf, Nour Eldin;Wilmes, Benedict;Drescher, Dieter
    • The korean journal of orthodontics
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    • v.52 no.3
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    • pp.236-245
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    • 2022
  • New digital technologies, many involving three-dimensional printing, bring benefits for clinical applications. This article reports on the clinical procedure and fabrication of a skeletally anchored mesialization appliance (Mesialslider) using computer-aided design/computer-aided manufacturing (CAD/CAM) for space closure of a congenitally missing lateral incisor in a 12-year-old female patient. The insertion of the mini-implants and appliance was performed in a single appointment. Bodily movement of the molars was achieved using the Mesialslider. Anchorage loss, such as deviation of the anterior midline or palatal tilting of the anterior teeth, was completely avoided. CAD/CAM facilitates safe and precise insertion of mini-implants. Further, mini-implants can improve patient comfort by reducing the number of office visits and eliminating the need for orthodontic bands and physical impressions.

Design of Deduplication Supported Clustering Backup System using File Finger Printing (파일 지문으로 중복 파일을 제거한 클러스터링 백업 시스템 설계)

  • Jeong, Ho-Min;Ko, Young-Woong
    • Proceedings of the Korea Information Processing Society Conference
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    • 2007.11a
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    • pp.737-740
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    • 2007
  • 기존의 백업시스템에서는 데이터의 중복을 고려하지 않고 백업 데이터 전부를 저장하기 때문에 저장용량 공간을 많이 차지하는 문제점이 있다. 본 논문에서는 이러한 문제점을 해결하기 위해 백업 데이터의 각 파일에 대해서 일정한 크기의 블록 단위로 파일지문을 부여하고 파일지문이 동일할 경우 하나의 사본만을 공유하는 방법으로 백업 데이터의 용량을 감소시키는 방법을 도입하였다. 제안하는 백업 시스템은 중복되어 발생하는 데이터에 대해 하나의 사본만 백업함으로써 백업되는 데이터의 양을 효과적으로 감소시켰다. 또한 백업되는 파일 블록에 대해서 클러스터링 기술을 사용함으로서 입출력 성능 향상을 고려하였다.

An optimal design for the local back contact pattern of crystalline silicon solar cells by using PC1D simulation (PC1D Simulation을 통한 결정질 실리콘 태양전지의 국부적 후면 전극 최적화 설계)

  • Oh, Sungkeun;Lim, Chung-Hyun;Cho, Younghyun
    • 한국신재생에너지학회:학술대회논문집
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    • 2010.11a
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    • pp.43.1-43.1
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    • 2010
  • In the crystalline silicon solar cells, the full area aluminum_back surface field(BSF) is routinely achieved through the screen-printing of aluminum paste and rapid firing. It is widely used in the industrial solar cell because of the simple and cost-effective process to suppress the overall recombination at the back surface. However, it still has limitations such as the relatively higher recombination rate and the low-to-moderate reflectance. In addition, it is difficult to apply it to thinner substrate due to wafer bowing. In the recent years, the dielectric back-passivated cell with local back contacts has been developed and implemented to overcome its disadvantages. Although it is successful to gain a lower value of surface recombination velocity(SRV), the series resistance($R_{series}$) becomes even more important than the conventional solar cell. That is, it is a trade off relationship between the SRV and the $R_{series}$ as a function of the contact size, the contact spacing and the geometry of the opening. Therefore it is essential to find the best compromise between them for the high efficiency solar cell. We have investigated the optimal design for the local back contact by using PC1D simulation.

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A Study on Deadbeat Control Systme of DC Motro Driving a Rotational Mechanical System (회전기계 계통을 가동시키는 직류전동기의 데드비트제어시스템 연구)

  • 송자윤
    • Proceedings of the Korea Society for Industrial Systems Conference
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    • 1999.12a
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    • pp.477-483
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    • 1999
  • This paper presents a design of deadbeat control system for DC motor driving such a rotational mechanical system with gear as a printing machine. The deadbeat response design developed for control system of a sampled continuous-data process does not guarantee zero intersampling ripples, but the proposed deadbeat control system that consists of the integral controller and the full-order state observer, has many advantages such as an output response without the ripples, and setting time than the optimal control system in the same sampling period. The results of case study through MATLAB simulation are shown that the efficiency of the proposed controller for DC motor driving a rotational system with gear is verified by comparing with optimal controller etc..

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A Study on Design and Implementation of Hangul-NAVTEX Simulator (한글 NAVTEX시뮬레이터 설계 및 구현에 관한 연구)

  • 이헌택;김기문
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.3 no.4
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    • pp.819-830
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    • 1999
  • NAVTEX system is an international automated direct-printing service, broadcast on 5181kHz and 490kHz, for the promulgation of navigational and meteorological warnings and urgent information to ships. With our government's adoption of the international convention for SAR(Search and Rescue) in 1993, various trials for the installation of NAVTEX system have been executed by the government committee, relating laboratory and experts. An important consideration of the installation for NAVTEX system is the availability that could broadcast messages written in korean letter. Also, the receiver which can process the signal demodulated from the two frequencies, 518kHz and 490kHz, should be developed and supplied in domestic. In this paper, the code table and algorithm for conversions between NAVTEX characters and Korean Letters are studied, and signal processing techniques of code conversion are developed. Circuit design and implementation of the NAVTEX simulator using the Direct Digital Synthesizer are discussed, code conversion algorithm and signal processing technique of the NAVTEX transmission are programmed in its circuits. For evaluating the its functional characteristics, receiving module which has I-Q channel structure is designed. From the measurements of simulator, the characteristics show the frequency stability of the $(\pm)2Hz$ and Spurious free dynamic range is -63dBc. And the simulator can generate simultaneously wanted signal and several interfere signals. So, its capability is valuable for designers of the transmitting system and NAVTEX receiver, for provider as testing facilities of the type approval.

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BGA to CSP to Flip Chip-Manufacturing Issues

  • Caswell, Greg;Partridge, Julian
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.2
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    • pp.37-42
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    • 2001
  • The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

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