• Korean Journal of Metals and Materials
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• v.49 no.11
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• pp.845-852
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• 2011

The Spark Plasma Sintering(SPS) method offers a means of fabricating a sintered-body having high density without grain growth through short sintering time and a one-step process. A titanium compact having high density and purity was fabricated by the SPS process. It can be used to fabricate a Ti sputtering target with controlled parameters such as sintering temperature, heating rate, and pressure to establish the optimized processing conditions. The compact/target(?) has a diameter of ${\Phi}150{\times}6.35mm$. The density, purity, phase transformation, and microstructure of the Ti compact were analyzed by Archimedes, ICP, XRD and FE-SEM. A Ti thin-film fabricated on a $Si/SiO_2$ substrate by a sputtering device (SRN-100) was analyzed by XRD, TEM, and SIMS. Density and grain size were up to 99% and below $40{\mu}m$, respectively. The specific resistivity of the optimized Ti target was $8.63{\times}10^{-6}{\Omega}{\cdot}cm$.

• Journal of Powder Materials
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• v.27 no.4
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• pp.293-299
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• 2020

W₂C is synthesized through a reaction-sintering process from an ultrafine-W and WC powder mixture using spark plasma sintering (SPS). The effect of various parameters, such as W:WC molar ratio, sintering temperature, and sintering time, on the synthesis behavior of W₂C is investigated through X-ray diffraction (XRD) analysis, scanning electron microscopy (SEM) analysis of the microstructure, and final sintered density. Further, the etching properties of a W₂C specimen are analyzed. A W₂C sintered specimen with a particle size of 2.0 ㎛ and a relative density over 98% could be obtained from a W-WC powder mixture with 55 mol%, after SPS at 1700℃ for 20 min under a pressure of 50 MPa. The sample etching rate is similar to that of SiC. Based on X-ray photoelectron spectroscopy (XPS) analysis, it is confirmed that fluorocarbon-based layers such as C-F and C-F2 with lower etch rates are also formed.

• Journal of Powder Materials
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• v.11 no.2
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• pp.158-164
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• 2004

W-Cu composite has been used for the applications requiring both high strength, good thermal and electrical conductivity. A graded combination of W and Cu will reduce thermal stress concerned with heat conduction, maintaining good thermal conductivity and high mechanical strength. In the present work, an attempt was made to fabricate continuous W-Cu FGM by preparing the graded porous structure of W skeleton using spark plasma sintering (SPS) process followed by infiltrating Cu. The graded porous structure was prepared at 150$0^{\circ}C$ for 60s under pressure of 15MPa by SPS process using a graphite mold with varying crr)ss section in the longitudinal direction. Infiltration of Cu was performed at 115$0^{\circ}C$ for 1 hour under $H_2$. W-Cu composite with graded Cu composition of 14 to 27 wt％ was finally prepared. In this process the gradient of composition could be conveniently controlled by varying the gradient of cross sectional area of graphite mold, temperature and pressure.

• Journal of the Korean Ceramic Society
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• v.34 no.4
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• pp.357-367
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• 1997

A fast process for producing pure silica glasses with the reproducibility of 100% by means of sintering of silica aerogels was optimized. The density of silica glasses synthesized by heat-treating upto 110$0^{\circ}C$ with the heating rate of 0.1$^{\circ}C$/min was 2.197 g/㎤. Synthetic silica glasses(5 mm thickness) exhibited the transmittance of 92% in the near IR range as well as they had the excellent mechanical properties such as flexural strength of 162 MPa and hardness of 778 kg/$\textrm{mm}^2$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.365-368
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• 2000

We have studies on the Microstructures and densities as a function of forming pressures and the magnetic properties of the specimens with additive Bi$_2$O$_3$ that sintered at 95$0^{\circ}C$ for 4.5 hours for synthesizing optimal Ni-Cu-Zn ferrite. Green density rose generally as Forming pressure increased from 1.7 ton/cm$^2$to 2.5 ton/cm$^2$and Cold Isostatic Pressure(CIP) method was more effective than Die Pressure(DP) method to high green density. Forming pressure had no influence on apparent density but on the other hand Bi$_2$O$_3$contents were strongly dominant to appaernt density than forming pressure. Bi$_2$O$_3$liquid phases created during sintering process promoted sintering and grain growth so that apparent density, grain size and permeability increased compared to that of the specimens which were sintered with non-additive Bi$_2$O$_3$.

• Korean Journal of Materials Research
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• v.17 no.6
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• pp.331-336
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• 2007

The pure Mg powder compacts were successfully fabricated using SPS process. The machined chip powder showed flake shaped morphology with coarse surfaces, while gas atomized powders were spherical in morphology with smooth surfaces. In this study, SPS process was used to consolidate the pure Mg powder because this process allows high density consolidation in a short time. The results showed that increased sintering temperature from $350^{\circ}C$ to $500^{\circ}C$ with pressure of 30MPa, the maximum values of the density was increased from 98.1% to 99.8% of theoretical density, respectively. However, density of the sintered chip powders was higher than that of gas-atomized powder due to larger contact areas between particles.

• Korean Journal of Materials Research
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• v.31 no.7
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• pp.397-402
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• 2021

In this study, binderless-WC, WC-6 wt%Co, WC-6wt% 1 and 2.5 B₄C materials are fabricated by spark plasma sintering process (SPS process). Each fabricated WC material is almost completely dense, with a relative density up to 99.5 % after the simultaneous application of pressure of 60 MPa. The WC added Co and Co-B₄C materials resulted in crystalline growth. The WC with HCP crystal structure has respective interfacial energy (basal facet direction: 1.07 ~ 1.34 J·m^-2, prismatic direction: 1.43 ~ 3.02 J·m^-2) that depends on the grain growth direction. It is confirmed that the continuous grain growth, biased by the basal facet, which has relatively low energy, is promoted at the WC/Co interface. As abnormal grain growth takes place, the grain size increases more than twice from 0.37 to 0.8 um. It is found through analysis that the hardness property also greatly decreases from about 2661.4 to 1721.4 kg/mm², along with the grain growth.

• Journal of the Korean institute of surface engineering
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• v.48 no.4
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• pp.158-162
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• 2015

To substitute indium tin oxide (ITO), many substituents have been studied such as metal nanowires, carbon based materials, 2D materials, and conducting polymers. These materials are not good enough to apply to an electrode because theses exhibit relatively high resistance. So metal grids are required as an additionalelectrode to improve the conductivities of substituents. The metal grids were printed by electrohydrodynamic printing system using Ag nanoparticle based ink. The Ag grids showed high uniformity and the line width was about $10{\mu}m$. The Ag nanoparticles are surrounded by dispersants such as unimolecular and polymer to prevent aggregation between Ag nanoparticles. The dispersants lead to low conductivity of Ag grids. Thus, the sintering process of Ag nanoparticles is strongly recommended to remove dispersants and connect each nanoparticles. For sintering process, the interface and microstructure of the Ag grid were controlled in 1.0 torr Ar atmosphere at aound $400^{\circ}C$ of temperature. From the sintering process, the uniformity of the Ag grid was improved and the defects on the Ag grids were reduced. As a result, the resistivity of Ag grid was greatly reduced up to $5.03({\pm}0.10){\times}10^{-6}{\Omega}{\cdot}cm$. The metal grids embedded substrates containing low pressure Ar sintered Ag grids showed 90.4% of transmittance in visible range with $0.43{\Omega}/{\square}$ of sheet resistance.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.234-238
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• 2008

The efficiency of fiber reinforced CMC(ceramic matrix composite) on the SiC materials have been investigated, in conjunction with the fabrication process by liquid phase sintering and the characterization. LPS-$SiC_f$/SiC composites was studied with the detailed analysis such as the microstructure, sintered density, flexural strength and fracture behavior. The applicability of carbon interfacial layer has been also investigated in the LPS process. Submicron SiC powder with the constant total amount and composition ratio of $Al_2O_3,\;Y_2O_3$ as sintering additives was used in order to promote the performance of the SiC matrix material. LPS-$SiC_f$/SiC composites were fabricated with hot press under the sintering temperature and applied pressure of $1820^{\circ}C$ and 20MPa for 1hr. The typical property of monolithic LPS-SiC materials was compared with LPS-$SiC_f$/SiC composites.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.278-281
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• 2009

Selective laser sintering(SLS), a kind of rapid prototyping technology, can provide a process to form many types of coatings. Coated layers by selective laser melting are highly influenced by substrate, powder and laser parameters such as laser power, scan rate, fill spacing and layer thickness. Therefore an attempt to fabricate Fe-Ni-Cr coating on AISI H13 tool steel has been performed by selective laser sintering. In this study, Fe-Ni-Cr coating was produced by experimental facilities consisting of a 200W fiber laser which can be focused to 0.08mm and atmospheric chamber which can control atmospheric pressure with Ar. With power increase or energy density decrease, line width was decreased and line surface quality was improved with energy density increase. Surface quality of coating layer was improved with fill spacing optimization or layer thickness decrease.