• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 추계학술대회 논문요약집
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• pp.5-5
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• 2003

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 추계학술대회 논문집
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• pp.219-220
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• 2009

• 한국생산제조학회지
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• 제9권6호
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• pp.164-169
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• 2000

Recently, High accuracy and precision are required in various industrial field especially, semiconductor manufacturing apparatus, Ultra precision positioning apparatus, Information field and so on. Positioning technology is a very important one among them. As such technology has been rapidly developed, this field needs the positioning accuracy as high as submicron. It is expected that the accuracy of 10nm and 1nm is required in precision work and ultra precision work field, respectively by the beginning of 2000s. High speed and low vibration are also needed. This work deals with the design method and control system of Ultra precision positioning apparatus. Control performance and stability analysis were performed in advance by modeling and designing the controller with Simulink.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 춘계학술대회 논문집
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• pp.512-515
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• 1996

A mass production system was implemented to reduce a manufacturing cost in a way of copying with a strong world market competition. However customer's demands are changing so rapidly and the mass production system is nolonger competitive to meet the demands. FMS (Flexible Manufacturing System) has been introduced as a replacement for the mass production system, but it still does not meet system's requirements. A new manufacturing system, called a holonic manufacturing system(HMS), is emerging. In this paper it is introduced an autonomous cooperative system under the concept of HMS.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.79-80
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• 2007

Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing (CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical planarization/polishing (ECMP) or electro-chemical mechanical planarization was introduced to solve the. technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

• Current Optics and Photonics
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• 제2권3호
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• pp.280-285
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• 2018

A new method to design a see-through off-axis head-mounted-display (OA-HMD) optical system with an ellipsoidal surface is proposed, in which a tilted ellipsoidal surface is used as the combiner, which yields the benefits of easier fabrication and testing compared to a freeform surface. Moreover, we realize a coaxial structure in the relay lens group, which is simple and has looser tolerance requirements, thus making assembly easier. The OA-HMD optical system we realize has a simple structure and consists of a combiner and 7 pieces of coaxial relay lenses. It has a $48^{\circ}{\times}36^{\circ}$ field of view (FOV) and 12-mm exit pupil diameter.

• International Journal of Precision Engineering and Manufacturing
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• 제1권1호
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• pp.84-90
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• 2000

The importance of Virtual Manufacturing System is increasing in the area of developing new manufacturing processes, implementing automated workcells, designing plant facility layouts and workplace ergonomics. Virtual manufacturing system is a computer system that can generate the same information about manufacturing system structure, states, and behaviors as is observed in a real manufacturing. In this research, a virtual manufacturing system for flexible manufacturing cells (VFMC), (which is a useful tool for building Computer Integrated Manufacturing (CIM), has been developed using object-oriented paradigm, and implemented with software QUEST/IGRIP. Three object models used in the system are the product model, the facility model, and the process model. The concrete behaviors of a flexible manufacturing cell are re[presented by the task-oriented description diagram, TIC. An example simulation is executed to evaluate applicability of the developed models, and to prove the potential value of virtual manufacturing paradigm.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 추계학술대회 논문집
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• pp.297-298
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• 2007

• 한국정밀공학회지
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• 제26권8호
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• pp.14-23
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• 2009

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 춘계학술대회 논문집
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• pp.321-322
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• 2009