• Title/Summary/Keyword: Precision grinding

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Ultra-precision Free-form Surface Grinding of WC Core (초경 금형의 자유 곡면 초정밀 연삭)

  • Park, Soon-Sub;Hwang, Yeon;Kim, Geon-Hee;Won, Jong-Ho
    • Journal of the Korean Society for Precision Engineering
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    • v.26 no.5
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    • pp.64-71
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    • 2009
  • Cylindrical lens core for optical transceiver was designed and machined. With the lens design data, WC asymmetric core surface data were generated for non-revolutional ultra-precision grinding. Grinding process for optimum machining conditions of target surface was studied in terms of surface roughness and form profile. We used experimental results to optimize turbine speed, feed-rate and depth of cut with durable grinding wheel wear. Ground WC cores were measured contact type profilers and verified.

The Dynamic and Machining Characteristics of Co-axial Grinding Machining System (동축 가공 연삭시스템의 운동 및 가공 특성)

  • Kim G.H.;Lee S.W.;Choi H.Z.;Choi Y.J.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.608-611
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    • 2005
  • As the optical communication industry is developed, the demand of optical communication part is increasing. $ZrO_2$ ceramic ferrule is very important part which can determines the transmission efficiency and information quality to connect the optical fibers. In general $ZrO_2$ ceramic ferrule is manufactured by grinding process because the demands precision is very high. For the precision grinding machining, it is very important that the error of feeding system is improved. Therefore, we estimated the dynamic characteristics in feeding system of ultra precision co-axial grinding machining system. Then, we performed the machining characteristics experiment.

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Prediction of Form Accuracy during Traverse Grinding of Slender Workpiece Using the Cylindrical Prunge Grinding Data (원통연삭 실험자료를 이용한 트래버스 연삭공정중의 형상예측)

  • 박철우;이상조
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.3
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    • pp.174-183
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    • 2000
  • Non-Parallelism the axial direction occurs during grinding process of long slender shafts. The reason for the axial error is due to elastic deformation of the components, accumulation phenomenon of the grinding and wheel wear during the grinding process. The accumulation phenomenon, the size generation mechanism and the wheel wear process during traverse grinding result in complicated process at each step on the wheel surface. The grinding system stiffness obtained from the stiffness of the center on the tailstock and the workpiece varing according to the relative position of the wheel and the workpiece. Further more, the value of wheel wear increases as the grinding process advances. The above mentioned issues make the shape generation process during traverse grinding quite complicated. This research analyzes the shape generation process in the direction of the work spindle. First, the formulation of the grinding system stiffness was conducted and the simulation analysis method of the traverse grinding was established. Also, a measuring system for assessing the dimensinal accuracy of the workpiece has been developed.

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Monitoring of Grinding Wheel Wear in Surface Grinding (평면 연삭에서의 연삭 숫돌 마모 모니터링)

  • 주광훈;김현수;홍성욱;박천홍
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.05a
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    • pp.613-616
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    • 2000
  • This paper deals with monitoring of grinding wheel wear in surface grinding process. A laser scanning micrometer is used to measure the circumferential shape as well as the axial shape of grinding wheel. The monitoring system is applied to two kinds of grinding methods: plunge and traverse grinding. Through experiments, it is found that measurement of grinding wheel wear reveals information of roughness of ground surface and the adequate dressing time. In addition, monitoring of grinding wheel wear makes it possible to identify abnormal grinding conditions.

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The Optimum Grinding Condition Selection of Grinding System (연삭시스템의 최적연삭가공조건)

  • Lee S.W.;Choi Y.J.;Hoe N.H.;Choi H.Z.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.563-564
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    • 2006
  • In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of water. The grinding of wafer is usually used by the infeed grinding machine. Grinding conditions are spindle speed, feed speed, rotation speed, grinding stone etc. But grinding condition selection and analysis is so difficult in grinding machine. In the intelligent grinding system based on knowledge many researchers have studied expert system, neural network, fuzzy etc. In this paper we deal grinding condition selection method, Taguchi method and Genetic Analysis.

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The Effect on the Machining Phenomenon due to the Change of the Quill Rigidity in a Side-Cut Grinding (측면 연삭가공에 있어서 퀄축강성변화가 가공현상에 미치는 현상)

  • 김창수;서영일;이종찬;정성환
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.10a
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    • pp.33-37
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    • 1995
  • A side-cut grinding generates a machining error by the decrease of the quill rigidity. In this paper, The effect on the grinding force, machining error and surface roughness due to the change of the quill rigidity is investigated experimentally. The slenderness ratio of the quill is a significant factor to analyse the change of the grinding force and machining error.

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Evaluation of Pre-estimation Model to the Inprocess Surface Roughness for Grinding Operations

  • Kim, Gun-Hoi
    • International Journal of Precision Engineering and Manufacturing
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    • v.3 no.4
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    • pp.24-30
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    • 2002
  • In grinding operations, one of the most important problems is to increase efficiency of process. In order to achieve this purpose, it is necessary to administer the tool lift of grinding wheel and to optimize grinding conditions. Frequently dressing result in lowering the process efficiency remarkably and makes production cost high. On the other hand, grinding with a worn wheel causes the workpiece surface roughness to increase and often results in the occurrence of such troubles as chatter vibration and homing.