• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• 한국재료학회지
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• 제26권3호
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• pp.109-116
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• 2016

To achieve the fabrication of high-quality Ag-coated Cu particles through a wet chemical process, we reported herein pretreatment conditions using an ammonium-based mixed solvent for the removal of a $Cu_2O$ layer on Cu particles that were oxidized in air for 1 hr at $200^{\circ}C$ or for 3 days at room temperature. Furthermore, we discussed the results of post-Ag plating with respect to removal level of the oxide layer. X-ray diffraction results revealed that the removal rate of the oxide layer is directly proportional to the concentration of the pretreatment solvent. With the results of Auger electron spectroscopy using oxidized Cu plates, the concentrations required to completely remove 50-nm-thick and 2-nm-thick oxides within 5 min were determined to be X2.5 and X0.13. However, the optimal concentrations in an actual Ag plating process using Cu powder increased to X0.4 and X0.5, respectively, because the oxidation in powder may be accelerated and the complete removal of oxide should be tuned to the thickest oxide layer among all the particles. Back-scattered electron images showed the formation of pure fine Ag particles instead of a uniform and smooth Ag coating in the Ag plating performed after incomplete removal of the oxide layer, indicating that the remaining oxide layer obstructs heterogeneous nucleation and plating by reduced Ag atoms.

• 한국응용과학기술학회지
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• 제22권3호
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• pp.250-256
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• 2005

This study was aimed to investigate treatment feasibility of leachate from D landfill that is located in gyr대ungbuk. From the analytical results of leachate, organic and nonbiodegradable matters were contained in high concentration. Thus chemical treatment was introduced to degrade nonbiodegradable matters in pre or post biological process. Two types of Fenton oxidation were adapted in this study. The first one is pre treatment process before biological treatment. The second one is post treatment process after biological treatment. The optimal conditions of both treatment methods were investigated as follows. In case of pre treatment process, the optimal conditions appeared in $Fe^{+2}/H_2O_2$(mmol/mmol): 0.1, $H_2O_2/CODcr$(mg/mg): 27.0, pH: 3 and reaction time: 2hrs. On the other hand, in case of post treatment process, the optimal conditions appeared in $Fe^{2+}$(mmol/mmol): 0.14, $H_2O_2/COD_{cr}$(mg/mg): 57.4, pH: 3 and reaction time: 1.25hrs. In the above optimal conditions, high COD removal was obtained in pre and post treatment process. Also it can expect that Fenton oxidation converted nonbiodegradable matters into biodegradable matters.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.773-776
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• 2009

In this paper, new concept of the diesel fuel processing is introduced for the stable operation of solid oxide fuel cells (SOFCs). Heavier hydrocarbons than $CH_4$, such as ethylene, ethane, propane, and etc., induce the carbon deposition on anode of SOFCs. In the reformate of heavy hydrocarbons (diesel, gasoline, kerosene, and JP-8), concentration of ethylene is usually higher than low hydrocarbons such as ethane, propane, and butane. So, removal of low hydrocarbons (over C1-hydrocarbons), especially ethylene, at the reformate gases is important for stable operation of SOFCs. New methodology as named "post-reformer" is introduced for removing the low hydrocarbons at the reformate gas stream. Catalyst of the NECS-PR4 is selected for post-reforming catalyst because the catalyst of NECS-PR4 shows the high selectivity for removing low hydrocarbons and achieving the high reforming efficiency. The diesel reformer and post-reformer are continuously operated for about 200 hours as integrated mode. The reforming performance is not degraded and low hydrocarbons in the diesel reformate are completely removed.

• 약학회지
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• 제40권3호
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• pp.347-350
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• 1996

The post-antibiotic effect (PAE), which is defined as the period of time lag that the target organisms resume normal growth rate after complete removal of the antibiotics, of LB 20304 and ciprofloxacin was evaluated against Staphylococcus aureus 6538p and Escherichia coli 3190Y, respectively. The PAE was estimated by adding each antibiotic to a log phase of growth and incubating at $37^{\circ}$C for 1 h.Antibiotic was removed by centrifugation, and total viable cell counts were determined hourly for a further 10 h. The PAEs of LB20304 against S. aureus at concentrations of $1{\times}MIC\;and\;2{\mu}g/ml$ were 10 min and 93min, respectively. LB20304 showed a comparable PAE to ciprofloxacin. Against E. coli, the PAE of LB20304 was also similar to that of ciprofloxacin at concentration of $4{\times}MIC$ but it was much longer than that of ciprofloxacin at concentration of 2${\mu}g/ml$. LB20304 showed higher lethality than ciprofloxacin against both S. aureus and E. coli strains.

• 한국수자원학회:학술대회논문집
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• 한국수자원학회 2018년도 학술발표회
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• pp.150-150
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• 2018

The Numerical Weather Prediction (NWP) models provide information for weather forecasts. The highly nonlinear and complex interactions in the atmosphere are simplified in meteorological models through approximations and parameterization. Therefore, the simplifications may lead to biases and errors in model results. Although the models have improved over time, the biased outputs of these models are still a matter of concern in meteorological and hydrological studies. Thus, bias removal is an essential step prior to using outputs of atmospheric models. The main idea of statistical bias correction methods is to develop a statistical relationship between modeled and observed variables over the same historical period. The Model Output Statistics (MOS) would be desirable to better match the real time forecast data with observation records. Statistical post-processing methods relate model outputs to the observed values at the sites of interest. In this study three methods are used to remove the possible biases of the real-time outputs of the Weather Research and Forecast (WRF) model in Imjin basin (North and South Korea). The post-processing techniques include the Linear Regression (LR), Linear Scaling (LS) and Power Scaling (PS) methods. The MOS techniques used in this study include three main steps: preprocessing of the historical data in training set, development of the equations, and application of the equations for the validation set. The expected results show the accuracy improvement of the real-time forecast data before and after bias correction. The comparison of the different methods will clarify the best method for the purpose of the forecast skill enhancement in a real-time case study.

• 대한환경공학회지
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• 제34권2호
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• pp.73-78
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• 2012

낙동강 원수와 급속 사여과 처리수중에 함유된 인공 사향물질(Synthetic Musk Compounds, SMCs) 3종에 대해 오존처리 공정에서의 제거특성을 살펴본 결과, Musk Ketone (MK)이 AHTN (7-acetyl-1,1,3,4,4,6-hexamethyl-1,2,3,4-tetrahydronaphthalene)과 HHCB (1,3,4,6,7,8-hexahydro-4,6,6,7,8,8-hexamethylcyclopenta[c]-2-benzopyran)에 비해 오존처리에 의한 제거율이 낮게 나타났다. 그리고 동일한 운전조건에서 원수에 함유된 SMCs의 제거율은 원수 중에 함유된 오존 소모물질들에 의한 영향으로 급속 사여과처리수에 함유된 경우보다 제거율이 훨씬 낮았다. 오존 투입농도 0.5~10.0 mg/L에서 낙동강 원수와 급속 사여과 처리수 중에 함유된 3종의 SMCs에 대한 제거 속도상수(k)는 오존 투입농도가 증가할수록 급격히 증가하는 경향을 나타내었고, 반감기 역시 오존 투입농도 증가에 비례하여 급격히 감소하였다. 전/후오존 공정이 갖추어진 낙동강 하류에 위치한 정수장들의 경우, 전오존 공정은 최대 1.5~2.0 mg/L의 오존 투입농도로 2~4분 및 후오존 공정은 최대 2.0~2.5 mg/L의 오존 투입농도로 6~8분 정도의 체류시간을 가지도록 설계되어져 있어 비교적 고농도의 SMCs가 유입될 경우에는 오존처리만으로는 이들 물질들에 대한 제어가 어려운 것으로 나타났다.

• 상하수도학회지
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• 제20권1호
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• pp.115-121
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• 2006

The purpose of this study was to investigate applicability of pretreatment on the existing biological treatment for domestic wastewater reclamation. From Jar Tests, it was found that optimum dosage of coagulant was PAC 0.5mg/L and $FeCl_3$ 180mg/L for urban sewage. In this study, PAC 0.5mg/L was selected considering sludge production and the amount of coagulant required. In a continuous experiment performed with combining chemical coagulation and biological treatment, a considerable removal efficency was obtained in term of BOD, SS, T-N, T-P and ABS. When the raw sewage was supplied into the pre-chamical treatment facility, the removal of BOD and SS was 48.3% and 81.1%. However T-N removal was very low which means T-N consists of $NH_3-N$ mostly. T-P was almost completely recluced by the chemical addition. The effluent BOD & SS was 57~76 and 21~43mg/L, which could reduce the size of biological treatment facility. From the cost estimation pre-chemical treatment could save around half of the area required for biological treatment with post ceagulation.

• Journal of Multimedia Information System
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• 제7권3호
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• pp.231-238
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• 2020

This work presents a fully analog baseline wander tracking and removal circuitry using high-pass filter (HPF) based R-peak detection and quadratic interpolation that does not require digital post processing, thus suitable for compact and low power long-term ECG monitoring devices. The proposed method can effectively track and remove baseline wander in ECG waveforms corrupted by various motion artifacts, whereas minimizing the loss of essential features including the QRS-Complex. The key component for tracking the baseline wander is down sampling the moving average of the corrupted ECG waveform followed by quadratic interpolation, where the R-peak samples that distort the baseline tracking are excluded from the moving average by using a HPF based approach. The proposed circuit is designed using CMOS 0.18-㎛ technology (1.8V supply) with power consumption of 19.1 ㎼ and estimated area of 15.5 ㎟ using a 4^th order HPF and quadratic interpolation. Results show SNR improvement of 10 dB after removing the baseline wander from the corrupted ECG waveform.