• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.5
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• pp.122-128
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• 2013

This paper describes the on-machine surface form evaluation of an ultra-precision cylinder for the fabrication by the compensation process. In this study, the surface form error of an ultra-precision cylinder, which was fabricated by the ultra-precision diamond turning machine with a single diamond cutting tool, was evaluated by using two capacitance-type displacement probes. Based on the measurement results, the compensation process was conducted. Since the measurement was carried out on the machine without re-mounting of the workpiece, additional fabrication for compensation process can be conducted precisely.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.1
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• pp.86-95
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• 2011

Ultra-precision machining technology is the essential core technology in today's micro-electronics and electro-optical industries. The needs for processing systems to manufacture products to nanometer(nm) accuracy and sub-nanometer resolutions are increased recently. By using ion beam, it is possible to fabricate ultra-precision and ultra-fine products with nm accuracy and sub-nm resolution. In this paper, the basic research trends of ultra precision machining technology in domestic are surveyed, and the ways to reach to the world-leading level of basic research capabilities in the field of ultra-precision machining technology in domestic is suggested.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.2
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• pp.1-9
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• 2006

As consumers in optics, electronics, aerospace and electronics industry grow, the demand for ultra-precision aspheric surface lens increases higher. To enhance the precision and productivity of ultra precision aspheric surface micro lens, the development of ultra-precision grinding system and process for the aspheric surface micro lens are described. In the work reported in this paper, an ultra-precision grinding system for manufacturing the aspheric surface micro lens was developed by considering the factors affecting the ground surface roughness and profile accuracy. This paper deals with mirror grinding of an aspheric surface micro lens by resin bonded diamond wheel and spherical lens of BK7. The optimization of grinding conditions on ground surface roughness and profiles accuracy is investigated using the design of experiments.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.58-58
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• 2009

Uniformity related issues in chemical mechanical polishing (CMP) are within wafer non-uniformity (WIWNU), wafer to wafer non-uniformity (WTWNU), planarity and dishing/erosion. Here, the WIWNU that originates from spatial distribution of independent variables such as temperature, sliding distance, down force and material removal rate (MRR) during CMP, relies to spatial dependency. Among various sources of spatial irregularity, hardness and modulus of pad and surface roughness in sources for pad uniformity are great, especially. So, we investigated the spatial variation of pad surface characteristics using pad measuring system (PMS) and roughness measuring system. Reduced peak height ($R_{pk}$) of roughness parameter shows a strong correlation with the removal rate, and the distribution of relative sliding distance onwafer during polishing has an effect on the variation of $R_{pk}$ and WIWNU. Also, the results of pad wear profile thorough developed pad profiler well coincides with the kinematical simulation of conditioning, and it can contribute for the enhancement of WIWNU in CMP process.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.3
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• pp.324-330
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• 2013

This paper describes a novel method to surface large optics mirror with an extremely high hardness, which could replace the high cost of the repetitive off-line measurement steps and the large ultra-precision grinding machine with ultra-positioning control of 10 nm resolution. A lot of diamond pellet to be attached on the convex aluminum base consists of a grinding tool for the concave large mirror, and the tool was pressured down on the large mirror blank. The tool motion at an interval on the spiral path was controlled with each feed rate as the dwell time in the conventional computer-controlled polishing. The shape to be surfaced was measured directly by a touch probe on the machine without any separation of the mirror blank. Total 40 iterative steps of the surfacing and measurement could demonstrate the form error of RMS $7.8{\mu}m$, surface roughness of Ra $0.2{\mu}m$ for the mirror blank with diameter of 1 m and spherical radius of curvature of 5400 mm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.113-113
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• 2008

Cu CMP (Chemical Mechanical Planarization) has been used to remove copper film and obtain a planar surface which is essential for the semiconductor devices. Generally, it is known that chemical reaction is a dominant factor in Cu CMP comparing to Silicon dioxide CMP. Therefore, Cu CMP slurry has been regarded as an important factor in the entire process. This investigation focused on understanding the effect of corrosion inhibitor on copper surface and CMP results. Benzotriazole (BTA) was used as a corrosion inhibitor in this experiment. For the surface analysis, electrochemical characteristics of Cu was measured by a potentiostat and surface modification was investigated by X-ray photoelectron spectroscopy (XPS). As a result, corrosion potential (Ecorr) increased and nitrogen concentration ratio on the copper surface also increased with BTA concentration. These results indicate that BTA prevents Cu surface from corrosion and forms Cu-BTA layer on Cu surface. CMP results are also well matched with these results. Material removal rate (MRR) decreased with BTA concentration and static etch rate also showed same trend. Consequently, adjustment of BTA concentration can give us control of step height variation and furthermore, this can be applicable for Cu pattern CMP.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.51-52
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• 2007

This paper compared wired Acoustic Emission (AE) signals with wireless AE signals. According to the material and process condition, each process signal has distinguishable characteristic to show each removal phenomenon. Therefore, wired and wireless AE sensors having different bandwidth are complementary for CMP process monitoring. Especially, the AE sensor was used to investigate abrasive and molecular-scale phenomena during CMP process, which was compatible to acquire high level frequency. In experiment, wireless AE system was used to get signals in rotary system, using bluetooth. But, it is possible to acquire only RMS signals, which can not analyze abrasive and molecular-sale phenomena. Second, wired AE system was installed using mercury slip-ring, which is suitable not only for rotation equipment but also for acquiring original signals. The acquired signals were analyzed by FFT for understanding of abrasive and molecular revel phenomena in CMP process, finally, we verified that two types of AE sensor with different bandwidth were complementary for CMP process monitoring.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.47-48
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• 2007

A CMP Process has many factors that affect result of a polished wafer. Dominant factors are velocity, pressure and temperature in process. A pad profile is also considered as affecting factor of CMP. Accoding to variation of a pad profile, the each pan of a wafer is differently pressured. It appears to affect the uniformity of a wafer. A pad profile varies as a swing arm conditioner which have been ordinarily used in industry. A swing arm conditioner has several sectors in its swing path. This study aims that a wafer get a good uniformity as swing arm conditioner's path on pad is analyzed and simulated. Through the simulation, tendency of pad profile after conditioning will be predicted and the result of simulation compared with the result of experiment. The optimized pad profile would be made by to vary swing arm's velocity on each sector. In order to maintain the optimized profile, conditioner design or swing arm's velocity should be changed and designed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.1
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• pp.63-68
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• 2018

At present, ultra-precision cutting technology has been studied in Korean research institutes, focusing on development of ultra-precision cutting tool technology and ultra-precision control engineering. However, the developed technologies are still far behind advanced countries. It focuses on metals including aluminum, copper and nickel, and nonmetals including plastics, silicone and germanium which require high precision while using a lathe. It is hard to implement high precision by grinding the aforementioned materials. To address the issue, the ultra-precision cutting technology has been developing by using ultra-precision machine tools very accurate and strong, and diamond tools highly abrasion-resistant. To address this issue, this study aims to conduct ultra-precision cutting by using ECTS (Error Compensation Tool Servo) to improve motion precision of elements and components, and compensate for motion errors in real time. An IR camera is used for analyzing cutting accuracy differences depending on the heat generated in diamond tools in cutting to examine the heat generated in cutting to study cutting accuracy depending on generated heat.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.1
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• pp.77-83
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• 2016

Intricate deflection requires many conventional actuators (motors, pistons etc.), which can be financially and spatially wasteful. Novel smart soft composite (SSC) actuators have been suggested, but fabrication complexity restricts their widespread use as general-purpose actuators. In this study, a hybrid manufacturing process comprising 3-D printing and casting was developed for automated fabrication of SSC actuators with $200{\mu}m$ precision, using a 3-D printer (3DISON, ROKIT), a simple polymer mixer, and a compressor controller. A method to improve precision is suggested, and the design compensates for deposition and backlash errors (maximum, $170{\mu}m$). A suitable flow rate and tool path are suggested for the polymer casting process. The equipment and process costs proposed here are lower than those of existing 3D printers for a multi-material deposition system and the technique has $200{\mu}m$ precision, which is suitable for fabrication of SSC actuators.