• Journal of Radiation Industry
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• v.4 no.4
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• pp.335-339
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• 2010

In this study, the surface of polyimide (PI) films was modified using ion implantation to enhance its adhesion to a deposited copper (Cu) layer. The surfaces of the PI films were implanted with 150 keV $Xe^+$ ions at fluences varying from $1{\times}10^{14}$ to $1{\time}10^{16}ions\;cm^{-2}$. The Cu layers were then deposited on the implanted PI. The surface properties of the implanted PI film were investigated based on the contact angle measurements, Fourier transform infrared spectroscopy (FT-IR), X-ray photoelectron spectroscopy (XPS), and atomic force microscopy (AFM). Furthermore, the adhesive strength between the deposited Cu layer and PI film was estimated through a scratch test using a nanoindenter. As a result, the surface environment of the PI film was changed by the ion implantation, which could have a significant effect on the adhesion between the deposited Cu layer and the PI.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1584-1587
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• 2008

We proposed a technique controlling continuously pretilt angle in full range with high process margin. The proposed method is characterized by tuning thickness of heterogeneous polyimide (PI) layer that homeotropic PI is mixed with planar PIs.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.317-319
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• 2008

Photo-alignment layer which contains cinnamate is difficult to generate pretilt angle of liquid crystals. In order to enhance pretilt angle, blending poly (amic acid) between containing fluorine poly (amic acid) and 1,2,3,4-cyclobutanetetracaroxylic dianhydride (CBDA) / 3,5-diaminobenzyl alcohol (DBA) were used. For photoreaction, cinnamate was conjugated by interfacial reaction with blending polyimide.

• Journal of Korean Vacuum Science & Technology
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• v.6 no.1
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• pp.51-54
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• 2002

Polymer EL devices of glass/ITO/PI/MEH-PPV/Al structure were fabricated using spin coating and the Ionized Cluster Beam deposition technique. PMDA-ODA type thin polyimide films which can be used as a impurity blocking layer of EL device were deposited by ICB. According to our previous results, the packing densities of polyimide films were subject to change and depend on their deposition condition. By inserting a Pl layer with various thickness and packing density, I-V characteristics and life time of the devices were investigated to determine the role of a interlayer. The blocking of impurity diffusion from ITO to luminescent layer were confirmed by XPS.

• ETRI Journal
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• v.44 no.1
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• pp.147-154
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• 2022

We demonstrate a new double-layer structure for stretchable interconnects, where the top surface of a serpentine polyimide support is coated with a thin eutectic gallium-indium liquid metal layer. Because the liquid metal layer is constantly fixed on the solid serpentine body in this liquid-on-solid structure, the overall stretching is accomplished by widening the solid frame itself, with little variation in the total length and cross-sectional area of the current path. Therefore, we can achieve both invariant resistance and infinite fatigue life by combining the stretchable configuration of the underlying body with the freely deformable nature of the top liquid conductor. Further, we fabricated various types of double-layer interconnects as narrow as 10 ㎛ using the roll-painting and lift-off patterning technique based on conventional photolithography and quantitatively validated their beneficial properties. The new interconnecting structure is expected to be widely used in applications requiring high-performance and high-density stretchable circuits owing to its superior reliability and capability to be monolithically integrated with thin-film devices.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.12
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• pp.996-999
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• 2012

From UV irradiation, we achieved homeotropic liquid crystal alignment on blended photo-polymer layer which is composed of polyvinyl-cinnamate (PVCi) and homeotropic polyimide (PI). From vertical alignment (VA) mode, we measured threshold voltages by various PVCi doping concentration. Also, the rise time and fall time of VA cells were measured to verify the best doping concentration. Transmittance curves showed about 70% value between 380 nm and 780 nm wavelength which mean visible region.

• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.2
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• pp.76-80
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• 2005

In this paper, a miniaturized ring hybrid circuit is characterized based on a thin film microstrip (TFMS) on low-resistivity silicon. In order to obtain low-loss characteristics, a polyimide layer with 50 $\mu$m thickness is spin-coated onto the silicon to be used for the substrate. First, propagation characteristics of TFMS lines consisting of the ring hybrid circuit are presented. Then, a ring hybrid circuit based on TFMS is featured by employing the triple concentric circle approach for miniaturization. Triple concentric circle lines with $\lambda$$_{g}$/4 or 3$\lambda$$_{g}$/4 line lengths are implemented on the surface of the polyimide by circularly meandering to reduce the circuit size of the designed ring hybrid. Good agreement between measured and simulated results is obtained.

• Current Optics and Photonics
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• v.2 no.2
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• pp.185-194
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• 2018

Ultra-small optical anisotropy of a rubbed polyimide (PI) alignment layer is quantitatively characterized using the improved reflection ellipsometer. Twisted nematic (TN) cells are fabricated using the rubbed PIs of known surface anisotropy as alignment layers. Distribution of liquid crystal (LC) molecules in the TN cell is characterized using transmission ellipsometry. The retardation of the rubbed PI surface increases as rubbing strength increases. The tilt angle of the optic axis of the rubbed PI surface decreases as rubbing strength especially as the angular speed of the rubbing roller increases. Pretilt angle of LC molecules in the TN cell shows strong correlation with tilt angle of the optic axis of the rubbed PI surface. Both the apparent order parameter and the effective twist angle of the LC molecules in the TN cell decrease as the pretilt angle of LC molecules increases.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.123-123
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• 2005

• Journal of Mechanical Science and Technology
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• v.18 no.9
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• pp.1572-1581
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• 2004

The purposes of the paper are to apply the axiomatic design methodology to the design of PBGA package with polyimide coating under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by stress analysis. The analysis model is a 256-pin perimeter Plastic Ball Grid Array (PBGA) package with the polyimide coating surrounding chip and above surface of BT-substrate. The polyimide coating is suggested to depress the maximum stresses occurred on the stress concentration positions. The axiomatic design methodology is proved to be useful to find the more reliable design conditions for PBGA package. Finally, the optimal values of design variables to depress the stress in the PBGA package are obtained.