• Journal of the Korean institute of surface engineering
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• v.38 no.2
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• pp.55-59
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• 2005

ITO/Ni/ITO thin films were deposited on the PET by RF magnetron sputtering. Dependance of the process parameters such as deposition pressure, positions of Ni layer, on the transmittance, reflectance and sheet resistance of ITO/Ni/ITO film were investigated. When the Ni layer is placed at the center of ITO and deposition pressure is low, ITO/Ni/ITO films showed better optical and electrical properties. At these conditions, the transmittance, reflectance and sheet resistance of the ITO film were $90\%,\;0.38\%$ and $185\Omega/\Box$ respectively.

• Geotechnical Engineering
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• v.3 no.3
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• pp.31-48
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• 1987

The vertical pressure due to soil prism load and surface surcharge load acts on buried pipe, and occasionally uplifting force due to earthquake or differential settlement acts on it. In this paper, study was performed to estimate the pressure acting on the buried pipe due to soil prism load through analyzing Marston-Spangler theory by new method. And loading tests on the buried flexible pipe were performed to study on the response of the pipe due to surface surcharge load. Also, through the estimation of uplifting resistance theory and uplifting test for buried pipe, the method to determine the maximum uplifting resistance of buried pipe was proposed.

• 유체기계공업학회:학술대회논문집
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• 2004.12a
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• pp.70-77
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• 2004

Comprehensive investigation on the outlet's geometric shapes of a centrifugal blower with higher inlet resistance than an atmospheric pressure is carried out for improvements of its performance. Most unwanted behaviors of such blower are pulsating flows because of unbalance between inflows and outflows in a scroll casing. In order to reduce this undesirable phenomenon a triump is made for both the shape of outlet duct and an accessory structure inserted in the outlet port of the blower. The modification on the shape is concerned with the contraction of cross sectional area and the attached structure is for an intentional obstruction to cause a flow resistance. The details of the modification are examined for different cases and results. The methodologies for the work are performance evaluations including noise level and velocity measurements with PIV Consequently, the performance of improved system is close to that of the system operating with atmospheric pressure at the inlet.

• Journal of the Korean institute of surface engineering
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• v.37 no.3
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• pp.158-163
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• 2004

ITO thin film was deposited on the glass by RF magnetron sputtering. Dependance of the process parameters such as thickness, target-to-substrate distance, substrate temperature and oxygen partial pressure on the transmittance and electrical resistance of ITO film were investigated. The deposition conditions for getting better optical and electrical ITO characteristics were the 1800-$2300\AA$ thickness, 65mm substrate-to-target distance, $350^{\circ}C$ substrate temperature and 8% oxygen partial pressure. At these conditions, the transmittance and sheet resistance of the ITO film were 83.3% and 77.86Ω/$\square$, respectively.

• Transactions of the Korean hydrogen and new energy society
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• v.16 no.4
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• pp.386-390
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• 2005

Al film(135.5 nm thick) with Pd film(39.6 nm thick) on the top of it was made by thermal evaporation method. Electrical resistance change due to hydrogen absorption and desorption was measured by four point measurement method. The sample was activated by hydrogen absorption and desorption cycling at room temp. Hydrogen was introduced into the film by increasing hydrogen gas pressure step by step up to 640 torr at room temp. The resistance change ratio was decreased to 12 % with increasing hydrogen pressure in contrast to normal metal behavior. This strange tendency was not understood yet. Further study is needed to find out the mechanism of hydrogen absorption in Al in Al/Pd film.

• Korean Journal of Metals and Materials
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• v.50 no.10
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• pp.785-792
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• 2012

A new flip chip structure consisting of interlocking joints locally surrounded by non-conductive adhesive was investigated in order to improve the contact resistance characteristics and prevent the parasitic capacitance increase. The average contact resistance of the interlocking joints was substantially reduced from $135m{\Omega}$ to $79m{\Omega}$ by increasing the flip chip bonding pressure from 85 MPa to 185 MPa. Improvement of the contact resistance characteristics at higher bonding pressure was attributed not only to the increased contact area between Cu chip bumps and Sn pads, but also to the severe plastic deformation of Sn pads caused during formation of the interlocking-joint structure. The parasitic capacitance increase due to the non-conductive adhesive locally surrounding the flip chip joints was estimated to be as small as 12.5%.

• Steel and Composite Structures
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• v.18 no.2
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• pp.345-355
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• 2015

In this study, the effects of weld parameters on nugget size and tensile-shear strength of welding joint in electrical resistance spot welding of galvanized DP 600 steel sheets having 1.2 mm were investigated. Taguchi design method has been employed to examine the effects of five parameters of welding current, electrode pressure, welding time, clamping time and holding time by using the $L_{27}(5^3)$ orthogonal array. Results showed that the most effective parameters on tensile shear strength and the nugget size ratio (hn/dn) were found as welding current and welding time, whereas electrode pressure, clamping time and holding time were less effective factors. Max. 545 MPa strength was obtained through proposed optimum conditions by Taguchi technique.

• Journal of Advanced Marine Engineering and Technology
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• v.19 no.2
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• pp.1-9
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• 1995

The processing paper has devoted to the theory of the flow equations, the basic derivative procedure, the meaning of a valve flow coefficient $C_v$, the valve Reynolds R$R_{ev}$ and its application for liquid control valves, which applicable under the condition of a non-critical flow and the case of piping geometry factor $F_p$=1.0. However there is no information on the effects of fittings, a critical flow and the flow resistance coefficient of a valve equivalent to that of pipe which is conveniently used in the piping design. Since the piping systems of plants or ships generally contain various fittings such as expanders and reducers due to different size between pipes and valves and there may occur a critical flow, that a mass flowrate is maintained to be constant, due to the pressure drop in a piping when a liquid is initially maintainder ar a saturated temperature or at nearby corresponding to upstream pressure, system designer should have a knowledge of the effect to flow due to fittings and the critical flow phenomenon of a liquid. This study is performed to inform system designers with the critical flow phenomenon of a liquid, a valve resistance coefficient, a valve geometry factor and their applications.

• Journal of Sensor Science and Technology
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• v.27 no.1
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• pp.40-46
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• 2018

In this paper, we focus on optimization of a boron ($^{11}B$)-implanted n type Si epi substrate for obtaining near-zero temperature coefficient of resistance (TCR) at temperature range from 25 to $125^{\circ}C$. The $^{11}B$-implantation on the N type-Si epi substrate formed isolation from the rest of the N-type Si by the depletion region of a PN junction. The TCR increased as the temperature of rapid thermal anneal (RTA) was increased at the temperature range from $900^{\circ}C$ to $1000^{\circ}C$ for the $p^+$ contact with implantation at dose of $1E16/cm^2$, but sheet resistance of this film was decreased. After the optimization of anneal process condition, the TCR of $1126.7{\pm}30.3$ (ppm/K) was obtained for the $p^-$ resistor-COB package chips contained $p^+$ contact with the implantation of $5E14/cm^2$. This shows the potential of the $^{11}B$-implanted n type Si epi substrate as a resistor for pressure sensor in thermal stable environment applications..

• 한국디지털정책학회:학술대회논문집
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• 2005.06a
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• pp.13-28
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• 2005

The purpose of this study is to explore conquest plans of the barrier and resistance in innovation management. This paper focuses to understand the model of innovation that reflects adoption process stages and identify the factors that drive the resistance of consumers. Whenever organizations try to plan and implement some kind of innovation in organizations, they confront resistance in many ways. By understanding innovation resistance, organizations can not only design better innovations but can develop strategies to reduce resistance. Thus they accelerate innovation. Understanding the factors that drive the innovation resistance has important implications for both theoretical development and managerial action. These results indicate that people resist innovation strongly when it betrays their value, needs and beliefs or when they felt the pressure on self-conviction and mental risk, loss, and lack of knowledge.