• Title/Summary/Keyword: Pressure sensor

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Development of Implantable Blood Pressure Sensor Using Quartz Wafer Direct Bonding and Ultrafast Laser Cutting (Quatrz 웨이퍼의 직접접합과 극초단 레이저 가공을 이용한 체내 이식형 혈압센서 개발)

  • Kim, Sung-Il;Kim, Eung-Bo;So, Sang-kyun;Choi, Jiyeon;Joung, Yeun-Ho
    • Journal of Biomedical Engineering Research
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    • v.37 no.5
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    • pp.168-177
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    • 2016
  • In this paper we present an implantable pressure sensor to measure real-time blood pressure by monitoring mechanical movement of artery. Sensor is composed of inductors (L) and capacitors (C) which are formed by microfabrication and direct bonding on two biocompatible substrates (quartz). When electrical potential is applied to the sensor, the inductors and capacitors generates a LC resonance circuit and produce characteristic resonant frequencies. Real-time variation of the resonant frequency is monitored by an external measurement system using inductive coupling. Structural and electrical simulation was performed by Computer Aided Engineering (CAE) programs, ANSYS and HFSS, to optimize geometry of sensor. Ultrafast laser (femto-second) cutting and MEMS process were executed as sensor fabrication methods with consideration of brittleness of the substrate and small radial artery size. After whole fabrication processes, we got sensors of $3mm{\times}15mm{\times}0.5mm$. Resonant frequency of the sensor was around 90 MHz at atmosphere (760 mmHg), and the sensor has good linearity without any hysteresis. Longterm (5 years) stability of the sensor was verified by thermal acceleration testing with Arrhenius model. Moreover, in-vitro cytotoxicity test was done to show biocompatiblity of the sensor and validation of real-time blood pressure measurement was verified with animal test by implant of the sensor. By integration with development of external interrogation system, the proposed sensor system will be a promising method to measure real-time blood pressure.

A Study on the Method of Equilibrium-Pressure Prediction from Transient Data (과도상태의 압력데이터로부터 평형상태 압력 예측방법 연구)

  • Lee, Jong-Kook
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.32 no.7
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    • pp.19-28
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    • 2004
  • This study is concerned with the method of equilibrium-pressure prediction from transient data. Pressure measurement system consisted of pressure sensor and pressure tube. The surface orifice where pressure is measured is connected to a pressure sensor by a tube. In case of high orifice pressure, the pressure sensor responds rapidly to the orifice pressure. But when the orifice pressure is low the pressure sensor does not respond rapidly to the orifice pressure and time lag occurs seriously. Various test conditions are applied to investigate the time lag and to assess the methods of equilibrium-pressure prediction. The test time of the low-pressure measurement can be reduced by the method of equilibrium-pressure prediction of the present study.

Characteristics of high-temperature single-crystalline 3C-SiC piezoresistive pressure sensors (고온 단결정 3C-SiC 압저항 압력센서 특성)

  • Thach, Phan Duy;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.274-274
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    • 2008
  • This paper describes on the fabrication and characteristics of a 3C-SiC (Silicon Carbide) micro pressure sensor for harsh environment applications. The implemented micro pressure sensor used 3C-SiC thin-films heteroepitaxially grown on SOI (Si-on-insulator) structures. This sensor takes advantages of the good mechanical properties of Si as diaphragms fabricated by D-RIE technology and temperature properties of 3C-SiC piezoresistors. The fabricated pressure sensors were tasted at temperature up to $250^{\circ}C$ and indicated a sensitivity of 0.46 mV/V*bar at room temperature and 0.28 mV/V*bar at $250^{\circ}C$. The fabricated 3C-SiC/SOI pressure sensor presents a high-sensitivity and excellent temperature stability.

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Flip-Chip Package of Silicon Pressure Sensor Using Lead-Free Solder (무연솔더를 이용한 실리콘 압력센서의 플립칩 패키지)

  • Cho, Chan-Seob
    • Journal of the Korean Society of Industry Convergence
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    • v.12 no.4
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    • pp.215-219
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    • 2009
  • A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

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Error Compensation due to Environmental Temperature for Diaphragm-Type Pressure Sensor (다이어프램형 압력센서에서 주변 온도에 의한 오차 보상)

  • Yun, Dae Jhonng;Ahn, Jung Hwan;Lee, Gil Seung;Kim, Hwa Young
    • Journal of Sensor Science and Technology
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    • v.28 no.3
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    • pp.177-181
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    • 2019
  • Pressure sensors are used in various industries such as automobiles, airplanes, medical equipment, and coolers. Even if the ambient temperature changes, the measurement is reliable and stable. In this study a diaphragm-type pressure sensor was used to derive a temperature-compensated pressure estimation equation for accurate pressure measurement at $100^{\circ}C$ and $-40^{\circ}C$. To understand the characteristics of the pressure sensor diaphragm with respect to temperature and pressure, experiments were conducted in temperature-variable chamber using FEM analysis to confirm that the influence of temperature effect was nonlinear. Based on the experimental results, a nonlinear method for calculating the pressure by compensating for the error due to temperature was derived. The calculated pressure value is lower than 0.5 % at low and high temperatures, and lower than 0.4 % at $22^{\circ}C$, thereby eliminating the effect of temperature.

Digitized Pressure Sensor (디지탈 출력 압력 센서)

  • Kim, Hyeon-Cheol;Chun, Kuk-Jin
    • Proceedings of the KIEE Conference
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    • 1996.11a
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    • pp.419-421
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    • 1996
  • We propose the digitized pressure sensor and the interface circuit to read directly the pressure signal in the digital form. The interface circuit has the control clock, comparator, and bit value decision circuit. The digitized sensor and interface circuit are integrated on the one chip using the post processing after IC fabrication. The dimension of the fabricated digitized pressure sensor is $3{\times}6{\times}1mm^3$.

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A Study of Characteristics of Foot Pressure Distribution in Trans-tibial Amputee Subjects (하퇴 의지 사용자의 족저압 분포 특성에 관한 연구)

  • Kim, Jang-Hwan;Cynn, Heon-Seock
    • Physical Therapy Korea
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    • v.8 no.3
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    • pp.1-10
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    • 2001
  • The purpose of this study was to compare the static pressure, dynamic pressure, dynamic pressure-time integral, relative impulse, and contact time between the sound lower limb and amputated lower limb in trans-tibial amputee subjects using Parotec system. Seventeen trans-tibial amputee subjects wearing endoskeletal trans-tibial prosthesis voluntarily participated in this study. The results were as follows: 1) In static standing condition, there were significantly higher static pressure in sound lower limb insole sensor of 10, 14, 15, 18, 19, 23, and 24 and in amputated lower limb insole sensor of 9, 12, and 16 (p<.05). 2) In dynamic gait condition, there were significantly higher dynamic pressure in sound lower limb insole sensor of 2, 18, 22, 23, and 24 and in amputated lower limb insole sensor of 5, 9, 10, 11, 12, 14, 15, and 16 (p<.05). 3) In dynamic gait condition, there were significantly higher pressure-time integral in sound lower limb insole sensor of 2, 4, 18, 19, 20, 21, 23, and 24 and in amputated lower limb insole sensor of 5, 11, 12, and 15 (p<.05). 4) In dynamic gait condition, there were significantly higher relative impulse in sound lower limb insole sensor of 18, 19, 20, 22, 23, and 24 and in amputated lower limb insole sensor of 5, 9, 10, 11, 12, and 15 (p<.05). 5) In dynamic gait condition, there was significantly higher percentage of contact time in push off phase of sound lower limb and in support phase of amputated lower limb (p<.05). These results suggest that trans-tibial amputee subjects had characteristics of shortened push off phase due to unutilized forefoot and of lengthened support phase with higher pressure in the midfoot.

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Electrical and Physical Properties of Sheath-core Type Conductive Textile Sensor with Home-Textile (Sheath-core 구조 전도사 섬유센서의 Home-Textile 적용을 위한 전기·물리학적 특성연구)

  • Cho, Kwang-Nyun;Jung, Hyun-Mi
    • Fashion & Textile Research Journal
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    • v.16 no.1
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    • pp.145-152
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    • 2014
  • The usage of textile-based sensors has increased due to their many advantages (compared to IT sensors) when applied to body assessment and comfort. Textile-based sensors have different detecting factors such as pressure, voltage, current and capacitance to investigate the characteristics. In this study, textile-based sensor fabrics with sheath-core type conductive yarns were produced and the relationship between capacitance changes and applied load was investigated. The physical and electric properties of textile-based sensor fabrics were also investigated under various laminating conditions. A textile based pressure sensor that uses a sheath-core conductive yarn to ensure the stability of the pressure sensor in the textile-based sensor (the physical structure of the reaction characteristic of the capacitance) is important for the stability of the initial value of the initial capacitance value outside the characteristic of the textile structural environment. In addition, a textile based sensor is displaced relative to the initial value of the capacitance change according to pressure changes in the capacitance value of the sensor due to the fineness of the high risk of noise generation. Changing the physical structure of the fabric through the sensor characteristic of the pressure sensor via the noise generating element of laminating (temperature, humidity, and static electricity) to cut off the voltage output element to improve the data reliability could be secured.

Construction and Characterization of the Stainless Steel Isolated Type Semiconductor Pressure Sensor (스테인레스 봉입형 반도체 압력센서의 제작 및 그 특성)

  • Kim, Woo-Jeong;Cho, Yong-Soo;Hwang, Jung-Hoon;Choi, Sie-Young
    • Journal of Sensor Science and Technology
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    • v.11 no.3
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    • pp.138-144
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    • 2002
  • The silicon piezoresistive pressure sensor is made by semiconductor process to obtain stainless steel isolated type pressure sensor. The sensor is loaded on a stainless steel housing with glass molding, $50\;{\mu}m$ stainless steel thin film is welded, and the stainless steel housing encapsulated by silicone oil. The performance of fabricated the pressure sensor has 10 bar pressure range. The XTR105 of exclusive transmitter chip is used the pressure transmitter that output current is 4 - 20 mA. The accuracy is ${\pm}5%$ FS, however, the accuracy is ${\pm}1%$ FS when the sensor is compensated temperature.

Effects of Sensor Errors in Air Cleaner Testing on the Cleaner Performance Estimation (공기청정기 시험기의 센서신호 오차가 공기청정기 성능 평가에 미치는 영향)

  • CHUNHWAN LEE;MINYOUNG KIM;SUMIN LEE
    • Transactions of the Korean hydrogen and new energy society
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    • v.34 no.1
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    • pp.77-82
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    • 2023
  • The fuel cell in fuel cell electric vehicle utilizes oxygen in the atmosphere, which requires the use of an air cleaner system to minimize the intake of harmful pollutants. To estimate the performance of the air cleaner system, the pressure drop between the filter inlet and outlet is used under the rated air flow condition. In this study, the effect of sensor error in this air cleaner testing is experimentally carried out. It is found that the errors of the temperature sensor does not significantly affect the estimation of pressure drop. However, in the case of the pressure sensor, 5% sensor error results in the error of pressure drop estimation by 3%. Therefore, it is recommended that the measurement accuracy of the pressure sensor mounted in test system should be maintained at less than 5%.