• Title/Summary/Keyword: Power Amplifiers

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Giga WDM-PON based on ASE Injection R-SOA (ASE 주입형 R-SOA 기반 기가급 WDM-PON 연구)

  • Shin Hong-Seok;Hyun Yoo-Jeong;Lee Kyung-Woo;Park Sung-Bum;Shin Dong-Jae;Jung Dae-Kwang;Kim Seung-Woo;Yun In-Kuk;Lee Jeong-Seok;Oh Yun-Je;Park Jin-Woo
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.43 no.5 s.347
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    • pp.35-44
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    • 2006
  • Reflective semiconductor optical amplifiers(R-SOAs) were designed with high gain, wide optical bandwidth, high thermal reliability and wide modulation bandwidth in TO-can package for the transmitter of wavelength division multiplexed-passive optical network(WDM-PON) application. Double trench structure and current block layer were introduced in designing the active layer of R-SOA to enable high speed modulation. The injection power requirement and the viable temperature range of WDM-PON system are experimentally analysed in based on Amplified Spontaneous Emission(ASE)-injected R-SOAs. The effect of the different injection spectrum in the gain-saturated R-SOA was experimentally characterized based on the measurements of excessive intensity noise, Q factor, and BER. The proposed spectral pre-composition method reduces the bandwidth of injection source below the AWG bandwidth and thereby avoids spectrum distortion impeding the intensity noise reduction originated from the amplitude squeezing.

A Dual-Channel 6b 1GS/s 0.18um CMOS ADC for Ultra Wide-Band Communication Systems (초광대역 통신시스템 응용을 위한 이중채널 6b 1GS/s 0.18um CMOS ADC)

  • Cho, Young-Jae;Yoo, Si-Wook;Kim, Young-Lok;Lee, Seung-Hoon
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.43 no.12 s.354
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    • pp.47-54
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    • 2006
  • This work proposes a dual-channel 6b 1GS/s ADC for ultra wide-band communication system applications. The proposed ADC based on a 6b interpolated flash architecture employs wide-band open-loop track-and-hold amplifiers, comparators with a wide-range differential difference pre-amplifier, latches with reduced kickback noise, on-chip CMOS references, and digital bubble-code correction circuits to optimize power, chip area, and accuracy at 1GS/s. The ADC implemented in a 0.18um 1P6M CMOS technology shows a signal-to-noise-and-distortion ratio of 30dB and a spurious-free dynamic range of 39dB at 1GS/s. The measured differential and integral non-linearities of the prototype ADC are within 1.0LSB and 1.3LSB, respectively. The dual-channel ADC has an active area of $4.0mm^2$ and consumes 594mW at 1GS/s and 1.8V.

The three dimensional measuring system for ELF magnetic fields with the multiturn loop-type sensors (멀티턴 루우프형 센서를 이용한 3차원 ELF 자장측정계)

  • Lee, Bok-Hee;Lee, Jeong-Gee;Kil, Gyung-Suk;Ahn, Chang-Hwan;Park, Dong-Hwa
    • Journal of Sensor Science and Technology
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    • v.5 no.2
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    • pp.29-36
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    • 1996
  • With the three dimensional magnetic field measuring system dealt with in this paper, accurate measurements and analyses of extremely low frequency(ELF) magnetic fields caused by starting and/or operating electric devices and power installations can be conducted. To obtain high performance for lower frequency and spatial components without any distortion, the measuring system is designed as three dimensionally including the multiturn loop-type magnetic field sensors, differential amplifiers and active integrators. As the results of calibration experiments, the frequency response characteristics of the measuring system range from 8[Hz] to about 53[kHz] for each direction of x, y, z axes, and the response sensitivities are 9.54, 9.21, $10.89[mV/{\mu}T]$, respectively. The actual survey experiments by using an oscillating impulse current generator confirm a reliability of the proposed measuring system. Also, through the other experiments by using small-sized induction motors, the magnetic field intensities when starting and steady-state operating mark 15.8, $8.61[{\mu}T]$ as maximum value, respectively. And those intensities decrease steeply according as the measuring distance increases.

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10Gb/s CMOS Transimpedance Amplifier Designs for Optical Communications (광통신용 10Gb/s CMOS 전치증폭기 설계)

  • Sim, Su-Jeong;Park, Sung-Min
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.43 no.10 s.352
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    • pp.1-9
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    • 2006
  • In this paper, a couple of 10Gb/s transimpedance amplifiers are realized in a 0.18um standard CMOS technology for optical communication applications. First, the voltage-mode inverter TIA(I-TIA) exploits inverter input configuration to achieve larger effective gm, thus reducing the input impedance and increasing the bandwidth. I-TIA demonstrates $56dB{\Omega}$ transimpedance gain, 14GHz bandwidth for 0.25pF photodiode capacitance, and -16.5dBm optical sensitivity for 0.5A/W responsivity, 9dB extinction ration and $10^{-12}$ BER. However, both its inherent parasitic capacitance and the package parasitics deteriorate the bandwidth significantly, thus mandating very judicious circuit design. Meanwhile, the current-mode RGC TIA incorporates the regulated cascade input configuration, and thus isolates the large input parasitic capacitance from the bandwidth determination more effectively than the voltage-mode TIA. Also, the parasitic components give much less impact on its bandwidth. RGC TIA provides $60dB{\Omega}$ transimpedance gain, 10GHz bandwidth for 0.25pF photodiode capacitance, and -15.7dBm optical sensitivity for 0.5A/W responsivity, 9dB extinction ration and $10^{-12}$ BER. Main drawback is the power dissipation which is 4.5 times larger than the I-TIA.

A 4-bit optical true time-delay for phased array antennas using 2×2 optical MEMS switches and fiber-optic delay lines (2×2 광 MEMS 스위치와 광섬유 지연선로를 이용한 위상배열 안테나용 4-비트 광 실시간 지연선로)

  • 정병민;윤영민;신종덕;김부균
    • Korean Journal of Optics and Photonics
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    • v.15 no.4
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    • pp.385-390
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    • 2004
  • In this paper, we designed a 4-bit optical true time-delay(TTD) for phased array antennas(PAAs), which is composed of a wavelength-fixed optical source, 2 ${\times}$ 2 optical MEMS switches, and fiber-optic delay lines. A 4-bit TTD with a unit time delay difference of 6 ps for 10-GHz PAAs has been implemented. Measurement results on time delay show an error of -0.4 ps at maximum, corresponding to a radiation angle error of less than 1.63$^{\circ}$. Thus, the TTD implemented in this research performs in excellent agreement with theory. Each TTD line, composed of MEMS switches and fiber-optic delay lines, connected to the corresponding antenna element has insertion loss in between 1.36 ㏈ and 2.40 ㏈ depending upon the setup of the switches. On the other hand, the insertion loss difference between TTD lines was 0.32 ㏈ at maximum for a fixed radiation angle. The TTD structure proposed in this paper might be more reliable and economical than those previously proposed using tunable wavelength sources if proper power equalization either with gain control of RF amplifiers or variable attenuators is achieved.

Development of Surface Myoelectric Sensor for Myoelectric Hand Prosthesis (근전의수용 소형 표면 근전위 센서의 개발)

  • Choi, Gi-Won;Sung, So-Young;Moon, Inhyuk
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.42 no.6
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    • pp.67-76
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    • 2005
  • This paper proposes a compact-sized surface myoelectric sensor for the myoelectric hand prosthesis. To fit the surface myoelectric sensor in the socket for the myoelectric hand prosthesis, the sensor should be a compact size. The surface myoelectric sensor is. composed of a skin interface and a single processing circuit that are mounted on a single package. The skin interface has one reference and two input electrodes, and the reference electrode is located in the center of two input electrodes. In this paper we propose two types of sensors with the circle- and bar-shaped reference electrode, but all input electrodes are the bar-shaped. The metal material of the electrodes is the stainless steel (SUS440) that endures sweat and wet conditions. Considering the conduction velocity and the median frequency of the myoelectric signal, we select the inter-electrode distance (IED) between two input electrodes as 18mm, 20mm, and 22 mm. The signal processing circuit consists of a differential amplifier with a band pass filter, a band rejection filter for rejecting 60Hz power-line noise, amplifiers, and a mean absolute value circuit. We evaluate the proposed sensor from the output characteristics according to the IED and the shape of the reference electrode. From the experimental results we show the surface myoelectric sensor with the 18mm IED and the bar-shaped reference electrode is suitable for the myoelectric hand prosthesis.

A 0.31pJ/conv-step 13b 100MS/s 0.13um CMOS ADC for 3G Communication Systems (3G 통신 시스템 응용을 위한 0.31pJ/conv-step의 13비트 100MS/s 0.13um CMOS A/D 변환기)

  • Lee, Dong-Suk;Lee, Myung-Hwan;Kwon, Yi-Gi;Lee, Seung-Hoon
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.46 no.3
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    • pp.75-85
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    • 2009
  • This work proposes a 13b 100MS/s 0.13um CMOS ADC for 3G communication systems such as two-carrier W-CDMA applications simultaneously requiring high resolution, low power, and small size at high speed. The proposed ADC employs a four-step pipeline architecture to optimize power consumption and chip area at the target resolution and sampling rate. Area-efficient high-speed high-resolution gate-bootstrapping circuits are implemented at the sampling switches of the input SHA to maintain signal linearity over the Nyquist rate even at a 1.0V supply operation. The cascode compensation technique on a low-impedance path implemented in the two-stage amplifiers of the SHA and MDAC simultaneously achieves the required operation speed and phase margin with more reduced power consumption than the Miller compensation technique. Low-glitch dynamic latches in sub-ranging flash ADCs reduce kickback-noise referred to the differential input stage of the comparator by isolating the input stage from output nodes to improve system accuracy. The proposed low-noise current and voltage references based on triple negative T.C. circuits are employed on chip with optional off-chip reference voltages. The prototype ADC in a 0.13um 1P8M CMOS technology demonstrates the measured DNL and INL within 0.70LSB and 1.79LSB, respectively. The ADC shows a maximum SNDR of 64.5dB and a maximum SFDR of 78.0dB at 100MS/s, respectively. The ABC with an active die area of $1.22mm^2$ consumes 42.0mW at 100MS/s and a 1.2V supply, corresponding to a FOM of 0.31pJ/conv-step.

A 1.1V 12b 100MS/s 0.43㎟ ADC based on a low-voltage gain-boosting amplifier in a 45nm CMOS technology (45nm CMOS 공정기술에 최적화된 저전압용 이득-부스팅 증폭기 기반의 1.1V 12b 100MS/s 0.43㎟ ADC)

  • An, Tai-Ji;Park, Jun-Sang;Roh, Ji-Hyun;Lee, Mun-Kyo;Nah, Sun-Phil;Lee, Seung-Hoon
    • Journal of the Institute of Electronics and Information Engineers
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    • v.50 no.7
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    • pp.122-130
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    • 2013
  • This work proposes a 12b 100MS/s 45nm CMOS four-step pipeline ADC for high-speed digital communication systems requiring high resolution, low power, and small size. The input SHA employs a gate-bootstrapping circuit to sample wide-band input signals with an accuracy of 12 bits or more. The input SHA and MDACs adopt two-stage op-amps with a gain-boosting technique to achieve the required DC gain and high signal swing range. In addition, cascode and Miller frequency-compensation techniques are selectively used for wide bandwidth and stable signal settling. The cascode current mirror minimizes current mismatch by channel length modulation and supply variation. The finger width of current mirrors and amplifiers is laid out in the same size to reduce device mismatch. The proposed supply- and temperature-insensitive current and voltage references are implemented on chip with optional off-chip reference voltages for various system applications. The prototype ADC in a 45nm CMOS demonstrates the measured DNL and INL within 0.88LSB and 1.46LSB, respectively. The ADC shows a maximum SNDR of 61.0dB and a maximum SFDR of 74.9dB at 100MS/s, respectively. The ADC with an active die area of $0.43mm^2$ consumes 29.8mW at 100MS/s and a 1.1V supply.

An Area-Efficient Time-Shared 10b DAC for AMOLED Column Driver IC Applications (AMOLED 컬럼 구동회로 응용을 위한 시분할 기법 기반의 면적 효율적인 10b DAC)

  • Kim, Won-Kang;An, Tai-Ji;Lee, Seung-Hoon
    • Journal of the Institute of Electronics and Information Engineers
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    • v.53 no.5
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    • pp.87-97
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    • 2016
  • This work proposes a time-shared 10b DAC based on a two-step resistor string to minimize the effective area of a DAC channel for driving each AMOLED display column. The proposed DAC shows a lower effective DAC area per unit column driver and a faster conversion speed than the conventional DACs by employing a time-shared DEMUX and a ROM-based two-step decoder of 6b and 4b in the first and second resistor string. In the second-stage 4b floating resistor string, a simple current source rather than a unity-gain buffer decreases the loading effect and chip area of a DAC channel and eliminates offset mismatch between channels caused by buffer amplifiers. The proposed 1-to-24 DEMUX enables a single DAC channel to drive 24 columns sequentially with a single-phase clock and a 5b binary counter. A 0.9pF sampling capacitor and a small-sized source follower in the input stage of each column-driving buffer amplifier decrease the effect due to channel charge injection and improve the output settling accuracy of the buffer amplifier while using the top-plate sampling scheme in the proposed DAC. The proposed DAC in a $0.18{\mu}m$ CMOS shows a signal settling time of 62.5ns during code transitions from '$000_{16}$' to '$3FF_{16}$'. The prototype DAC occupies a unit channel area of $0.058mm^2$ and an effective unit channel area of $0.002mm^2$ while consuming 6.08mW with analog and digital power supplies of 3.3V and 1.8V, respectively.