• JSTS:Journal of Semiconductor Technology and Science
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• 제4권2호
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• pp.128-132
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• 2004

This paper presents the design, fabrication sequence and measurement results of a highly sensitive capacitive-type humidity sensor using a polyimide film without hydrophobic elements. The structure of the humidity sensor is MIM (metalinsulator-metal). For a high sensitivity, a modified aromatic polyimides as a moisture absorbing layer has been synthesized instead of using general polyimides containing hydrophobic elements. The polyimide film was obtained by synthesizing and thermally polymerizing polyamic acid composed of m-pyromellitic dianhydride, phenelenediamine and dimethylacetamide. Characteristics of fabricated sensors which include sensitivity, hysteresis and stability have been measured. The measurement result shows the percent normalized capacitance change of 0.37/%RH over a range from 10 to 90%RH, hysteresis of 0.77% over the same %RH range and maximum drift of 0.25% at 50%RH. The result shows that the developed humidity sensor can be applied to evaluate a hermeticity of various sensors and actuator systems as well as micro packages.

• 한국표면공학회지
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• 제26권6호
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• pp.327-333
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• 1993

The effect of heat treatment on the adhesion between Cu-18wt% Cr film and polyimide has been studied by using T-peel test, AES, and XRD. Cu-18wt% Cr alloy and pure Cu films were sputter deposited onto pol-yimide. Cu was electroplated before and after heat treatment at $400^{\circ}C$ for 0.5 hr and 2 hrs respectively. The adhesion of metal film onto polyimide was considerably good before heat treatment, but heat treatment re-duced the peel adhesion strength in all specimens. The reduction in adhesion in adhesion strength values in the specimens which were plated after heat treatment was mainly due to Cr-O rich pahse formed in the metal/polyimide in-terface. In the specimens which were heat treated after plating, the enhanced ductility in the metal films con-tributes the peel adhesion strength by increasing the amount of deformation in metal strips.

• Journal of Mechanical Science and Technology
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• 제18권1호
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• pp.12-19
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• 2004

Using LSM (laser scanning method) , the radius of curvature due to thermal deformation in polyimide film coated on Si substrate is measured. Since the polyimide film shows viscoelastic behavior, i.e., the modulus and deformation of the film vary with time and temperature, we estimate the relaxation modulus and the residual stresses of the polyimide film by measuring the radius of curvature and subsequently by performing viscoelastic analysis. The residual stresses relax by an amount of 10％ at 100$^{\circ}C$ and 20% at 150$^{\circ}C$ for two hours.

• 한국표면공학회지
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• 제29권3호
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• pp.157-162
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• 1996

The effects of microstructural change on the adhesion strength between Cu/Cr film and polyimide have been studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide by DC magnetron sputtering. During Cu deposition the Ar pressure was 5 or 100 mtorr. The microstructure was observed by SEM and the adhesion was measured by T-peel test. Plastic deformation of peeled metal strips was characterized quantitatively by using XRD technique. The film in which Cu is deposited at 100 mtorr has higher adhesion strength than the film in which Cu is deposited at 5 mtorr. And in the film with same deposition pressure of 100 mtorr, the adhesion strength is increased as the deposited thickness increases from 500 to 1000 nm. The adhesion change of Cu/Cr can be interpreted as the difference in plastic deformation.

• 반도체디스플레이기술학회지
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• 제9권2호
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• pp.117-121
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• 2010

The composite films were fabricated by air-spray method under the 2 kgf/$cm^2$ pressure using the multi-walled CNTs solution and the nitrocellulose on a 10 ${\mu}m$ polyimide film substrates. We obtained the composite films which were sprayed with the MWCNT dispersion by varying the spray time from 20, 40 and 60sec. The electrical and the optical properties of the sandwiched-structure-composite thin films were investigated by an UV/VIS spectrometer and a Hall Effect equipment. As a result, the optical transmittance of all thin films in the visible range, as well as the electrical conductance shows an available value for the transparent electrode. The carrier concentration and the light transmittance rate for the fabricated sample are between $3.733{\times}10^{10}$ and $6.551{\times}10^{14}cm^{-3}$, around 35 to 95%, respectively.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1498-1501
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• 1996

To evaluate insulating properties of polyimide thin film on high temperature over $100\;^{\circ}C$, polyimide film were prepared by electrophoretic deposition onto metal surface from nonaqueous emulsion. The emulsion is made by adding a solution of the resin to a precipitant, which is an organic liquid compeltely miscible with the solvent of the organic resin solution, but which does not dissolve the resin. The polyimide film obtained by annealing shows good insulation properties of 5.8 MV/cm at elevated temperature and breakdown strength of the film reveals thickness dependence.

• 공업화학
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• 제32권2호
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• pp.143-148
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• 2021

본 연구에서는 폴리이미드(polyimide; PI) 막(film)의 열전도도를 향상시켜 그 응용성을 확대하고자, 정전기 방전법을 이용하여 흑연봉으로부터 그래핀을 제조하고 제조된 그래핀을 첨가하여 폴리아믹산(polyamic acid; PAA) 전구체로부터 200 ㎛두께의 폴리이미드 기반 열전도 막을 제조하였다. 정전기 방전 기법으로 생산된 그래핀은 라만, XPS, TEM 등을 이용하여 물성을 평가하였다. 제조된 그래핀은 라만 스펙트럼 분석 결과 ID/IG 값이 0.138이며, XPS 분석 결과 C/O 비율이 24.91로 구조적, 표면화학적으로 우수한 물성을 나타내었다. 또한, 흑연 박리 그래핀의 첨가량에 따라 폴리이미드 막의 열전도도는 지수함수적으로 증가하였으며, 그래핀 함량을 40% 초과 시에는 폴리이미드 막을 제조할 수 없었다. 그래핀을 폴리아믹산 중량 대비40 wt% 첨가하여 제조된 폴리이미드 막의 열원반(hot disk) 열전도도는 51 W/mK를 나타내었으며, 순수한 폴리이미드 막의 열전도도(1.9 W/mK)보다 크게 향상되었다. 이 결과는 정전기 방전기법으로 제조된 박리 그래핀의 우수한 물성에 기인한 것으로 판단된다.

• 한국막학회:학술대회논문집
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• 한국막학회 1993년도 추계 총회 및 학술발표회
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• pp.31-31
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• 1993

지금까지 내유기용매성 분리막의 소재로는 Polysulfone이 많이 사용되었으나 내유기용매성이 고도로 요구되는 분야에는 적합하지 않았다. 이의 해결을 위해서 Polyimide를 소재로한 분리막의 개발에 대한 연구가 많이 진행되고 있다. 그러나 Polyimide는 내열성, 내유기용매성 등이 우수한 반면 T$_g$가 높고 용해되지 않아서 가공하는데 많은 제약이 있는 단점을 가지고 있다. 또한 기존에 널리 사용되었던 2단계 합성방법, 즉 Polyimide 전구체인 Polyamic acid를 합성하고 이를 casting하여 film을 얻은 뒤 다시 고온으로 열처리하여 Polyimide를 제조하는 방법은 공정이 번거롭고 부분적으로 불용성을 나타내기도 하였다. 본 연구에서는 1단계 용액 증합법으로 용융성 Polyimide를 합성하여 이를 소재로 내유기용매성 분리막을 제조하였다. 1단계 중합벙는 Polyamic acid를 합성하고 이를 film으로 만드는 공정이 필요치 않으며, 공정이 비교적 간단하고 경제적으로 유리한 잇점이 있다.

• 한국응용과학기술학회지
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• 제26권4호
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• pp.400-406
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• 2009

We investigated the electrochemical properties for Langmuir-Blodgett (LB) films of functionalized polyimide. LB films of polyimide monolayer were deposited by the Langmuir-Blodgett method on the indium tin oxide(ITO) glass. The electrochemical properties measured by cyclic voltammetry with a three-electrode system(an Ag/AgCl reference electrode, a platinum wire counter electrode and LB film-coated ITO working electrode) at various concentrations(0.5, 1.0, and 1.5 N) of $NaClO_4$ solution. The current of reduction and oxidation range was measured from 1650 mV to -1350 mV, continuously. The scan rates were 50, 100 and 150 mV/s, respectively. As a result, monolayer and multilayer LB films of polyimide are appeared on irreversible process caused by the oxidation current from the cyclic voltammogram.

• 한국레이저가공학회지
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• 제12권4호
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• pp.1-5
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• 2009

Conventional patterning based on wet-process for multi-layered film is a relatively complex and costly process though it is a necessary step for fabrication of TFT-LCD module. Recently, a direct pattering by laser has been studied because it is low cost and simple process compared to the wet process. In this work, the selective removal process of multi-layered film (polyimide/indium tin oxide/glass) is studied by modeling the thermal and mechanical behavior for multi-layered structure. Especially, the effects of thickness of polyimide layer are examined.