• Proceedings of the IEEK Conference
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• 2000.11b
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• pp.341-344
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• 2000

Several new via structures in printed circuit boards are proposed, fabricated and characterized in RF regime. The new structure with a larger inductance component in the bottom layer shows 3㏈ improvement over the conventional structure. The ADS simulation with model parameters extracted from 3D fie]d solver matches with the characterization of these vias

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1607-1608
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• 2006

PCB상에서의 집중정수 소자를 분석하기 위해 Electromagnetic Top이ogy를 이용한다. 복잡한 시스템에서 EM Coupling 문제를 수치해석이나 실험을 통해 구하기는 어렵다. 이런 복잡한 시스템에서 Electromagnetic Topology 방법을 통하여 EMC 해석을 하는 것은 유용할 것이다. 간단한 회로로 된 PCB를 통하여 이 방법에 대하여 검증해볼 것이다.

• Journal of the Korean earth science society
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• v.35 no.4
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• pp.259-266
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• 2014

This study was carried out to find an environmental friendly and effective way to leach Au and Ag from scrap of Printed Circuit Boards (PCBs) using sodium-hypochlorite solution. In an EDS analysis, valuable metals such as Cu, Sn, Sb, Al, Ni, Pb and Au were all found in PCBs. The highest leaching rates obtained were 1% of pulp density with a chlorine:hypochlorite of 2:1 and a concentration of NaCl at 2M. The highest Au recovery was observed with the addition of sodium metabisulfite to make a 3M solution. It is confirmed that the leaching agent (chlorine-hypochlorite) could effectively leach Au and Ag from Printed Circuit Boards (scrap parts) and the additive reagent sodium metabisulfite could easily precipitate Au from the chlorine-hypochlorite solution.

• Resources Recycling
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• v.24 no.1
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• pp.66-72
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• 2015

Various waste PCBs arose during disassembly of LCD TVs and monitors in which they originally functioned for transmission of imaging signal, power supply, and imaging control. In those functional PCBs, gold and copper are contained at far more acceptable level, exceeding mining grade ores. Those valuable metals and their contents widely vary with functionality and end use of PCBs. Therefore, compositional analysis of individual waste PCBs from disassembled LCD TVs and monitors were performed in the present study to classify them into three categories: high gold yield and low gold yield PCBs and those without gold contents. Besides, additional chemical analysis was made to reveal gold and copper contents in the waste PCBs arising from actual disassembly/separation of end-of-life LCD TVs and monitors.

• Resources Recycling
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• v.22 no.2
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• pp.71-77
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• 2013

Electronic products such as appliances, computers, and cellular phones have printed circuit boards (PCBs) in common and the PCBs in the waste electronic products contain valuable metals and organic resins. In Korea, recovery and recycling of the organic resins as well as the valuable metallics from the wastes are required indeed as the most of resources are being imported from abroad. In this article, the patents and papers for the recycling of organic residues from the waste PCBs were collected and analyzed. The open patents of USA (US), European Union (EP), Japan (JP), and Korea (KR) and SCI journals from 1979 to 2012 were investigated. The patents and journals were collected using key-words and filtered by the definition of the technology. The patents and journals were analyzed by the years, countries, companies, and technologies and the technical trends were discussed in this paper. It is showed sluggish relatively activity of published papers and patent applications for polymer manufacturing technology in local and abroad.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.768-771
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• 2003

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, electronic equipment (KOMPSAT 2, RDU : Remote Drive Unit) of a satellite consists of aluminum case containing PCB (Printed circuit boards). Each PCB has resistors and IC (Integrated circuits). Noise and vibration of wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation. random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when tile frequency of random vibration meets with natural frequency of PCB. fatigue fracture nay occur in the part of solder joint. The launching environment, thus. needs to be carefully considered when designing the electronic equipment of a satellite. In general. the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM(Finite Element Method) or vibration test. In this study. the natural frequency and dynamic deflection of PCB are measured by FEM, aud the safety of the electronic components of PCB is being evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs from the electronic equipments of a satellite to home electronics.

• Applied Chemistry for Engineering
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• v.23 no.4
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• pp.367-371
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• 2012

Waste printed circuit boards (WPCBs) contain valuable metals such as Cu, Ni, Au, Ag, and Pd. For an effective recycling of WPCBs, it is essential to recover the valuable metals. In recent years, recycling processes have come to be necessary for separating noble metals from WPCBs due to an increasing amount of electronic device wastes. However, it is well known that glass reinforced epoxy resins in the WPCBs are difficult materials to separate into elemental components, namely metals, glass fibers and epoxy resins in the chemical recycling process. $K_3PO_4$ as a catalyst in dimethylformamide (DMF) and N-Methyl-2-pyrrolidone (NMP) was used to depolymerize epoxy resins for recovering metallic and non-metallic components from WPCBs. Reactions of WPCBs were carried out at temperatures $160{\sim}200^{\circ}C$ for 2~12 h. The recycled glass fiber from WPCBs was analyzed by thermogravimetric analyzer (TGA) and evaluated the degree of solubility of the epoxy resin for separation efficiencies of the WPCBs.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1450-1451
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• 2008

To investigate the reliability of the conductive lines patterned by ink-jet printing, we evaluated the reliability of the ink-jet printed silver (Ag) patterns according to the guide lines built up as assessments methods in the production of conventional rigid printed circuit boards. The assessment methods include the uniformity of line width and space, adhesive strength, dielectric withstand, solder float, thermal shock test and pressure cooker test (PCT). To prepare assesment vehicles, different regular test patterns were created by Ag ink-jet printing on the same polyimide substrate for each of assessment methods.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.12
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• pp.1716-1721
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• 2014

In this paper, a study on automation method for the circuit/EM (Electro-Magnetic) simulation is carried out to analyze effectively the SI/PI (Signal Integrity/Power Integrity) issues which occur on circuits and/or PCBs (Printed Circuit Boards). For the automation of the circuit/EM simulation, algorithms performing each process of the SI/PI analysis automatically (such as ports setup, circuit definition and SI/PI evaluation) are developed; thereby automation system for the SI/PI analysis is constructed with the algorithms. The automation of the circuit/EM simulation is accomplished in the environment of the C/S (Client/Server) architecture in order to reduce resources such as high cost computers demanded for the SI/PI analysis. The automation method for the SI/PI analyses proposed in this paper reduces effort, time, and cost spent on the environment setup for simulation and the SI/PI analysis process. In addition, the proposed method includes automation of the documenting process, which organizes, records and displays the SI/PI analysis results automatically for users.

• Journal of the Institute of Convergence Signal Processing
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• v.16 no.3
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• pp.90-95
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• 2015

This study presents a method to test quite small-sized and light-weighted micro-drill bits which are used to make holes in printed circuit boards(PCB). After getting images of micro-drill bits through the high resolution microscope, we developed image processing algorithms to detect fiducial points, and then measured diverse factors of the drill-bit based on these points. We also developed the window-based inspection system to automatically discriminate normal and abnormal status. For the relative comparison of its performance, the system was compared with an existing inspection system using test images. Experimental results showed that the proposed system slightly improved performance, and also classified correctly some misjudged errors which were occurred in the existing system.