• Title/Summary/Keyword: Post removal

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Effect of Mulberry Leaf Tea for the Removal on Cd and Pb in drinking water (뽕잎차에 의한 음용수중 Cd과 Pb의 제거효과)

  • 김현복;이완주
    • Journal of Sericultural and Entomological Science
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    • v.40 no.1
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    • pp.17-22
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    • 1998
  • To investigate the detoxificative effect of tea, five kinds of tea(mulberry, anaerobic treated mulberry, green, barly tea and corm tea) were selected and determined their dotoxication activities for Cd and Pb in drinking water. The effect of tea on the removal of Cd and Pb were increased proportionally to the contents of teas. Anaerobic treated mulberry leaf tea showed stronger detoxication activity than the others. In drinking water contaminated with Cd, the removal effect of Cd was high 27% by anaerobic treated mulberry leaf tea and 14% by mulberry leaf tea as compared to green tea. Also, in drinking water with Pb, the removal effect of anaerobic treated mulberry leaf tea was the best among five kinds of tea. Pretreatment method on the removal effect of Cd was better than post-treatment method in the treatment method.

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Rapid in vitro Germination of Zygotic Embryos via Endosperm Removal in Eleutherococcus senticosus

  • You Xiang-Ling;Choi Yong-Eui;Yi Jae-Seon
    • Journal of Plant Biotechnology
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    • v.7 no.1
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    • pp.75-80
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    • 2005
  • Eleutherococcus senticosus (also called Acanthopanax senticosus), belonging to Araliaceae family, has been used as an important medicinal woody plant. Mature seeds of Eleutherococcus senticosus have rudimentary (extremely immature) zygotic embryos and require a long-term stratification for about 18 months to induce germination. Here, through the methods of endosperm removal and other exogenous treatments, we investigated the factors for inducing rudimentary embryos by in vitro culture, Rudimentary zygotic embryos in seeds were at globular to heart-shaped stage at about $250{\mu}m$ in length just after harvest of fruits. When the seeds without testa were cultured on 1/2 MS (Murashige and Skoog 1962) medium, they did not germinate regardless of medium and sucrose concentrations but the removal of endosperm tissue markedly stimulated the growth of rudimentary zygotic embryos. The embryo reached ear-lier maturation, once when the endosperm surrounding the rudimentary embryos was removed. Rudimentary zygotic embryos developed cotyledons within 3 weeks of culture after endosperm emoval. However, post-mature zygotic embryos failed to germinate though they were morphologically normal, indicating another dormancy of embryos. $GA_3\;(2.0\;\cal{mg/L})$ and/or charcoal ($0.2\%$) treatment rapidly enhanced the germination of zygotic embryos. These results suggest that E. senticosus seeds have double dormancy; i. e. morphological rudimentary dormancy influenced by surrounding endosperm and physiological dormancy after post-maturation of zygotic embryos. Based on the above findings, we established the rapid germination of rudimentary zygotic embryos by in vitro culture of excised seeds with endosperm removal and $GA_3$ treatment.

Effect of Chemical Mechanical Cleaning(CMC) on Particle Removal in Post-Cu CMP Cleaning (구리 CMP 후 연마입자 제거에 화학 기계적 세정의 효과)

  • Kim, Young-Min;Cho, Han-Chul;Jeong, Hae-Do
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.10
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    • pp.1023-1028
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    • 2009
  • Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the chemical mechanical cleaning(CMC) is performed various conditions as a cleaning process. The CMC process combined mechanical cleaning by friction between a wafer and a pad and chemical cleaning by CMC solution consists of tetramethyl ammonium hydroxide (TMAH) / benzotriazole (BTA). This paper studies the removal of abrasive on the Cu wafer and the cleaning efficiency of CMC process.

Study of T Type Waveguide in Single Wafer Megasonic Cleaning for Post CMP (T형의 waveguide를 이용한 Post CMP용 메가소닉 세정장치에 대한 연구)

  • Kim, Tae-Gon;Lee, Yang-Lae;Lim, Eui-Su;Kang, Kook-Jin;Kim, Hyun-Se;Park, Jin-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.11a
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    • pp.364-365
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    • 2006
  • Transverse some wave was generated by T type waveguide for single wafer cleaning application T type megasonic waveguide was analyzed by acoustic pressure measurements and particle removal efficiency. Compared to conventional longitudinal waves, not like longitudinal waves, transverse waves showed changes of direction and phase which increased the cleaning efficiency.

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Effect of chemical in post Ru CMP Cleaning solutions on abrasive particle adhesion and removal (Post Ru CMP Cleaning에서 연마입자의 흡착과 제거에 대한 chemical의 첨가제에 따른 영향)

  • Kim, In-Kwon;Kim, Tae-Gon;Cho, Byung-Gwun;Son, Il-Ryong;Park, Jin-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.529-529
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    • 2007
  • Ruthenium (Ru) is a white metal and belongs to platinum group which is very stable chemically and has a high work function. It has been widely studied to apply Ru as an electrode material in memory devices and a Cu diffusion barrier metal for Cu interconnection due to good electrical conductivity and adhesion property to Cu layer. To planarize deposited Ru layer, chemical mechanical planarization(CMP) was suggested. However, abrasive particle can induce particle contamination on the Ru layer surface during CMP process. In this study, zeta potentials of Ru and interaction force of alumina particles with Ru substrate were measured as a function of pH. The etch rate and oxidation behavior were measured as a function of chemical concentration of several organic acids and other acidic and alkaline chemicals. PRE (particle removal efficiency) was also evaluated in cleaning chemical.

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Recent Progress on Adsorptive Removal of Cd(II), Hg(II), and Pb(II) Ions by Post-synthetically Modified Metal-organic Frameworks and Chemically Modified Activated Carbons

  • Rallapalli, Phani Brahma Somayajulu;Choi, Suk Soon;Ha, Jeong Hyub
    • Applied Chemistry for Engineering
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    • v.33 no.2
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    • pp.133-144
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    • 2022
  • Fast-paced industrial and agricultural development generates large quantities of hazardous heavy metals (HMs), which are extremely damaging to individuals and the environment. Research in both academia and industry has been spurred by the need for HMs to be removed from water bodies. Advanced materials are being developed to replace existing water purification technologies or to introduce cutting-edge solutions that solve challenges such as cost efficacy, easy production, diverse metal removal, and regenerability. Water treatment industries are increasingly interested in activated carbon because of its high adsorption capacity for HMs adsorption. Furthermore, because of its huge surface area, abundant functional groups on surface, and optimal pore diameter, the modified activated carbon has the potential to be used as an efficient adsorbent. Metal-organic frameworks (MOFs), a novel organic-inorganic hybrid porous materials, sparked an interest in the elimination of HMs via adsorption. This is due to the their highly porous nature, large surface area, abundance of exposed adsorptive sites, and post-synthetic modification (PSM) ability. This review introduces PSM methods for MOFs, chemical modification of activated carbons (ACs), and current advancements in the elimination of Pb2+, Hg2+, and Cd2+ ions from water using modified MOFs and ACs via adsorption.

Effect of PVA Brush Contamination on Post-CMP Cleaning Performance (Post-CMP Cleaning에서 PVA 브러시 오염이 세정 효율에 미치는 영향)

  • Cho, Han-Chul;Yuh, Min-Jong;Kim, Suk-Joo;Jeong, Hae-Do
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.2
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    • pp.114-118
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    • 2009
  • PVA (polyvinyl alcohol) brush cleaning method is a typical cleaning method for semiconductor cleaning process especially post-CMP cleaning. PVA brush contacts with the wafer surface and abrasive particle, generating the contact rotational torque of the brush, which is the removal mechanism. The brush rotational torque can overcome theoretically the adhesion force generated between the abrasive particle and wafer by zeta potential. However, after CMP (chemical mechanical polishing) process, many particles remained on the wafer because the brush was contaminated in previous post-CMP cleaning step. The abrasive particle on the brush redeposits to the wafer. The level of the brush contamination increased according to the cleaning run time. After cleaning the brush, the level of wafer contamination dramatically decreased. Therefore, the brush cleanliness effect on the cleaning performance and it is important for the brush to be maintained clearly.

Removal of boron in seawater by activated carbon adsoprtion (활성탄 흡착에 의한 해수중의 보론 제거)

  • Kim, Han-Seung;Kang, Joon-Seok;Kim, Byung-Ro
    • Journal of Korean Society of Water and Wastewater
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    • v.25 no.6
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    • pp.917-922
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    • 2011
  • Adsorption characteristics of boron on activated carbon was investigated in order to evaluate the use of activated carbon for the removal of boron in desalination processes using SWRO. Boron was removed ranging from 54~60% when the concentration of activated carbon was 1,000 mg/L in 6 hours under the initial boron concentration of 5 mg/L. The removal of boron increased by 20~22% with the increase of pH from 5 to 9. Organic matter had adverse effect on the adsorption of boron on activated carbon. Boron removal decreased by 10-12% when EDTA was added at 1 mg/L under 5 mg/L of boron and 200mg/L of activated carbon. In this results, activated carbon would be a good candidate for a pretreatment of desalination processes by SWRO from the view of mitigating the feed boron concentration to RO and meeting the effluent boron concentration without post-treatment after RO.