• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.373-373
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• 2009

Relative humidity, membrane conductivity and water activity are critical parameters of polymer electrolyte membrane fuel cells (PEMFC) for high performance and reliability. These parameters are closely related with temperature. Moreover, the ideal values of these parameters are not always identical along the channels. Therefore, the cooling channel design and its operating condition should be well optimized along the all location of the channels. In the present study, we have performed a numerical investigation on the effects of cooling channels on performance of a PEMFC. Three-dimensional Navier-Stokes equations are solved with the energy equation including heat generated by the electrochemical reactions in the fuel cell. The present numerical model includes the gas diffusion layers (GDL) and serpentine channels for both anode and cathode gas flows, as well as cooling channels. To accurately predict the water transport across the membrane, the distribution of water content in the membrane is calculated by solving a nonlinear differential equation with a nonlinear coefficient, i.e., the water diffusivity which is a function of water content as well as temperature. Main emphasis is placed on the heat transfer between the solid bipolar plate and coolant flow. The present results show that local current density is affected by cooling channels due to the change of the oxygen concentration and the membrane conductivity as well as the water content. It is also found that the relative humidity is influenced by the generated water and the gas temperature and thus it affects the distribution of fuel concentration and the conductivity of the membrane, ultimately fuel cell performance. Unit-cell experiments are also carried out to validate the numerical models. The performance curves between the models and experiments show reasonable results.

• International Journal of Automotive Technology
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• 제7권5호
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• pp.571-577
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• 2006

This paper deals with dynamic tensile characteristics for the polypropylene used in an IP(Instrument Panel). The polypropylene is adopted in the dash board of a car, especially PAB(Passenger Air Bag) module. Its dynamic tensile characteristics are important because the PAB module undergoes high speed deformation during the airbag expansion. Since the operating temperature of a car varies from $-40^{\circ}C$ to $90^{\circ}C$ according to the specification, the dynamic tensile tests are performed at a low temperature($-30^{\circ}C$), the room temperature($21^{\circ}C$) and a high temperature($85^{\circ}C$). The tensile tests are carried out at strain rates of six intervals ranged from 0.001/sec to 100/sec in order to obtain the strain rate sensitivity. The flow stress decreases at the high temperature while the strain rate sensitivity increases. Tensile tests of polymers are rather tricky since polymer does not elongate uniformly right after the onset of yielding unlike the conventional steel. A new method is suggested to obtain the stress-strain curve accurately. A true stress-strain curve was estimated from modification of the nominal stress-strain curves obtained from the experiment. The modification was carried out with the help of an optimization scheme accompanied with finite element analysis of the tensile test with a special specimen. The optimization method provided excellent true stress-strain curves by enforcing the load response coincident with the experimental result. The material properties obtained from this paper will be useful to simulate the airbag expansion at the normal and harsh operating conditions.

• 마이크로전자및패키징학회지
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• 제22권2호
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• pp.55-59
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• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.332-332
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• 2010

We have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films withouWe have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films without a high temperature sintering process. In order to remove the coffee ring effect in the ink drop, we have introduced a co-solvent system in order to create Marangoni flow in the ink drop, which leads to the dense packing of ceramic powders on the substrate during inkjet process. The packing density of the Inkjet-printed $Al_2O_3$ films is around 60% (max. 70%) which is very high compared to the value obtained from the same material films by other conventional methods such as film casting, dip coating process, etc. The voids inside the films (which are around 40% of the entire film volume) are filled with the polymer resin (Cyanate ester) by the infiltration process. This resin infiltration is also implemented by the inkjet printing process right after the Ah03 film ink-jetting process. The microstructures of the printed $Al_2O_3$ films are investigated by Scanning Electron Microscope (SEM) to understand the degree of packing density in the printed films. The inkjet-printed $Al_2O_3$ films have been characterized to investigate its thickness and roughness. Quality factor of the printed $Al_2O_3$ film is also measured to be over 300 at 1MHz.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.457-460
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• 2000

Injection molding is the most widely used process for the industrial forming of plastic articles. During an injection molding process of composites, the fiber-matrix separation and fiber orientation are caused by the flow of molten polymer/fiber mixture. As a result, the product tends to be nonhomogeneous and anisotropic. Hence, it is very important to clarify the relations between separation·orientation and infection molding conditions. So far, there is no research on the measurement of fiber orientation using image processing. In this study, the effects of fiber content ratio and molding condition on the fiber orientation-angle distributions are studied experimentally. Using the image processing method, the fiber orientation distribution of welding parts in injection-molded products is assessed. And the effects of fiber content and injection mold shapes on the fiber orientation in case of fiber reinforced polymeric composites are studied. experimentally.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2009년도 하계학술발표대회 논문집
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• pp.645-649
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• 2009

Liquid desiccant cooling technology can supply cooling by using waste heat and solar heat which are hard to use effectively. For compact and efficient design of a dehumidifier, it is important to sustain sufficient heat and mass transfer surface area for water vapor diffusion from air to liquid desiccant on heat exchanger. In this study, the plate type heat exchanger is adopted which has extended surface, and hydrophilic coating and porous layer coating are adopted to enhance surface wettedness. PP(polypropylene) plate is coated by porous layer and PET(polyethylene terephthalate) non-woven fabric is coated by hydrophilic polymer. These coated surfaces have porous structure, so that falling liquid film spreads widely on the coated surface foaming thin liquid film by capillary force. The temperature of liquid desiccant increases during dehumidification process by latent heat absorption, which leads to loss of dehumidification capacity. Liquid desiccant is cooled by cooling water flowing in plate heat exchanger. On the plate side, the liquid desiccant can be cooled by internal cooling. However the liquid desiccant on extended surface should be moved and cooled at heat exchanger surface. Optimal mixing and distribution of liquid desiccant between extended surface and plate heat exchanger surface is essential design parameter. The experiment has been conducted to verify effective surface treatment and distribution characteristics by measuring wall side flow rate and visualization test. It is observed that hydrophilic and porous layer coating have excellent wettedness, and the distribution can be regulated by adopting holes on extended surface.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.216-216
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• 1999

The usage of a stationary plasma thruster (SPT) ion source, invented previously for space application in Russia, in experiments with surface modifications and film deposition systems is reported here. Plasma in the SPT is formed and accelerated in electric discharge taking place in the crossed axial electric and radial magnetic fields. Brief description of the construction of specific model of SPT used in the experiments is presented. With gas flow rate 39ml/min, ion current distributions at several distances from the source are obtained. These was equal to 1~3 mA/$\textrm{cm}^2$ within an ion beam ejection angle of $\pm$20$^{\circ}$with discharge voltage 160V for Ar as a working gas. Such an extremely high ion current density allows us to obtain the Ti metal films with deposition rate of $\AA$/sec by sputtering of Ti target. It is shown a possibility of using of reactive gases in SPT (O2 and N2) along with high purity inert gases used for cathode to prevent the latter contamination. It is shown the SPT can be operated at the discharge and accelerating boltages up to 600V. The results of presented experiments show high promises of the SPT in sputtering and surface modification systems for deposition of oxide thin films on Si or polymer substrates for semiconductor devices, optical coatings and metal corrosion barrier layers. Also, we have been tried to establish in application of the modeling expertise gained in electric and ionic propulsion to permit numerical simulation of additional processing systems. In this mechanism, it will be compared with conventional DC sputtering for film microstructure, chemical composition and crystallographic considerations.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• 한국염색가공학회지
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• 제22권3호
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• pp.187-193
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• 2010

The effects of molecular weight (MW) and concentration on the rheological properties of poly(vinyl alcohol) (PVA) solutions in dimethyl sulfoxide (DMSO) were investigated at $30^{\circ}C$. Ubbelohde viscometer and rotational rheometer were employed for dilute and concentrated regime, respectively. In the dilute regime, the Mark-Houwink exponent ($\alpha$) of the solutions determined from three different MWs proved 0.73. The critical concentration (C*), in which the entanglement and overlap of polymer molecules began to take place, decreased with increasing the MW of PVA. Huggins constant ($K_H$) values ranged from 0.33 to 0.45 over the MW examined. In the log-log plot of $\eta_{sp}$ versus [$\eta$]C, the PVA with higher degree of polymerization (DP) gave a greater slope exhibiting the inflection point in the vicinity of C*. In the dynamic viscosity ($\eta'$) curve, the PVA solutions of DP 1700 presented Newtonian fluid behavior over most of the frequency range examined. However, the lower Newtonian flow region reduced with increasing the DP. As the PVA concentration increased, $\eta'$ was increased and the onset shear rate for pseudoplasticity was decreased. In the Cole-Cole plot, PVA solutions showed almost a single master curve in a slope of ca. 1.65 regardless of the DP. However, the increase of the concentration from 8 to 12 wt% for PVA solutions of DP 5000 decreased the slope from 1.73 to 1.57. In the tan $\delta$ curve, the onset frequency for sol-gel transition was shifted from 154 to 92 rad/s with increasing the DP from 3300 to 5000 and from 192 to 46 rad/s with increasing the concentration from 8 to 12 wt%. In addition, longer relaxation time ($\lambda$) was observed with increasing the DP and concentration.

• 공업화학
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• 제1권2호
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• pp.240-248
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• 1990

$C_9$ aromatics의 transakylation에 대한 금속담지 H-mordenite의 촉매활성 및 선택도에 관한 실험이 고압의 연속흐름 고정층 반응기에서 수행되었다. 니켈담지 H-mordenite(T-Ni) 촉매는 높은 활성을 나타내었으며, 이 활성의 감소속도가 느렸다. 몰리브덴 및 니켈이 담지된 H-mordenite(T-NiMo) 촉매도 높은 활성을 나타내었으며, 탄화수소의 탄화를 억제하였다. T-Ni 및 T-NiMo 촉매의 선택도는 실험범위 내에서 반응온도가 증가함에 따라 감소하였지만, 상업적으로 사용되는 T촉매의 선택도는 반응온도가 증가함에 따라 서서히 증가하였다. 촉매의 초기활성 및 활성감소 측면에서는 T-Ni 및 T-NiMo 촉매의 성능이 T촉매보다 우수하였으며, 몰리브덴의 첨가는 T-Ni 촉매의 안정성을 다소 개선하였다.