• IE interfaces
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• v.10 no.1
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• pp.155-167
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• 1997

The purpose of this study is to develop the program for efficient operation of a multi-functional surface mounting device(SMD) which mount various components on a printed circuit board(PCB). These components are provided by diverse types of feeders such as cassette, stick and tray feeders. The SMD has one or two heads. In the SMD, the positions of PCB and feeders and fixed, and the head moves to pick up a component from a feeder and to mount it on the PCB. The number of lanes occupied by each feeder and the nozzle used for each component can be different. We develop an off-line program to minimize the cycle-time of the SMD by studying the optimal assignment of feeders and the optimal mounting sequence of components. Graphical User Interface(GUI) is also developed. Additionally, we consider the line balancing problem which appears when two SMDs are used sequentially.

• Proceedings of the Korean Information Science Society Conference
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• 2011.06a
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• pp.320-323
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• 2011

최근 전자기술의 발달로 인해 인쇄 회로 기판(Printed Circuit Board)이 정밀화되고 세분화됨에 따라 고도로 집약되어 육안에 의한 시각검사 방법이 어려워지고 있다. 이에 따라 컴퓨터 시각 기술을 이용한 자동시각검사가 점차 늘어가는 추세다. 이러한 PCB의 설계 또는 검사 시 참조할 이미지를 만드는 방법 중 하나로 Gerber Interface로 표현된 PCB용 CAD파일인 거버파일을 이용하여 디지털 이미지를 생성하는 법이 널리 이용되고 있다. 반면 이러한 파일 및 이미지는 상호간에 인과관계(causality)를 가지며, 이미지 유출시 그 피해가 크다. 따라서 생성된 이미지를 효과적으로 보호하고 관리해야할 필요가 있다. 본 논문에서 상기의 인과관계를 이용하여 이를 관리하고 보호하는 이미지 권한관리 기법을 제안한다.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.10a
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• pp.43-46
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• 2006

본 논문은 PCB(printed circuit board)에 납땜이 되어 장착된 부품들의 들뜸 상태 검사 알고리즘에 관한 연구이다. 전자산업의 발달로 제품이 소형화, SMD화, 고집적화가 함께 추구되고 있으며, 특히 리드(lead)의 fine-pitch화 현상으로 인해 부품의 들뜸 상태 검사의 중요성은 매우 부각되고 있다. 따라서 본 논문에서는 2차원 포인터 레이저 거리센서를 이용하여 PCB위에 장착된 부품의 들뜸 상태를 검사하고자 한다. 이를 위해 레이저 측정용 장치를 제작하여 부품의 들뜸 검사 알고리즘의 유용성 및 들뜸의 상태 판단 여부를 확인하였다. 본 논문에서 사용한 기준 부품은 각칩 형태로 된 저항, 커패시터와 BGA 및 QFP이며 이 부품들을 이용하여 리드와 바디의 들뜸 상태를 검사하였다. 검사 기준으로 리드의 들뜸은 Scan Teaching 방식을 이용하였으며, 바디의 들뜸은 단차 Teaching 방식을 이용하였다.

• International Journal of Control, Automation, and Systems
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• v.4 no.1
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• pp.96-104
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• 2006

We propose a path planning method to improve the productivity of AOI (automated optical inspection) machines in PCB (printed circuit board) assembly lines. The path-planning problem is the optimization problem of finding inspection clusters and the visiting sequence of cameras to minimize the overall working time. A unified method is newly proposed to determine the inspection clusters and visiting sequence simultaneously. We apply a hybrid genetic algorithm to solve the highly complicated optimization problem. Comparative simulation results are presented to verify the usefulness of the proposed method.

• Journal of the Korea Society of Computer and Information
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• v.21 no.3
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• pp.57-64
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• 2016

This paper deals with the PCB assembly time minimization problem that the PAP (pick-and-placement) machine pickup the K-weighted group of N-components, loading, and place into the PCB placement location. This problem considers the rotational turret velocity according to component weight group and moving velocity of distance in two component placement locations in PCB. This paper suggest heavy-weight component group first pick-and-place strategy that the feeder sequence fit to the placement location Hamiltonean cycle sequence. This algorithm applies the quadratic assignment problem (QAP) that considers feeder sequence and location sequence, and the linear assignment problem (LAP) that considers only feeder sequence. The proposed algorithm shorten the assembly time than iATMA for QAP, and same result as iATMA that shorten the assembly time than ATMA.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.301-306
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• 2001

Applying life cycle assessment in PCB (printed circuit board) production, most of environmental impacts come from outside-factory-process due to power generation, especially, and other raw material productions. Relatively, small environmental impacts of inside-factory-process make it difficult to compare them. To overcome this problem allocating environmental impacts of outside-factory-process on inside-factory-process. It helps to identify the environmental impacts of each process and find sources of environmental impacts. Also, life cycle assessment shows reduction of environmental impacts after copper recycling process.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.25 no.5A
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• pp.682-687
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• 2000

EMI problem is very important in a printed circuit board design. This paper deals with image plane as one of the most effective method to reduce EMI in PCB. The shielding performance of one and two layers of image planes of finite width and length is analyzed by the method of moments based on the triangular surface patch model. The current distributions were modeled as two simple line sources. It is demonstrated that proper triangulation should be made so as to take two basis functions in the boundary triangles of the surface.

• Journal of Korea Society of Industrial Information Systems
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• v.1 no.1
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• pp.29-62
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• 1996

In this paper, the problem of determining cyclic schedules for a material handling hoist in the printed-circuit-board(PCB) electroplating line is considered. The objective of this research is to determine an optimal simple-cycle schedule of the hoist which in turn maximizes the line throughput rate. Previous approaches to the cyclic hoist scheduling problem are all mathematical programming-based approaches to develop cyclic schedules(Mixed Integer Programming, Linear Programming based Branch and Bound, Branch and Bound Search Method and so on). In this paper, a genetic algorithm-based approach for a single hoist scheduling in the PCB electroplating line is described. Through some experiments for the well known example data and randomly generated data, the proposed algorithm is shown to be more efficient than the previous mathematical programming-based algorithm.

• Journal of Welding and Joining
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• v.17 no.6
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• pp.78-83
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• 1999

Solder joint is the weakest part which connects in mechanically and electronically between package body and PCB(Printed Circuit Board). Recently, the reliability of solder joint become the most critical issue in surface mounted technology. The solder joint interconnection between plastic package and PCB is susceptible to shear stress during thermal storage due to the mismatch in coefficient of thermal expansion between plastic package and PCB. A general computational approach to determine the effect of solder joint shape on the fatigue life presented. The thermal fatigue life was estimated from the engelmaier equation which was obtained from the temperature cycling loading($-65^{\circ}C$ to $150^{\circ}C$). As result of the simulation, TSOP structure has the shortest thermal fatigue life and the same structure Copper lead has 2.5 times as much fatigue life as Alloy 42 lead. In BGA structure, fatigue life time extended 80 times when underfill material exists.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.52 no.9
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• pp.468-474
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• 2003

This paper describes the development of an open frame type high power density switching converter. It is based on the active clamp forward converter with synchronous rectifier, and packaged by using the open frame and multi-layer printed circuit board (PCB) technology to achieve the higher power density. Furthermore, the windings of transformer and inductor are also realized by multi-layer PCB so that it also contributes to achieve higher power density. Through the experiment on the prototype converter of 50[W], it is confirmed that power density of 50[W/i$n_3$] and maximum efficiency of over 91[%] are obtained.