• ETRI Journal
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• v.38 no.4
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• pp.645-653
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• 2016

This paper demonstrates the performance of a metal-substrate power module with multiple fabricated chips for a high current electrical application, and evaluates the proposed module using a 1.5-kW sinusoidal brushless direct current (BLDC) motor. Specifically, the power module has a hybrid structure employing a single-layer heat-sink extensible metal board (Al board). A fabricated motor driver IC and trench gate DMOSFET (TDMOSFET) are implemented on the Al board, and the proper heat-sink size was designed under the operating conditions. The fabricated motor driver IC mainly operates as a speed controller under various load conditions, and as a multi-phase gate driver using an N-ch silicon MOSFET high-side drive scheme. A fabricated power TDMOSFET is also included in the fabricated power module for three-phase inverter operation. Using this proposed module, a BLDC motor is operated and evaluated under various pulse load tests, and our module is compared with a commercial MOSFET module in terms of the system efficiency and input current.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.914-919
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• 2000

In most case high temperature components in fossil power plant are damaged by fatigue, creep and degradation. Design of power plant components is based on ideal loading such as temperature, pressure and so on. But in many cases unexpected loadings are applied at components. A key ingredient in plant life extension is the preventive diagnosis technology and remaining-life-assessment technology. This paper describes diagnosis technology and life-assessment technology for power plant boiler. It helps in setting up proper inspection schedules, maintenance procedures, and operating procedure.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 2003.05a
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• pp.415-423
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• 2003

Korea Electric Power Research Institute(KEPRI) had worked a comprehensive Plant Lifetime Management (PLiM) project for a CANDU plant in corporation with Korea Hydro and Nuclear Power(KHNP). The project had been performed to understand the aging status of major components screened from the plant and to address provisions for the continued operation over its design life. A feasibility of the continued operation was reviewed in the aspects of technology, economics, and regulatory environments. This paper introduces general approach of aging assessment, screening of critical components and an experience of aging assessment for an example of fuel channel that is the most critical component in CANDU plant.

• ETRI Journal
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• v.33 no.4
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• pp.637-640
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• 2011

A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flip-chip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 ${\mu}m$ in one direction.

• ETRI Journal
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• v.41 no.6
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• pp.811-819
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• 2019

We propose a substrate with high thermal conductivity, manufactured by the low-temperature co-fired ceramic (LTCC) multilayer circuit process technology, as a new DC/DC converter platform for power electronics applications. We compare the reliability and power conversion efficiency of a converter using the LTCC substrate with the one using a conventional printed circuit board (PCB) substrate, to demonstrate the superior characteristics of the LTCC substrates. The power conversion efficiencies of the LTCC- and PCB-based synchronous buck converters are 95.5% and 94.5%, respectively, while those of nonsynchronous buck converters are 92.5% and 91.3%, respectively, at an output power of 100 W. To verify the reliability of the LTCC-based converter, two types of tests were conducted. Storage temperature tests were conducted at -20 ℃ and 85 ℃ for 100 h each. The variation in efficiency after the tests was less than 0.3%. A working temperature test was conducted for 60 min, and the temperature of the converter was saturated at 58.2 ℃ without a decrease in efficiency. These results demonstrate the applicability of LTCC as a substrate for power conversion systems.

• Journal of the Korean Magnetics Society
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• v.23 no.2
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• pp.68-76
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• 2013

Currently, wireless power transmission technology based on magnetic induction was employed in battery charger for smart phone application. The system consists of wireless power transmitter in base station and receiver in smart phone. Size and thickness of receiver was strictly limited in the newest smart phone. In order to achieve high efficiency of a tiny small wireless power receiver module, sub-millimeter thick electromagnetic wave shielding sheet having high permeability and Q was essential component. It was found that magnetic field from transmitter to receiver can be intensified by sufficient shielding cause to minimize leakage magnetic flux by those magnetic properties. This leads to high efficiency of wireless power transmission and protects crucial integrated circuit of main board from electromagnetic noise. The important soft magnetic materials were introduced and summarized for the current small-power wireless power charger and NFC application and mid-power home appliance and high-power automotive application in the near future.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.2
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• pp.99-104
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• 2020

In this study, we fabricated a metamorphic high-electron-mobility transistor (mHEMT) device with a T-type gate structure for the implementation of W-band monolithic microwave integrated circuits (MMICs) and investigated its characteristics. To fabricate the mHEMT device, a recess process for etching of its Schottky layer was applied before gate metal deposition, and an e-beam lithography using a triple photoresist film for the T-gate structure was employed. We measured DC and RF characteristics of the fabricated device to verify the characteristics that can be used in W-band MMIC design. The mHEMT device exhibited DC characteristics such as a drain current density of 747 mA/mm, maximum transconductance of 1.354 S/mm, and pinch-off voltage of -0.42 V. Concerning the frequency characteristics, the device showed a cutoff frequency of 215 GHz and maximum oscillation frequency of 260 GHz, which provide sufficient performance for W-band MMIC design and fabrication. In addition, active and passive modeling was performed and its accuracy was evaluated by comparing the measured results. The developed mHEMT and device models could be used for the fabrication of W-band MMICs.

• International Journal of Automotive Technology
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• v.2 no.1
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• pp.9-16
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• 2001

The lifetime of power train components can be improved dramatically by finding crack initiation points with suitable software tools and optimization of the critical areas. With increasing capacities of computers the prediction of the lifetime for components by numerical methods gets more and more important. This paper discusses some applications of the outstanding fatigue simulation program FEMFAT supporting the assessment of uniaxially and multiaxially loaded components (as well as welding seams and spot joints). The theory applied in FEMFAT differs in some aspects from classical approaches like the nominal stress concept or the local one and can be characterized by the term "influence parameter method". The specimen S/N-curve is locally modified by different influence parameters as stress-gradient to take into account notch effects, mean-stress influence which is quantified by means of a Haigh-diagram, surface roughness and treatments, temperature, technological size, etc. It is possible to consider plastic deformations resulting in mean-stress rearrangements. The dynamic loading of power train components is very often multiaxial, e.g. the stress state at each time is not proportional to one single stress state. Hence, the directions of the principal axes vary with time. We will present the way how such complex load situations can be handled with FEMFAT by the examples of a crank case and a gear box.

• ETRI Journal
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• v.31 no.6
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• pp.717-724
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• 2009

This paper describes a 1.2 V 12 b 60 MS/s CMOS analog front-end (AFE) employing low-power and flexible design techniques for image signal processing. An op-amp preset technique and programmable capacitor array scheme are used in a variable gain amplifier to reduce the power consumption with a small area of the AFE. A pipelined analog-to-digital converter with variable resolution and a clock detector provide operation flexibility with regard to resolution and speed. The AFE is fabricated in a 0.13 ${\mu}m$ CMOS process and shows a gain error of 0.68 LSB with 0.0352 dB gain steps and a differential/integral nonlinearity of 0.64/1.58 LSB. The signal-to-noise ratio of the AFE is 59.7 dB at a 60 MHz sampling frequency. The AFE occupies 1.73 $mm^2$ and dissipates 64 mW from a 1.2 V supply. Also, the performance of the proposed AFE is demonstrated by an implementation of an image signal processing platform for digital camcorders.

• ETRI Journal
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• v.31 no.6
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• pp.695-702
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• 2009

We propose a lens-drive unit composed of an ionic polymer-metal composite (IPMC) for an auto-focus compact camera module in cellular phones to solve the power consumption problem of voice coil motors which are widely used in commercial products. In this research, an IPMC incorporated into a lens-drive unit is designed to implement a large displacement in low-power consumption by using an anisotropic plasma treatment. Experimental results show that a camera module containing IPMCs can control and maintain the position of the lens by using proportional integral derivative control with a photo-reflective position sensor despite the non-linear actuation behavior of IPMCs. We demonstrate that the fabrication and commercialization of a lens actuator that has a large displacement and low power consumption using IPMCs is possible in the near future.