• Journal of the Korean Operations Research and Management Science Society
• /
• v.19 no.1
• /
• pp.1-16
• /
• 1994

In this paper, we try to raise the efficiency of PCB production by improving automated inserting process. This process is composed of part inserting sequence and feeder allocation problem. Until now, this problem is formulated by Traveling Salesman Problem (TSP) or Rural Postman Problem. They concerted more on parts(chips) inserting. But in this paper, we concentrate on Feeder. We formulate 0-1 Integer program (MP2) easier than TSP. This program can be solved by using LP Package (i. e. LINDO, GAMS etc). We propose Heuristic algorithm ISFA which guarantees a local optimum and often gives solution. We give some examples to prove ISFA algorithm.

• International Journal of Fuzzy Logic and Intelligent Systems
• /
• v.4 no.3
• /
• pp.316-321
• /
• 2004

In this paper, we have developed a new mounting head system for flip chip. The proposed head system consists of a macro/micro positioning actuator for stable force control. The macro actuator provides the system with a gross motion while the micro device yields fine tuned motion to reduce the harmful impact force that occurs between very small sized electronic parts and the surface of a PCB(printed circuit board). In order to show the effectiveness of the proposed macro/micro chip mounting system, we compared the proposed system with the conventional chip mounting head equipped with a macro actuator only. A series of experiments were executed under the mounting conditions such as various access velocities and PCB stiffness. As a result of this study, a satisfactory voice coil actuator as the micro actuator has been developed, and its performance meet well the specifications desired for the design of the chip mounting head system and show good correspondence between theoretical analysis and experimental results.

• Journal of electromagnetic engineering and science
• /
• v.6 no.1
• /
• pp.62-70
• /
• 2006

This paper presents a new power plane design method incorporating a single geometry derived from a unit cell of photonic bandgap(PBG) structure. This method yields constantly wide suppression of parallel plate resonances from 0.9 GHz to 4.2 GHz and is very efficient to eliminate PCB resonances in a specified frequency region to provide effective suppression of simultaneous switching noise(SSN). It is shown that with only two cells the propagation of unwanted high frequency signals is effectively suppressed, while it could provide continuous return signal path. The measured results agree very well with theoretically predicted ones, and confirm that proposed method is effective for reducing EMI, with measured near-field distribution. The proposed topology is suitable for design of high speed digital system.

• Journal of Korean Society of Industrial and Systems Engineering
• /
• v.27 no.4
• /
• pp.141-146
• /
• 2004

This research considers the problem of scheduling jobs on unrelated parallel machines with a common due date. The objective is to minimize the total absolute deviation of job completion times about the common due date. This problem is motivated by the fact that a certain phase of printed circuit board manufacturing and other production systems is bottleneck and the processing speeds of parallel machines in this phase are different for each job. A zero-one integer programming formulation is presented and two dominance properties are proved. By these dominance properties, it is shown that the problem is reduced to asymmetric assignment problem and is solvable in polynomial time.

• Korean Chemical Engineering Research
• /
• v.52 no.2
• /
• pp.272-277
• /
• 2014

In this study the nanofiltration (NF) membrane treatment of a sulfuric acid waste solutions containing copper ion ($Cu^{+2}$) discharging from the etching processes of the printed circuit board (PCB) manufacturing industry has been studied for the recycling of acid etching solution. SelRO MPS-34 4040 NF membrane from Koch company was tested to obtain the basic NF data for recycling of etching solution and separation efficiency (total rejection) of copper ion. NF experiments were carried out with a cross-flow membrane filtration laboratory system. The permeate flux was decreased with the increasing copper ion concentration in sulfuric acid solution and lowering pH of acid solution, and its value was the range of $4.5{\sim}23L/m^2{\cdot}h$. Total rejection of copper ion was decreased with the increasing copper ion concentration, lowering pH of acid solution and decreasing cross-flow rate. The total rejection of copper ion was more than 70% at the experimental condition. The SelRO MPS-34 4040 NF membrane was represented the stable flux and rejection for 1 year operation.

• Journal of Radiation Industry
• /
• v.9 no.3
• /
• pp.153-159
• /
• 2015

Reliability of printed circuit board (PCB), which is based on high integrated circuit technology, is having been important because of development of electric and self-driving car. In order to answer these demand, automated X-ray inspection (AXI) is best solution for PCB non-destructive test. PCB is consist of plastic, copper, and, lead, which have low to high Z-number materials. By using dual energy X-ray imaging, these materials can be inspected accurately and efficiently. Dual energy X-ray imaging, that have the advantage of separating materials, however, need some solution such as energy separation method and enhancing efficiency because PCB has materials that has wide range of Z-number. In this work, we found out several things by analysis of X-ray energy spectrum. Separating between lead and combination of plastic and copper is only possible with energy range not dose. On the other hand, separating between plastic and copper is only with dose not energy range. Moreover the copper filter of high energy part of dual X-ray imaging and 50 kVp of low energy part of dual X-ray imaging is best for efficiency.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
• /
• 2003.11a
• /
• pp.178-182
• /
• 2003

This paper presents the embedded inductors in PCB (Printed Circuit Board) for PAM(Power Amplifier Module) of mobile terminations. The inductors are designed, simulated, and compared to conventional chip inductors. The Quality factor(Q) and self-resonance frequency(SRF) of the inductors are evaluated. The quality factors of the inductors are two times higher than those of the chip inductors, and the self-resonance frequency is 1.3 times higher than those of chip inductors at the inductance of 2.7 nH and 3.3 nH respectively.

• Journal of the Korea Institute of Military Science and Technology
• /
• v.23 no.4
• /
• pp.319-327
• /
• 2020

In this study a methodology to evaluate fatigue life of the electronic parts for the fighter radar unit under random vibration loading is presented. To do this, one parameter for the 3-σ RMS quation of Steinberg fatigue model is modified to come up with a printed circuit board(PCB) with multiple electronic parts, while fundamental frequency and dynamic deflection of the PCB are calculated from a MATLAB based finite element computer code. For the RIFA structure selected in this study, the 3-σ RMS fatigue limit displacement is reduced to 0.741 times as much as the Steinberg model. This investigation allows to assess the life of multiple electronic parts mounted on the PCB with reinforced metal cover/body showing non-sinusoidal deflection patterns.

• IE interfaces
• /
• v.7 no.1
• /
• pp.67-74
• /
• 1994

In this study, we propose an integrated CAD(Computer Aided Design) library database in a heterogeneous commercial ECAD(Electronic CAD) environment. To effectively solve engineering problems focused on BOM data extraction we use a software system called schematic capture and company-wide standard electronic part information loaded on different commercial ECADs. We unify many commercial ECADs into one schematic capture and a variety of PCB(Printed Circuit Board) design tools. For this purpose we develope a model for linking CAD symbol library with company-wide standard part information. We also develope a schematic design data conversion scheme and show how to extract PBA level BOM data using our customized schematic capture. This system is being operated in an X-Window based engineering work station and commercial RDBMS base.

• International Journal of Internet, Broadcasting and Communication
• /
• v.7 no.2
• /
• pp.161-167
• /
• 2015

The performance of high power LEDs highly depends on the junction temperature. Operating at high junction temperature causes elevation of the overall thermal resistance which causes degradation of light intensity and lifetime. Thus, appropriate thermal management is critical for LED packaging. The main goal of this research is to improve thermal resistance by optimizing and comparing nano-pore silicon-based thermal substrate to insulated metal substrate and direct bonded copper thermal substrate. The thermal resistance of the packages are evaluated using computation fluid dynamic approach for 1 W single chip LED module.