• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.350-354
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• 2009

In this work, polymer - inorganic composites have prepared using polymer such as polyethylene glycol (PEG)/poly (methyl methacrylate, PMMA) and inorganic nanofillers materials such as TiO2 nanotubes (TiNTs)/carbon nanotubes (CNTs). The extensive structural, morphological and ionic properties revealed that the high surface area and tubular feature of nanofillers improved the interaction and cross-linking to polymer matrix which is significantly enhanced the ionic conductivity and electrical properties of composite electrolytes. Comparably high conversion efficiency ~4.5% has been observed by using the newly prepared PEG-TiNTs composite solid electrolyte as compared with PMMA-CNTs electrolyte based DSSCs (~3%). The detailed comparative properties would be discussed in term of their structural, morphology, ionic and photovoltaic properties.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.68-74
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• 2017

Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Up to now there have been a lot of researches on thermal NIL, but most of them have been focused on polymer deformation in the molding process and there are very few studies on the cooling and demolding process. In this paper a cooling process of the polymer resist in thermal NIL is analyzed with finite element method. The modeling of cooling process for mold, polymer resist and substrate is developed. And the cooling process is numerically investigated with the effects of imprinting temperature and residual layer thickness of polymer resist on stress distribution of the polymer resist. The results show that the lower imprinting temperature, the higher the maximum von Mises stress and that the thicker the residual layer, the greater maximum von Mises stress.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1572-1575
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• 2005

Poly(vinyl phenol)(PVP)/$TiO_2$ nanocomposite the films have been prepared incorporating metal alkoxide with vinyl polymer to obtain high dielectric constant gate insulating material for a organic thin film transistor. The surface composition, the morphology, and the thermal and electrical properties of the hybrid nanocomposite films were observed by ESCA, scanning electron microscopy (SEM), atomic force microscopy(AFM), and thermogravimetric analysis (TGA). Thin hybrid films exhibit much higher dielectric constants (7.79 at 40wt% metal alkoxide).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.666-670
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• 2004

VLSI 소자에서 design rule(D/R)이 작아져 각 단위 Pattern의 size가 작아짐에 따라 aspect ratio가 커지게 되었다. 산화막 contact etch를 하는데 있어 산화막 측벽을 보호하는데, 이러한 보호막은 주로 fluoro-carbon 계열의 polymer precursor들이 사용된다. Aspect ratio(A/R)가 5 이하일 때에는 측벽의 보호막에 의한 바닥 변형이 문제가 되지 않으나, 10 이상의 A/R를 가진 contact에서는 크기가 줄고, 모양이 불균형하게 변하는 바닥 변형을 쉴게 관찰할 수 있다. 이러한 바닥 변형이 커지면 contact 저항이 높아지는 것은 물론이고, 심하게는 하부 pattern과 overlap 불량을 유발할 수 있다. 본 논문에서는 바닥변형을 일으키는 원인을 분석하고 fluoro-carbon 계열의 polymer precursor의 종류$(C_4_F6\;vs.\;C_3F_8)$에 따른 polymer증착 상태 확인 및 pattern비대칭에 따른 바닥 변형의 고찰과 plasma etching 시 H/W 변형을 통해 바닥 변형이 거의 없는 조건을 찾아낼 수 있었다.

• Polymer Science and Technology
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• v.16 no.1
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• pp.38-47
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• 2005

• Journal of the Microelectronics and Packaging Society
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• v.31 no.3
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• pp.1-9
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• 2024

This paper addresses the significance of Cu/Polymer Hybrid Bonding technology in the advancement of semiconductor packaging. As the demands of the AI era increase, the semiconductor industry is exploring heterogeneous integration packaging technologies to achieve high I/O counts, low power consumption, efficient heat dissipation, multifunctionality, and miniaturization. The conventional Cu/SiO₂ Hybrid Bonding structure faces limitations such as achieving compatibility with CMP processes to attain surface roughness below 1nm and the occurrence of bonding defects due to particles. However, Cu/Polymer Hybrid Bonding technology, utilizing polymers, is gaining attention as a promising alternative to overcome these challenges. This study focuses on the deposition, patterning, and material properties of polymers essential for Cu/Polymer Hybrid Bonding, highlighting the advantages and potential applications of this technology compared to existing methods. Specifically, the use of polymers with low glass transition temperatures (Tg) is discussed for their benefits in low-temperature bonding processes and improved mechanical properties due to their high coefficients of thermal expansion. Furthermore, the study explores surface property modifications of polymers and the enhancement of bonding mechanisms through plasma treatment. This research emphasizes that Cu/Polymer Hybrid Bonding technology can serve as a critical breakthrough in developing high-performance, low-power semiconductor devices within the industry.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1389-1392
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• 2009

A series of new symmetric TTF derivatives were designed and synthesized. This facile synthetic method provides an opportunity to prepare TTF-based LC candidates. This series of compounds exhibited smectic A phase based on coplanar TTF core. One of the LC compounds was used as a semiconductor layer to fabricate OTFT.

• Advanced Composite Materials
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• v.17 no.1
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• pp.89-99
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• 2008

Using a Dynamic Mechanical Analyzer (DMA), mechanical properties like modulus and phase transition temperature of polyester composites of banana fibers (treated and untreated) are measured simultaneously. The shifting of phase transition temperature is observed in some treatments. The performance of the composite depends to a large extent on the adhesion between polymer matrix and the reinforcement. This is often achieved by surface modification of the matrix or the filler. Banana fiber was modified chemically to achieve improved interfacial interaction between the fiber and the polyester matrix. Various silanes and alkalies were used to modify the fiber surface. Chemical modification was found to have a profound effect on the fiber/matrix interaction, which is evident from the values of phase transition temperatures. Of the various chemical treatments, simple alkali treatment with 1% NaOH was found to be the most effective.

• Journal of Information Display
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• v.3 no.2
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• pp.1-5
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• 2002

A CMOS driving circuit for active matrix type polymer electroluminescent displays was designed to develop an on-chip microdisplay on the single crystal silicon wafer substrate. The driving circuit is a conventional structure that is composed of the row, column and pixel driving parts. 256 gray scales were implemented using pulse amplitude modulation method. The 2-transistor driving scheme was adopted for the pixel driving part. The layout was carried out considering the compatibility with the standard CMOS process. Judging from the layout of the driving circuit, it turns that it is possible to implement a high-resolution display about 400 ppi resolution. Through the HSPICE simulation, it was verified that this circuit is capable of driving a VGA signal mode display and implementing 256 gray levels.

• Journal of the Semiconductor & Display Technology
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• v.12 no.2
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• pp.93-98
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• 2013

Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. To successfully imprint a nanosized pattern with the thermal NIL, the process conditions such as temperature and pressure should be appropriately selected. This starts with a clear understanding of polymer material behavior during the thermal NIL process. In this paper, a filling process of the polymer resist into nanometer scale cavities during the thermal NIL at the temperature range, where the polymer resist shows the viscoelastic behaviors with consideration of stress relaxation effect of the polymer. In the simulation, the filling process and the residual layer formation are numerically investigated. And the effects of pressure and temperature on NIL process, specially the residual layer formation are discussed.