• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.5
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• pp.122-128
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• 2013

This paper describes the on-machine surface form evaluation of an ultra-precision cylinder for the fabrication by the compensation process. In this study, the surface form error of an ultra-precision cylinder, which was fabricated by the ultra-precision diamond turning machine with a single diamond cutting tool, was evaluated by using two capacitance-type displacement probes. Based on the measurement results, the compensation process was conducted. Since the measurement was carried out on the machine without re-mounting of the workpiece, additional fabrication for compensation process can be conducted precisely.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.565-568
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• 2005

We describe a new scheme of dispersive white-light interferometer that is capable of measuring the thickness profile of thin-film layers, for which not only the top surface height profile but also the film thickness of the target surface should be measured at the same time. The interferometer is found useful particularly for in-situ inspection of micro-engineered surfaces such as liquid crystal displays, which requires for high-speed implementation of 3-D surface metrology.

• Journal of the Optical Society of Korea
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• v.20 no.1
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• pp.174-179
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• 2016

In this paper, a novel full-aperture reflective null measuring method is proposed to detect the transmission wavefront of a conformal dome surface. An aspheric compensator is designed and placed behind the dome to reflect the aspheric testing wave back to the same path. To ensure the feasibility of this method, tolerance analysis is conducted, and guidance to assembly is given accordingly. The accuracy of this method is verified to be λ/30 (λ =3.39 μm) by Monte Carlo algorithm. In addition, the influence of different error factors, including the thickness error and decenter error of the dome, on the testing wavefront is analyzed. Simulation and experiment indicate that this method is practical and simple, and can measure the conformal domes precisely and comprehensively.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.11
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• pp.99-109
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• 2004

This paper proposes precision evaluation method for the positioning error of three-DOF translational parallel mechanism. The proposed method uses conventional CMM as metrology equipment to measure the position of end-effector. In order to obtain accurate measurement data from CMM, the transform relationship between the coordinate system of the parallel mechanism and the CMM coordinate system must be identified. For this purpose, a new coordinate referencing (or coordinate system identification) technique is presented. By using this technique accurate coordinate transformation relationships are efficiently established. According to these coordinate transformation relationships, an equation to calculate error components at any arbitrary position of the end-effector is derived. In addition, mathematical fitting models to represent the position error components in the two-dimensional workspace of the parallel mechanism are also constructed based on response surface methodology. The proposed error evaluation method proves its effectiveness through the experimental results and its application to real three-DOF parallel mechanism.

• Journal of the Korean Society for Precision Engineering
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• v.34 no.2
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• pp.107-114
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• 2017

In this investigation, we describe a metrological technique for surface and thickness profiles of a silicon (Si) wafer by using a 6 degree of freedom (DOF) stitching method. Low coherence scanning interferometry employing near infrared light, partially transparent to a Si wafer, is adopted to simultaneously measure the surface and thickness profiles of the wafer. For the large field of view, a stitching method of the sub-aperture measurement is added to the measurement system; also, 6 DOF parameters, including the lateral positioning errors and the rotational error, are considered. In the experiment, surface profiles of a double-sided polished wafer with a 100 mm diameter were measured with the sub-aperture of an 18 mm diameter at $10\times10$ locations and the surface profiles of both sides were stitched with the sub-aperture maps. As a result, the nominal thickness of the wafer was $483.2{\mu}m$ and the calculated PV values of both surfaces were $16.57{\mu}m$ and $17.12{\mu}m$, respectively.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.204-207
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• 2005

We discuss two possibilities of using femtosecond pulse lasers as a new interferometric light source fer enhanced precision surface profile metrology. First, a train of ultra-fast laser pulses yields repeated low temporal coherence, which allows performing unequal-path scanning interferometry that is not feasible with white light. Second, high spatial coherence of femtosecond pulse lasers enables to test large size optics in non-symmetric configurations with relatively small size reference surfaces. These two advantages are verified experimentally using Fizeau and Twyman-Green type scanning interferometers.

• Journal of the Optical Society of Korea
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• v.10 no.1
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• pp.48-54
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• 2006

White-light scanning interferometry (WLI) and phase shifting interferometry (PSI) are increasingly used for surface topography measurements, particularly for areal measurements. In this paper, we compare surface profiling results obtained from above two optical methods with those obtained from stylus instruments. For moderately rough surfaces ($Ra{\approx}500\;nm$), roughness measurements obtained with WLI and the stylus method seem to provide close agreement on the same roughness samples. For surface roughness measurements in the 50 nm to 300 nm range of Ra, discrepancies between WLI and the stylus method are observed. In some cases the discrepancy is as large as 109% of the value obtained with the stylus method. By contrast, the PSI results are in good agreement with those of the stylus technique.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.23-24
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• 2006

We present a dispersive scheme of white-light interferometry that enables not only to perform tomographical measurements of thin-film layers but also to measure a refractive index without mechanical depth scanning. The interferometry is found useful particularly for in-situ 3-D inspection of micro-engineered surfaces such as liquid crystal displays, semi-conductor and MEMS structure, which requires for high-speed implementation of 3-D surface metrology.

• Korean Journal of Optics and Photonics
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• v.17 no.1
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• pp.47-53
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• 2006

The Integrated Ballistics Identification Systems (IBIS) is widely used for bullet and casing signature identification. The IBIS obtains a pair of ballistic signatures from two bullets (or casings) using optical microscopy, and estimates a correlation score which can represent the degree of signature match. However, this method largely depends on lighting and surface conditions because optical image contrast is primarily a function of test surface's slope, shadowing, multiple reflections, optical properties, and illumination direction. Moreover, it can be affected with surface height variation. To overcome these problems and improve the identification system, we used well known surface topographic techniques, such as confocal microscopy and white-light scanning interferometry. The measuring instruments were calibrated by a NIST step height standard and verified by a NIST sinusoidal profile roughness standard and a commercial roughness standard. We also suggest a new analysis method for the ballistic identification. In this method, the maximum cross-correlation function CCFmax is used to quantify the degree of signature match. If the compared signatures were exactly the same, CCFmax would be $100\%$.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.7 s.94
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• pp.1731-1739
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• 1993

An application of Scanning Tunneling Microscopy(STM) is investigated for the measurement of 3-dimensional profiles of the macro-machined patterns of which critical dimensions lie in the range of submicrometers. Special emphasis of this investigation is given to extending the measuring ranges of STM upto the order of several micrometers while maintaining superb nanometer measuring resolution. This is accomplished by correcting hysteresis effects of piezoelectric actuators by using non-linear compensation models. Detailed aspects of design and control of a prototype measurement system are described with some actual measuring examples in which fine It patterns can successfully be traced with a resolution of 1 nanometer over a surface range of $4{\times}2$ micrometers.