• Korean Journal of Materials Research
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• v.29 no.4
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• pp.221-227
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• 2019

This study examines the role of the nano- and micro-particle ratio in dispersion stability and mechanical properties of composite resins for SLA(stereolithography) 3D printing technology. VTES(vinyltriethoxysilane)-coated $ZrO_2$ ceramic particles with different nano- and micro-particle ratios are prepared by a hydrolysis and condensation reaction and then dispersed in commercial photopolymer (High-temp) based on interpenetrating networks(IPNs). The coating characteristics of VTES-coated $ZrO_2$ particles are observed by FE-TEM and FT-IR. The rheological properties of VTES-coated $ZrO_2/High-temp$ composite solution with different particle ratios are investigated by rheometer, and the dispersion properties of the composite solution are confirmed by relaxation NMR and Turbiscan. The mechanical properties of 3D-printed objects are measured by a tensile test and nanoindenter. To investigate the aggregation and dispersion properties of VTES-coated $ZrO_2$ ceramic particles with different particle ratios, we observe the cross-sectional images of 3D printed objects using FE-SEM. The 3D printed objects of the composite solution with nano-particles of 80 % demonstrate improved mechanical characteristics.

• Journal of Sensor Science and Technology
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• v.31 no.2
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• pp.85-89
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• 2022

We investigated a pH sensor using an Indium tin oxide (ITO) nanoparticle (NP) film printed on a flexible substrate. First, the printing precision and mechanical stability of the ITO-printed film were investigated. In particular, the factors that influence the crystallinity of ITO films were studied using X-ray diffraction pattern analysis. The response of the ITO pH sensor was calibrated using a series of standard pH solutions (pH 3-11). The pH values of various specimens were measured using an ITO pH sensor, and the results were compared with those of various pH measurement methods. As a result of the experiment, the maximum error was approximately ± 0.04 pH (0.4 %) at pH 9, which indicated that the ITO pH sensor is highly suitable for pH measurement. Finally, we used the ITO pH sensor to the measure of general specimens such as solvents and beverages and compared the results in comparison with those obtained from several conventional methods.

• Transactions of the Korean hydrogen and new energy society
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• v.35 no.2
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• pp.240-248
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• 2024

The purpose of this study is to investigate the freezing phenomena in printed circuit heat exchanger (PCHE) for cryogenic liquid hydrogen vaporizer. Local freezing phenomena in hot channels should be avoided in designing PCHE for cryogenic liquid hydrogen vaporizer. Hence, the flow and thermal characteristics of PCHE is experimentally investigated to figure out the conditions under when freezing occurs. To conduct lab-scale PCHE experiment, liquid nitrogen is used as a working fluid in cold channels instead of using liquid hydrogen. Glycol water is used as a working fluid in hot channels. Based on the experimental data, ratio between mass flow rates of cold channels and that of hot channels is proposed as contour map to avoid the freezing phenomena in PCHE.

• Polymer Science and Technology
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• v.18 no.3
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• pp.238-245
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• 2007

• Journal of the Korean Society of Safety
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• v.13 no.2
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• pp.22-29
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• 1998

The natural convection cooling of simulated electronic chips located on a printed circuit board(PCB) has been studied by Computer Aided Engineering(CAE). In CAE, 3-dimensional finite element model of simulated electronic chip was made to accomplish heat transfer analysis at each design stage of a printed circuit boards for thermal optimization. The simulated electronic chips are installed protrudent from the plate about 3mm. The materials the plates are epoxy and aluminum. The results show that the chip with relatively high heat generation rates should not be close to each other. It is found, as well that cooling effect for the aluminum plate is superior to the epoxy plate and location of maximum temperature is significantly influenced by the structure variation of PCB. In developing PCB and electronic chips, it's recommended that CAE is very useful to estimate to the distribution of temperature.

• Transactions on Electrical and Electronic Materials
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• v.7 no.2
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• pp.72-75
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• 2006

Ferroelectric PZT heterolayered thick films were fabricated by the alkoxide-based sol-gel method. PZT(Zr/Ti=60/40) paste was made and alternately screen-printed on the $Al_2O_3$ substrates. We have introduced a press-treatment to obtain a good densification of screen printed films. The porosity of the thick films was decreased with increasing the applied pressure and the thick films pressed at $0.6ton/cm^2$ showed the dense microstructure and thickness of about $76{\mu}m$. The relative dielectric constant increased with increasing the applied pressure. The remanent polarization and coercive field increased with increasing applied pressure and the values for the PZT thick films pressed at $0.6ton/cm^2$ were $16.6{\mu}C/cm^2$, 76.9 kV/cm, respectively.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.239-242
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• 2009

$Sr_2Si_5N_8:Eu^{2+}$, one of the most recently developed phosphors for use in white light emitting diodes, exhibits a two-peak emission. Namely, the emission band of $Sr_2Si_5N_8:Eu^{2+}$ is deconvoluted into two Gaussian peaks irrespective of the $Eu^{2+}$ concentration. We examined the two-peak emission of $Sr_2Si_5N_8:Eu^{2+}$ by analyzing the time-resolved photoluminescence spectra. We revealed that the two-peak emission was closely associated with the energy transfer taking place between $Eu^{2+}$ activators located at two different crystallographic sites in the $Sr_2Si_5N_8$ structure. The experimental results coincided well with the rate equation model involving the crystallographic information of the host.

• Transactions on Electrical and Electronic Materials
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• v.13 no.3
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• pp.129-135
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• 2012

A number of surface mount technology (SMT) process variables including land design are considered for minimizing tombstone defect in flexible printed circuit assembly in high volume manufacturing. As SMT chip components have been reduced over the past years with their weights in milligrams, the torque that once helped self-centering of chips, gears to tombstone defects. In this paper, we have investigated the correlation of the assembly process variables with respect to the tombstone defect by employing statistically designed experiment. After the statistical analysis is performed, we have setup hypotheses for the root causes of tombstone defect and derived main effects and interactions of the process parameters affecting the hypothesis. Based on the designed experiments, statistical analysis was performed to investigate significant process variable for the purpose of process control in flexible printed circuit manufacturing area. Finally, we provide beneficial suggestions for find-pitch PCB design, screen printing process, chip-mounting process, and reflow process to minimize the tombstone defects.

• Transactions on Electrical and Electronic Materials
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• v.12 no.6
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• pp.271-274
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• 2011

Screen-printed source and drain electrodes were used for a spin-coated and inkjet-processed zinc-tin oxide (ZTO) TFTs for the first time. Source and drain were silver nanoparticles. Channel length was patterned using screen printing technology. Different silver nanoinks and process parameters were tested to find optimal source and drain contacts Relatively good electrical properties of a screen-printed inkjet-processed oxide TFT were obtained as follows; a mobility of 1.20 $cm^2$/Vs, an on-off current ratio of $10^6$, a Vth of 5.4 V and a subthreshold swing of 1.5 V/dec.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.10
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• pp.104-109
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• 2019

Reverse engineering techniques using 3D scanners and 3D printing technologies are being used in various industries. In this paper, the three-dimensional model is designed for automotive hub parts through 3D scanning and reverse engineering, and the design of hub parts is intended to be printed on FDM-style 3D printers to measure and analyze the dimensions of hub parts designed for reverse design and 3D printed hub parts. Experimental result have shown that the dimensions of 3D printed hub parts are small compared to those of the reverse-engineered dimensions, which are due to the shrinkage of filament materials in 3D printing.