• The Journal of Advanced Prosthodontics
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• 제1권1호
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• pp.1-5
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• 2009

STATEMENT OF PROBLEM. Poor wettability of denture relining materials may lead to retention problems and patient discomfort. PURPOSE. Purpose of this study is to compare and evaluate wettability of nine denture relining materials using contact angle measurements under air and water storage over time. MATERIAL AND METHODS. Nine denture relining materials were investigated in this study. Two heat-curing polymethyl-methacrylate(PMMA) denture base materials: Vertex RS, Lang, one self-curing polyethyl-methacrylate(PEMA) chairside reline resin: Rebase II, six silicone relining materials: Mucopren soft, Mucosoft, $Mollosil^{{R}}$ plus, Sofreliner Touch, GC $Reline^{TM}$ Ultrasoft, Silagum automix comfort were used in this experiment. Contact angles were measured using high-resolution drop shape analysis system(DSA 10-MK2, KRUESS, Germany) under three conditions(in air after setting, 1 hour water storage, and 24 hours water storage). Nine materials were classified into three groups according to material composition(Group 1: PMMA, Group 2: PEMA, Group 3: Silicone). Mean values of contact angles were compared using independent samples t-test and one-way ANOVA, followed by a Scheffe's post hoc analysis($\alpha$=0.01). RESULTS. Contact angles of materials tested after air and water storage increased in the following order: Group 1(PMMA), Group 2(PEMA), Group 3(Silicone). Heat-cured acrylic denture base resins had more wettability than silicone relining materials. Lang had the highest wettability after 24 hours of water storage. Silicone relining materials had lower wettability due to their hydrophobicity. Wettability of all denture relining materials, except Rebase II and $Mollosil^{{R}}$ plus, increased after 24 hours of water storage. CONCLUSIONS. Conventional heat-cured resin showed the highest wettability, therefore, it can be suggested that heat-cured acrylic resin is material of choice for denture relining materials.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.191-194
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• 2007

In hot embossing lithography which has shown to be a good method to fabricate polymeric patterns for IT and bio components, it is very important to determine the proper process conditions of pressure, temperature, and time. It is also a key factor for predicting the optical properties of final product to calculate residual stress distribution after the embossing process. Therefore, to design the optimum process with right conditions, the ability to predict viscoelastic behavior of polymer during and after the hot embossing process is required. The objective of the present investigation is to establish simulation technique based on constitutive modeling of polymer with experiments. To analyze deformation behavior of viscoelastic polymer, the large strain material properties were obtained from quasi-static compression tests at different strain rates and temperatures and also stress relaxation tests were executed. With this viscoelastic material model, finite element simulation of hot embossing was executed and stress distribution is obtained. Proper process pressure is very important to predict the defect and incomplete filling.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.333-338
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• 2003

Nano-imprint lithography(NIL) is a polymer embossing technique, capable of transferring nano-scale patterns onto a thin film of thermoplastics such as polymethyl methacrylate(PMMA) using this parallel process. Feature size down 10 nm have been demonstrated. In NIL, the pattern is formed by displacing polymer material, which can be squeeze flow of a viscous liquid. Due to the size of the pattern, a thorough understood of the process through experiments may be very different. Therefore we nead to resort to numerical simulation on the embossing process. Generally, there are two ways of numerical simulation on nano-scale flow, namely top-down and bottom-up approach. Top-down approach is a way to simulate the flow assuming that polymer is a continuum. On the contrary, in the bottom-up approach, simulation is peformed using molecular dynamics(MD). However, as latter method is not feasible yet. we chose the top-down approach. For the numerical analysis, two dimensional moving grid was used since the moving grid can predict the flow front. Effects of surface tension as well as the slip at the boundary were also considered.

• 한국세라믹학회지
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• 제45권9호
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• pp.537-543
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• 2008

Effect of template size ratio on porosity and mechanical properties of porous zirconia ceramics were investigated using two different size (${\sim}8{\mu}m$ and ${\sim}50{\mu}m$ in diameter) of polymethyl methacrylate-coethylene glycol dimethacrylate (PMMA) microbeads as sacrificial templates. Porosity of the porous zirconia ceramics increased with decreasing the template size ratio ($8{\mu}m: 50{\mu}m$) whereas the compressive and flexural strengths of the porous zirconia ceramics increased with increasing the template size ratio. By controlling the template size ratio, sintering temperature and sintering time, it was possible to produce porous zirconia ceramics with porosities ranging from 57% to 69%. Typical flexural and compressive strength values of porous zirconia ceramics with ${\sim}60%$ porosity were ${\sim}37\;MPa$ and ${\sim}85\;MPa$, respectively.

• IEIE Transactions on Smart Processing and Computing
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• 제4권5호
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• pp.297-304
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• 2015

A multilayer gaseous detector has been developed for fast dose-verification measurements of raster-scan-mode therapeutic beams in particle therapy. The detector, which was constructed with eight thin parallel-plate ionization chambers (PPICs) and polymethyl methacrylate (PMMA) absorber plates, is closely tissue-equivalent in a beam's eye view. The gas-electron signals, collected on the strips and pad arrays of each PPIC, were amplified and processed with a continuous charge.integration mode. The detector was tested with 190-MeV raster-scan-mode beams that were provided by the Proton Therapy Facility at Samsung Medical Center, Seoul, South Korea. The detector responses of the PPICs for a 190-MeV raster-scan-mode proton beam agreed well with the dose data, measured using a 2D ionization chamber array (Octavius model, PTW). Furthermore, in this study it was confirmed that the detector simultaneously tracked the doses induced at the PPICs by the fast-oscillating beam, with a scanning speed of 2 m s-1. Thus, it is anticipated that the present detector, composed of thin PPICs and operating in charge.integration mode, will allow medical scientists to perform reliable fast dose-verification measurements for typical dynamic mode therapeutic beams.

• 한국정밀공학회지
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• 제21권12호
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• pp.13-20
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• 2004

Manufacturing process for the microfluidic device can include such sequential steps as master fabrication, electroforming, and injection molding. The laser ablation using masks has been applied to the fabrication of channels in microfluidic devices. In this study, manufacturing of polymer master and mold insert for micro injection molding was investigated. Ablation of PET (polyethylene terephthalate) by the excimer laser radiation could be used successfully to make three dimensional master fur nickel mold insert. The mechanism fur ablative decomposition of PET with KrF excimer laser $({\lambda}: 248 nm, pulse duration: 5 ns)$ was explained by photochemical process, while ablation mechanism of PMMA (polymethyl methacrylate) is dominated by photothermal process, the .eaction between PC (polycarbonate) and KrF excimer laser beam generate too much su.face debris. Thus, PET was adopted in polymer master for nickel mold insert. Nickel electroforming using laser ablated PET master was preferable for replication method. Finally, it was shown that excimer laser ablation can substitute for X-ray lithography of LIGA process in microstructuring.

• 한국환경과학회지
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• 제17권11호
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• pp.1235-1241
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• 2008

Membrane separation is extensively used for water/wastewater treatment because of its efficiency separation processes. However, particles in the feed water can deposit and accumulate on the membrane surface to created cake layer. As a consequence, the selectivity of the membrane and flux through the membrane are decreased, which is called fouling/blocking phenomenon. In order to solve fouling problem, we developed a novel membrane named Carbon Whisker Membrane (CWM) which contains vapor-grown carbon fibers/whiskers on the surface of the membrane and a layer of carbon film coated on the ceramic substrate. We firstly employed polymethyl methacrylate (PMMA) as a testing material to investigate the fouling mechanism. The results suggested that Carbon Whiskers on the surface of the membrane can prevent the directly contact between the membrane body and particles so that the fouling/blocking could not occurred easily compared to the membrane without carbon whiskers. We also researched the relationship with the diameter, density of carbon whisker on the membrane surface and total flux of solutions. Finally, we will be able to control the diameter and density of carbon whiskers on the membrane and existence of carbon whiskers on the membrane, it is important factor, might be prevent fouling/blocking in the water treatment.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1336_1337
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• 2009

본 논문에서는 유기 박막 트랜지스터의 전극을 잉크젯 프린팅과 스크린 프린팅 방법을 이용하여 유기 박막 트랜지스터를 제작하였다. 전극으로 PEDOT:PSS와 Ag 잉크를 사용하였고, 게이트 절연막으로 polymethyl methacrylate (PMMA)와 poly(4-vinylphenol) (PVP)를 사용하였다. 유기물 활성층으로 pentacene을 진공 증착하였다. 잉크젯 프린팅 방법을 이용하여 제작한 유기 박막 트랜지스터는 전계이동도 (${\mu}_{FET}$) $0.068\;cm^2$/Vs, 문턱전압 ($V_{th}$) -15 V, 전류 점멸비 ($I_{on}/I_{off}$ current ratio) >$10^4$의 전기적 특성을 보였고, 스크린 인쇄 방법을 이용하여 제작한 유기 박막 트랜지스터는 전계이동도 (${\mu}_{FET}$) $0.016\;cm^2$/Vs, 문턱전압 ($V_{th}$) 6 V, 전류 점멸비 ($I_{on}/I_{off}$ current ratio) >$10^4$의 전기적 특성을 보였다. 이를 통하여 프린팅 방법을 이용한 유기 박막 트랜지스터 단일 소자 및 유기 전자 회로 제작의 가능성을 확인 하였다.

• 대한기계학회논문집
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• 제19권9호
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• pp.2353-2364
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• 1995

The ignition phenomena of a solid fuel plate of polymethyl-methacrylate(PMMA), which is vertically positioned and exposed to a thermal radiation source, is numerically studied here. A two-dimensional transient model includes such various aspects as thermal decomposition of PMMA, gas phase radiation absorption, gas phase chemical reaction and air entrainment by natural convection. Whereas the previous studies considers the problem approximately in a one-dimensional form by neglecting the natural convection, the present model takes account of the two-dimensional effect of radiation and air entrainment. The inert heating of the solid fuel is also taken into consideration. Radiative heat transfer is incorporated by th Discrete Ordinates Method(DOM) with the absorption coefficient evaluated using gas species concentration. The thermal history of the solid fuel plate shows a good agreement compared with experimental results. Despite of induced natural convective flow that induces heat loss from the fuel surface, the locally absorbed radiant energy, which is converted to the internal energy, is found to play an important role in the onset of gas phase ignition. The ignition is considered to occur when the rate of variation of gas phase reaction rate reaches its maximum value. Once the ignition takes place, the flame propagates downward.

• 한국생산제조학회지
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• 제25권1호
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• pp.62-67
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• 2016

This paper presents a silicon nanostructure array embedded in a polymer film. The silicon nanostructure array was fabricated by using basic microelectromechanical systems (MEMS) processes such as photolithography, reactive ion etching, and anisotropic KOH wet etching. The fabricated silicon nanostructure array was transferred into polymer substrates such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), and polycarbonate (PC) through the hot-embossing process. In order to determine the transfer conditions under which the silicon nanostructures do not fracture, hot-embossing experiments were performed at various temperatures, pressures, and pressing times. Transfer was successfully achieved with a pressure of 1 MPa and a temperature higher than the transition temperature for the three types of polymer substrates. The transferred silicon nanostructure array was electrically evaluated through measurements with a semiconductor parameter analyzer (SPA).