• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.4.1-4.1
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• 2011

Recently, circuit printing technology has been considered as a promising alternative to conventional PCB fabrication, for it can greatly reduce the manufacturing costs. Even though printed circuit has many advantages over typical subtractive technology such as fewer processes, it has some disadvantages. The major problems are low adhesion and poor resolution. Efforts to overcome these problems have been mainly focused on ink developments with a limited success. And surface treatments showed some improvements. Therefore, various plasma treatments and primer coatings on plastic substrates have been tested. Plasma treatments using hydrocarbon gases including methane and propane improved the pattern quality of the inkjet printed circuit, which are further improved upon heating of substrate. On the other hand, there is little effect on the adhesion, which is improved only by a special primer coating. The adhesion of inkjet printed circuit has been increased more than 10 times upon treatment. As for the screen printed circuits, the overall effects are less significant since there is some organic binder in the ink. Nonetheless, the treatment has strong positive effects on pattern quality and adhesion. The adhesion of 1 kgf/cm2, which is comparable with those of the conventional PCB circuits, is possible through primer coating for both screen and inkjet printed circuits. The resulting circuit also showed good thermal, mechanical and electrical properties.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.66.1-66.1
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• 2012

Although all printed cost-less radio frequency identification (RFID) tags have been considered as a core tool for bringing up a ubiquitous society, the difficulties in integrating thin film transistors (TFTs), diodes and capacitors on plastic foils using a single in-line printing method nullify their roles for the realization of the ubiquitous society1,2. To prove the concept of all printed cost-less RFID tag, the practical degree of the integration of those devices on the plastic foils should be successfully printed to demonstrate multi bit RFID tag. The tag contains key device units such as 13.56 MHz modulating TFT, digital logic gates and 13.56 MHz rectifier to generate and transfer multi bit digital codes via a wireless communication (13.56 MHz). However, those key devices have never been integrated on the plastic foils using printing method yet because the electrical fluctuation of fully printed TFTs and diodes on plastic foils could not be controlled to show the function of desired devices. In this work, fully gravure printing process in printing 13.56 MHz operated 32 bit RFID tags on plastic foils has been demonstrated for the first time to prove all printed RFID tags on plastic foils can wirelessly generate and transfer 32 bit digital codes using the radio frequency of 13.56 MHz. This result proved that the electrical fluctuations of printed TFTs and diodes on plastic foils should be controlled in the range of maximum 20% to properly operate 32 bit RFID tags.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.730-732
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• 2007

We fabricated a coplanar type organic thin-film transistors using ink-jet printed silver source/drain electrodes and ${\alpha},{\omega}-dihexylquaterthiophene$ (DH4T) which is an active layer. Use of ink-jet printed silver nanoparticle-based metal electrode assists the energetic mismatch with p-type organic semiconductor via modification of their interfacial properties to enable ohmic contact formation.

• Korean Journal of Materials Research
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• v.27 no.8
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• pp.397-402
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• 2017

We used an etching process to control the line-width of screen printed Ag paste patterns. Ag paste was printed on anodized Al substrate to produce a high power LED. In general, Ag paste spreads or diffuses on anodized Al substrate in the process of screen printing; therefore, the line-width of the printed Ag paste pattern increases in contrast with the ideal line-width of the pattern. Smudges of Ag paste on anodized Al substrate were removed by neutral etching process without surface damage of the anodized Al substrate. Accordingly, the line-width of the printed Ag paste pattern was controlled as close as possible to the ideal line-width. When the etched Ag paste pattern was used as a seed layer for electroless Ni plating, the line width of the plated Ni film was similar to the line-width of the etched Ag paste pattern. Finally, in pattern formation by Ag paste screen printing, we found that the accuracy of the line-width of the pattern can be effectively improved by using an etching process before electroless Ni plating.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.3
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• pp.217-223
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• 2016

In this research, a continuous roll-to-roll screen printing system was developed using a flat screen. It has a newly devised sliding mechanism of screen printing module, which can be controlled accurately in sync with a moving web, driven by a roll-to-roll tension control and web-guiding system. In addition, the real-time precision alignment module that consists of a vision camera and an $X-Y-{\theta}$ alignment stage was implemented. With this developed system, the feasibility of continuous printing with minimum pattern width below $60{\mu}m$ was verified, and an overlay of ${\pm}60{\mu}m$ between the laser-patterned reference mark and the printed mark on a 300-mm-wide film was achieved.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.1.1-1.1
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• 2011

Printed electronics based on the direct writing of solution processable functional materials have been of paramount interest and importance. In this talk, the synthesis of printable inorganic functional materials (conductors and semiconductors) for thin-film transistors (TFTs) and photovoltaic devices, device fabrication based on a printing technique, and specific characteristics of devices are presented. For printable conductor materials, Ag ink is designed to achieve the long-term dispersion stability and good adhesion property on a glass substrate, and Cu ink is sophisticatedly formulated to endow the oxidation stability in air and even aqueous solvent system. The both inks were successfully printed onto either polymer or glass substrate, exhibiting the superior conductivity comparable to that of bulk one. In addition, the organic thin-film transistor based on the printed metal source/drain electrode exhibits the electrical performance comparable to that of a transistor based on a vacuum deposited Au electrode. For printable amorphous oxide semiconductors (AOSs), I introduce the noble ways to resolve the critical problems, a high processing temperature above $400^{\circ}C$ and low mobility of AOSs annealed at a low temperature below $400^{\circ}C$. The dependency of TFT performances on the chemical structure of AOSs is compared and contrasted to clarify which factor should be considered to realize the low temperature annealed, high performance AOSs. For photovoltaic application, CI(G)S nanoparticle ink for solution processable high performance solar cells is presented. By overcoming the critical drawbacks of conventional solution processed CI(G)S absorber layers, the device quality dense CI(G)S layer is obtained, affording 7.3% efficiency CI(G)S photovoltaic device.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.05a
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• pp.34.2-34.2
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• 2007

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.24.2-24.2
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• 2007

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.89.2-89.2
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• 2007

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.15.2-15.2
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• 2009

Manufacturing of printed electronics using printing technology has begun to get into the hot issue in many ways due to the low cost effectiveness to existing semi-conductor process. This technology with both low cost and high productivity, can be applied in the production of organic thin film transistor (OTFT), solar cell, radio frequency identification (RFID) tag, printed battery, E-paper, touch screen panel, black matrix for liquid crystal display (LCD), flexible display, and so forth. The emerging technology to manufacture the products in mass production is roll-to-roll printing technology which is a manufacturing method by printings of multi-layered patterns composed of semi-conductive, dielectric and conductive layers. In contrary to the conventional printing machines in which printing precision is about $50~100{\mu}m$, the printing machines for printed electronics should have a precision under $30{\mu}m$. In general, in order to implement printed electronics, narrow width and gap printing, register of multi-layer printing by several printing units, and printing accuracy of under $30{\mu}m$ are all required. We developed the roll-to-roll printing equipment used for printed electronics, which is composed of un-winder, re-winder, tension measurement system, feeding units, dancer systems, guide unit, printing unit, vision system, dryer units, and various auxiliary devices. The equipment is designed based on cantilever type in which all rollers except printing ones have cantilever types, which could give more accurate machine precision as well as convenience for changing rollers and observing the process.