• Proceedings of the Korea Society for Simulation Conference
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• 1999.04a
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• pp.122-126
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• 1999

시스템 레벨 PCB(Printed Circuit Board) 디자인은 최종적인 시스템 특성에 정확한 정보를 갖지 못하는 디자인 결정을 하기 위해 여러 가지 정보가 필요하다. 또한 분할 할 때 분할 시간과 방법은 매우 중요하고 합성 결과의 특성은 교환(tradeoffs)과 디자인 결정에 매우 민감하다. 그러므로 만일 디자인이 합성되고 단일 보드로 디자인된다 할지라도 후에 다중 보드로 분할 될 수 있다. 따라서 본 논문에서는 PCB회로 디자인의 제약구동 방법중 off-critical-path 분할기법을 사용한 휴리스틱(heuristic) 방법을 제안했고 교환 그래프 착색 알고리즘을 제안했다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.11
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• pp.5471-5478
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• 2012

In this paper, we propose a new short-circuit detecting method which can detect bad short-circuits, one of bad types occurring in PCB(Printed Circuit Board), by using SURF(Speeded-Up Robust Features) algorithm. The basic procedure in the proposed method sequentially consists of extracting features from both sample and inputted images by SURF, performing perspective transform by feature matching and matching results, extracting check areas of interest, binary coding and extracting short-circuits, and verifying results. The proposed method focuses on the robustness which can detect bad short-circuits even though the position and angle of PCB are not uniform and arbitrarily placed. Experimental results show that our method enables to detect bad short-circuits regardless of the location and angle of PCB placed variously and validate that the proposed method outperforms the conventional methods detecting bad short-circuits manually on the aspect of both the detection rate and time.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.54 no.8
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• pp.475-481
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• 2005

In the existing ICT technique, the mounted electronic devices on the printed circuit board are tested whether the devices are good or not by comparing and measuring the value of the devices after separating the devices to be tested from around it based on the guarding method. But, in case that resistance, inductor and capacitor are configured as a parallel circuit on the circuit pattern, values for each device can not be measured because the total impedance value of the parallel circuit is measured. Accordingly, it is impossible to test whether the parallel circuit is good or not in case that the measured impedance value is within the tolerance error. Also, it is difficult to identify that which device among R, L and C of the parallel circuit is bad in case that the measured impedance value is out of the tolerance error. Accordingly, this paper proposes a test method which can enhance the quality and productivity by separating and measuring accurately R, L and C components from the RLC parallel circuits on the device-mounted printed circuit board. First, the RLC parallel circuit to be test is separated electrically from around it using three-terminal guarding technique. And then R, L and C values are computed based on the total impedance values and phase angles between voltage and current of the parallel circuit measured from two AC input signals with other frequency, Finally, the availability and accuracy of the proposed test method is verified by reviewing the simulation results.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.9
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• pp.879-884
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• 2015

Printed electronics is a technology that produces electronic devices and circuits by printing functional ink on a web, which is a film-like flexible material. This technology is suitable for large-scale and high-speed mass production, and is a next-generation process technology that can fabricate electronic devices from flexible materials. As precise measurement of the positions of the web is required in order to commercialize such a printed electronics process, a measurement system with an optical encoder with a precision of micrometers had been proposed in the preceding research of this study. However, the lateral positions of the web could not be measured in the preceding research as the phenomenon of the entire web being moved in the lateral direction could not be detected. In this study, a measurement system that utilizes the differences in the amount of light reflected from the alignment patterns depending on the web positions in the lateral direction was proposed for measuring the lateral positions of the web. In addition, its reliability was verified and then the effect when measuring printed alignment patterns was analyzed by experiments.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.12
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• pp.1563-1568
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• 2012

Printed electronics is a technology used for forming electronic circuits or devices, and it is used in the manufacture of many products such as RFID tags, solar cells, and flexible display panels with a much lower cost than in the case of semiconductor process technology. Web-guide-type printing such as roll-to-roll printing is a method used to produce printed electronic devices in a large volume. To commercialize such products, highly precise alignment between printed layers is required. In this study, a highly precise alignment system is proposed, and some experimental results are compared with those obtained using a laser surface vibrometer to illustrate the reliability of the proposed system. The robustness of the proposed system to web deformation is also considered experimentally.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1853-1856
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• 2003

Multi-layer printed circuit board(PCB) is being used widely for the product with relatively complex circuits such as TV, VTR and FAX. With the rapid enlargement of electronic and IT industry, the hole machining technology on multi-layer PCB is increasingly required to improve. Thus, the micro drilling with ultrasonic vibration can be a good method for hole machining. Unlike conventional drilling, ultrasonic vibration applied drilling introduces less wear and fracture of not only tool but also internal surface of workpiece due to little cutting resistance, thus, machinability can be improved. The experiment is conducted through the comparison between the results of conventional drilling and ultrasonic micro drilling as well as among each results by the variation according to not only feed rate of drill but also amplitude and frequency of ultrasonic vibration. The multi-layer PCB consists of 6 layers and ${\Phi}$0.3 diameter drill was used. As a result, it was found that the state of internal surfaces of holes on multiple layer PCBs is improved by the application of ultrasonic vibration.

• Journal of the Institute of Convergence Signal Processing
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• v.9 no.2
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• pp.135-140
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• 2008

In this paper, the spiral antenna with the center frequencies of 315MHz, 433MHz, and 447MHz for RKE system of a vehicle is designed on PCB. The antenna is microstrip line-fed, and applied PIFA concept near the feeding part to easily tune center frequency and input impedance. The PIFA-type spiral antenna with the size of $30mm{\times}20mm$ is designed on printed PCB by considering the effect of circuits and components on PCB, ECU case and vehicle body. Also chip inductor inserted dual-band spiral antenna of 315MHz and 447MHz is designed. We found that the antenna designed on PCB satisfied the antenna specifications through measurement and field test.

• ETRI Journal
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• v.33 no.6
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• pp.887-896
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• 2011

We investigated the effects of a gate dielectric and its solvent on the characteristics of top-gated organic field-effect transistors (OFETs). Despite the rough top surface of the inkjet-printed active features, the charge transport in an OFET is still favorable, with no significant degradation in performance. Moreover, the characteristics of the OFETs showed a strong dependency on the gate dielectrics used and its orthogonal solvents. Poly(3-hexylthiophene) OFETs with a poly(methyl methacrylate) dielectric showed typical p-type OFET characteristics. The selection of gate dielectric and solvent is very important to achieve high-performance organic electronic circuits.

• Journal of Sensor Science and Technology
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• v.17 no.1
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• pp.15-22
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• 2008

When designing image sensors including a CMOS vision chip for edge detection, resolution is a significant factor to evaluate the performance. It is hard to improve the resolution of a bio-inspired CMOS vision using a resistive network because the vision chip contains many circuits such as a resistive network and several signal processing circuits as well as photocircuits of general image sensors such as CMOS image sensor (CIS). Low resolution restricts the use of the application systems. In this paper, we improve the resolution through layout and circuit optimization. Furthermore, we have designed a printed circuit board using FPGA which controls the vision chip. The vision chip for edge detection has been designed and fabricated by using $0.35{\mu}m$ double-poly four-metal CMOS technology, and its output characteristics have been investigated.

• Proceedings of the KIEE Conference
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• 2002.07d
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• pp.2625-2627
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• 2002

A virtual laboratory for measurement and instrumentation must aim to realize an integrated environment. To achieve this goal, we designed and implemented a client/server distributed environment and developed a web-based virtual laboratory system for electronic circuits. The proposed virtual laboratory system is composed of four important components : Principle Classroom, Virtual Experiment Classroom, Evaluation Classroom and Overall Management System. Through our virtual laboratory, the learners will be capable of learning the concepts and theories related to electronic circuit experiments and how to operate the experimental equipments. Also, every activity occurred in our virtual laboratory is recorded on database and printed out on the preliminary report form. All of these can be achieved by the aid of the Management System. The database connectivity is made by PHP and the virtual laboratory environment is set up slightly differently for each learner. Finally, we have obtained several affirmative effects such as reducing the total experimental hours and the damage rate for experimental equipments and increasing learning efficiencies as well as faculty productivity.