• Journal of the Semiconductor & Display Technology
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• v.16 no.2
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• pp.55-60
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• 2017

The supercritical $CO_2$ (sc-$CO_2$) mixture and the sc-$CO_2$-based Photoresist(PR) stripping(SCPS) process were applied to the removal of the post etch/ash PR residue on aluminum patterned wafers and the results were observed by scanning of electron microscope(SEM). In the case of MDII wafers, the carbonized PR was able to be effectively removed without pre-stripping by oxygen plasma ashing by using sc-$CO_2$ mixture containing the optimum formulated additives at the proper pressure and temperature, and the same result was also able to be obtained in the case of HDII wafer. It was found that the efficiency of SCPS of ion implanted wafer improved as the temperature of SCPS was high, so a very large amount of MEA in the sc-$CO_2$ mixture could be reduced if the temperature could be increased at condition that a process permits, and the ion implanted photoresist(IIP) on the wafer was able to be removed completely without pre-treatment of plasma ashing by using the only 1 step SCPS process. By using SCPS process, PR polymers formed on sidewalls of metal conductive layers such as aluminum films, titanium and titanium nitride films by dry etching and ashing processes were removed effectively with the minimization of the corrosion of the metal conductive layers.

• International Journal of Computer Science & Network Security
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• v.22 no.10
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• pp.37-42
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• 2022

Communication as a process of interpreting signs has always existed in people's life. In post-information society, the communication between a person and a technological system through the specific sign-attaching process becomes widespread. Moreover, it somehow replaces usual communication between people. One of the means of communication in the digital space are video games. They not only play an important role in communication processes, but also are a special case of sign-creating and interpreting. The purpose of the article is to examine video games as a space of sign-based communication between a person and a game as a specific digital system. With the help of general scientific and hermeneutic methodology, the analysis of video games as a post-information society phenomenon which people communicate to has been conducted. The process of semiosis as attaching special meanings to signs has been traced in both manipulating in-game objects and characters and understanding rules of an in-game world.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.10
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• pp.1023-1028
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• 2009

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the chemical mechanical cleaning(CMC) is performed various conditions as a cleaning process. The CMC process combined mechanical cleaning by friction between a wafer and a pad and chemical cleaning by CMC solution consists of tetramethyl ammonium hydroxide (TMAH) / benzotriazole (BTA). This paper studies the removal of abrasive on the Cu wafer and the cleaning efficiency of CMC process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• The Journal of the Korea Contents Association
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• v.22 no.1
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• pp.535-544
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• 2022

This study identified the relationship between deliberate rumination of adults who experienced traumas and post-traumatic growth, and examined the mediating model of meaning of life moderated by trauma intensity on deliberate rumination and post-traumatic growth. Participants were 318 male and female adults who experienced traumas. The moderated mediating effect was analysed with PROCESS Macro 3.5 Model 7. Results revealed that deliberate rumination of adults who experienced traumas was positively correlated with trauma intensity, meaning of life, and post-traumatic growth, while meaning of life was positively correlated with post-traumatic growth. In a moderated mediating model for post-traumatic growth, there was significant interaction effect of deliberate rumination and trauma intensity; conditionally indirect effect of deliberate rumination was only significant for whose trauma intensity were high. These findings suggest that adults who did deliberate rumination are more likely to experience post-traumatic growth with finding meaning of life. And, the moderating effect suggests that this influence is only with higher levels of trauma intensity. In conclusion, deliberate rumination of severe traumatic event may lead to post-traumatic growth, and it can be helpful to experience the meaning of life in the process.

• The Korean Journal of Physiology and Pharmacology
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• v.14 no.5
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• pp.291-297
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• 2010

The sleep homeostatic response significantly affects the state of anesthesia. In addition, sleep recovery may occur during anesthesia, either via a natural sleep-like process to occur or via a direct restorative effect. Little is known about the effects of isoflurane anesthesia on sleep homeostasis. We investigated whether 1) isoflurane anesthesia could provide a sleep-like process, and 2) the depth of anesthesia could differently affect the post-anesthesia sleep response. Nine rats were treated for 2 hours with $ad$ $libitum$ sleep (Control), sleep deprivation (SD), and isoflurane anesthesia with delta-wave- predominant state (ISO-1) or burst suppression pattern-predominant state (ISO-2) with at least a 1-week interval. Electroencephalogram and electromyogram were recorded and sleep-wake architecture was evaluated for 4 hours after each treatment. In the post-treatment period, the duration of transition to slow-wave-sleep decreased but slow wave sleep (SWS) increased in the SD group, but no sleep stages were significantly changed in ISO-1 and ISO-2 groups compared to Control. Different levels of anesthesia did not significantly affect the post-anesthesia sleep responses, but the deep level of anesthesia significantly delayed the latency to sleep compared to Control. The present results indicate that a natural sleep-like process likely occurs during isoflurane anesthesia and that the post-anesthesia sleep response occurs irrespective to the level of anesthesia.

• Journal of Ginseng Research
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• v.28 no.1
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• pp.18-26
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• 2004

The effect of Panax ginseng administration in muscle inflammatory process induced after eccentric exercise, that causes myofibrillar disruption, was studied. Changes in lipid peroxidation, inflammation, glycogen levels in muscle and release of myocellular proteins to blood were measured. The analyses were performed immediately after eccentric exercise and over week since this period are necessary for the muscle damage-repair cycle. The ginseng extract (100 mg kg$^{-1}$ ) was orally administered to rats for three months, before the eccentric exercise performance. The results showed the protective role of ginseng against skeletal muscle damage. This effect could be associated with their membrane stabilising capacity since creatine kinase (CK) activity was significantly decreased 96 h post-exercise from 523$\pm$70 to 381$\pm$53 and 120 h post-exercise from 443$\pm$85 to 327$\pm$75 in treated animals. $\beta$-glucuronidase activity, as indicator of inflammation, showed a significant reduction of about 15-25% in soleus, vastus and triceps in these post-exercise times. The lipid peroxidation, measured by malondyaldehyde levels, was significantly decreased in the 24 h post-exercise period in soleus and vastus intermedius muscles and on the recovery period. Finally ginseng administration reduced significantly the decrease of the glycogen levels immediately after exercise and when the regenerative process took place (72-168 h post exercise). Collectively, the results have showed that ginseng did not inhibit the vital inflammatory response process associated with the muscle damage-repair cycle but presumably ameliorate the injury.

• Proceedings of the KSME Conference
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• 2001.06c
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• pp.621-626
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• 2001

Microcellular foaming process was developed at MIT in 1980's to save a quantity of raw materials and improve mechanical properties. There are many process variables in appling microcellular foaming process to the conventional injection molding process. Of all process variables, part dimension control and shrinkage are the most influential on the post molded dimension. The post molding dimensional change of thermoplastic resins is important to tool designers for predicting the specific difference of molded part vs. actual mold cavity. Generally, articles injection molded are smaller in size than the cavity; hence, the term shrinkage factor is used to define the allowance a designer specifies. It is important to consider the factors that influence molded part dimension. According to ASTM Designation: D 955, shrinkage from mold dimensions of molded plastics was measured. In injection molding, the difference between the dimensions of the mold and of the molded article produced therein from a given material may vary according to the design and operation of the mold. In this paper, shrinkage data of molded plastic parts was obtained. It can be an important information for designing optimum mold system in a microcellular foaming injection molding process.

• Journal of Korean Society of Steel Construction
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• v.12 no.5 s.48
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• pp.549-558
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• 2000

In strengthening structure, the external post-tensioning method which secure clearness in the structure analysis process is adopted to bridges as well as architecture structure. In this study, to investigate the behavior of composite beam in the process of post-tensioning, the amount of prestress force loss, the amount of prestressed compression stress at the lower flange and the behavior of lower flange connected with anchorage are analyzed by comparing the results of finite element analysis with the measured results of installed strain gauges. After finishing the post-tensioning, the strengthening effect of external post-tensioning method is analyzed by static loading test. It is also investigated that the strengthening effect of shear section in the harped external post-tensioning specimens.