통합 검색 | Korea Science

Lin, Ning;Vanmarcke, Erik;Yau, Siu-Chung
- Wind and Structures
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- 제13권2호
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- pp.207-220
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- 2010
The 'chain reaction' effect of the interaction between wind pressure and windborne debris is likely to be a major cause of damage to residential buildings during severe wind events. The current paper (Part II) concerns the quantification of such pressure-debris interaction in an advanced vulnerability model that integrates the debris risk model developed in Part I and a component-based wind-pressure damage model. This vulnerability model may be applied to predict the cumulative wind damage during the passage of particular hurricanes, to estimate annual hurricane losses, or to conduct system reliability analysis for residential developments, with the effect of windborne debris fully considered.
https://doi.org/10.12989/was.2010.13.2.207 인용 KSCI

Hong, Yong-Taek;Heiler, Gregory;Cheng, I-Chun;Kattamis, Alex;Wagner, Sigurd
- 한국정보디스플레이학회:학술대회논문집
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- 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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- pp.892-896
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- 2005
In this paper, key issues of stainless steel foil substrates for display applications have been described. We studied and analyzed technical issues on substrate passivation/planarization to control surface roughness and capacitive coupling from conductive substrates. A thick (either multiple or single) passivation/planarization layer needs to be applied on the nonelectronic-grade stainless steel substrate to provide a smooth surface and electrical insulation from the conductive substrate. Especially for large size, high-resolution display applications, low k and thick passivation/planarization layers should be used for appropriate capacitive coupling. Based on our initial study, a unit area capacitance of less than $2nF/cm^2$ of passivation/planarization layers is needed for 32" HD TV OLED displays.
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Wagner, Sigurd;Gleskova, Helena
- 한국정보디스플레이학회:학술대회논문집
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- 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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- pp.263-267
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- 2002
We are standing at the beginning of the industrialization of flexible thin-film transistor backplanes. An important group of candidates is based on silicon thin films made on metal or plastic foils. The main features of amorphous, nanocrystalline and microcrystalline silicon films for TFTs are summarized, and their compatibility with foil substrate materials is discussed.
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