• Title/Summary/Keyword: Polishing time

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Micro Polishing Force Control of the Polishing Machine with the Airbag Tool (에어백 공구 기반의 광학 연마 장치의 미세 힘 제어 구현)

  • Lee, Ho-Cheol;Lee, Chang-Eun;Je, Tae-Jin
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.21 no.5
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    • pp.714-719
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    • 2012
  • In this paper, the polishing force monitoring and the control method were implemented for the polishing machine with the airbag tool. Airbag tool has been known to be adaptable to the curvature variation such as the aspherical and the free-form surface. However, it was necessary to control the tool movement of vertical axis also because of the table rotational wobble and vibration. To solve it by the polishing force control, we installed another stepping motor to the z-axis. And the polishing force was measured with the load cell and controlled by the PID Labview controller. A few hundreds gram of the polishing force were well controlled under 0.8 second of the response time and 5% variation. An experiment was done to clean the edge burrs of the micro channel structure of width $87{\mu}m$ using the polishing force control.

A Study on the Remote Operation and the Monitoring systems for Automatic Polishing Robot (자동 연마로봇의 원격 조작 및 모니터링 시스템 개발에 관한 연구)

  • 김병수;고석조;이민철
    • 제어로봇시스템학회:학술대회논문집
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    • 2000.10a
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    • pp.122-122
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    • 2000
  • Polishing work of a free-curved surface die demands simple and repetitive operations but requires a considerable amount of time for high precision. In out previous study, to reduce the polishing time and solve the problem of the shortage of skilled workers, the automatic polishing system was developed. However, in the polishing process of die, workers have to stay still in factory to monitor the polishing process for a long time in the poor environment. Therefore, this study proposes the remote operation and monitoring system of the automatic polishing robot. The developing system offer worker monitoring functions and teleoperating functions, as following: system state check, manual manipulation mode, automatic mode, manual teaching mode, automatic teaching mode, simulation by virtual manufacturing device. And automatic teaching system is developed to easily obtain a teaching data.

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Polishing Characteristics and Development of Automatic Die Polishing Machine by Liquid Honing (액체호닝에 의한 금형 자동 사상기계개발 및 가공 특성)

  • 김재도;류기덕;홍정석
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.6
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    • pp.162-168
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    • 2000
  • The automatic die polishing machine by liquid honing has been developed and experimented on the surface of machined die. The goal of development in the automatic die polishing machine by liquid honing is to increase the accuracy and the productivity in die polishing. To reach this goal, the polishing machine consists of the automatic measuring device for contour of die, the nozzle and pumping system to spray the powder mixed with liquid, and the 3-axis guides. Before polishing, the measuring device with a semiconductor laser scans the surface of mould to get the data of contour. The data store a PC and use to control the nozzle head to move above a couple of centimeters on the machined surface of die. The experimental parameters are the spraying time, the pressure, the size of abrasive grain and the mixing ratio between abrasive grain and liquid. The surface roughness is measured on the polished die which are SKDl 1 and Al7075 machined by NC. The surface roughness indicates the values of Rmax 0.5${\mu}{\textrm}{m}$ for Al7075 and Rmax 1.4${\mu}{\textrm}{m}$ for SKDl 1. It reduces the polishing time significantly and reduces the monotonous work for labors. As the results, the liquid honing system is useful method to apply for the die polishing and the automatic die polishing machine using liquid honing shows that it's very effective processing ability.

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Development of Automatic Polishing Robot System and Integrated Operating Program (자동 연마 로봇 시스템의 개발 및 통합 구동 환경 구축)

  • 이민철;정진영;고석조;허창훈
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.1
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    • pp.107-117
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    • 2003
  • Polishing a die that has free-form surfaces is a time-consuming and tedious job, and requires a considerable amount of high-precision skill. In order to reduce the polishing time and cope with the shortage of skilled workers, an automatic polishing robot system was developed. The polishing robot system is composed of two subsystems, a three-axis machining center and a two-axis polishing head. The machining center is controlled by a FANUC controller, and the polishing head by DSP controller. The system has five degrees of freedom and is able to keep the polishing tool normal to the die surface during operation. To easily operate the developed polishing robot system, this study developed an integrated operating program in the Windows environment. The program consists of five modules: a polishing data generation module, a code separation module, a polishing module, a graphic simulator module, and a teaching module. And, the automatic teaching system was developed to easily obtain teaching data and it consists of a three dimensional joystick and a proximity sensor. Also, to evaluate the performance of the integrated operating program and the polishing robot system, polishing experiments of a die of shadow mask were carried out.

User-friendly Automatic Polishing Robot System and Its Integrated Operating Program

  • Lee, Min-Cheol;Jung, Jin-Young;Go, Seok-Jo
    • International Journal of Precision Engineering and Manufacturing
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    • v.5 no.3
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    • pp.69-76
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    • 2004
  • Polishing a die that has free-form surfaces is a time-consuming and tedious job, and requires a considerable amount of high-precision skill. In order to reduce the polishing time and cope with the shortage of skilled workers, an automatic polishing robot system was developed. The polishing robot system is composed of two subsystems, a three-axis machining center and a two-axis polishing head. The machining center is controlled by a FANUC controller, and the polishing head by DSP controller. The system has five degrees of freedom and is able to keep the polishing tool normal to the die surface during operation. To easily operate the developed polishing robot system, this study developed an integrated operating program in the Windows environment. The program consists of five modules: a polishing data generation module, a code separation module, a polishing module, a graphic simulator module, and a teaching module. Also, the automatic teaching system was developed to easily obtain teaching data and it consists of a three dimensional joystick and a proximity sensor. Also, to evaluate the performance of the integrated operating program and the polishing robot system, polishing experiments of a die of shadow mask were carried out.

A Study on the Development of Polishing Robot System Attached to Machining Center for Curved Surface Die (곡면금형 연마를 위한 머시닝센터 장착형 연마로봇 시스템 개발에 관한 연구)

  • Lee, Min-Cheol;Ha, Deok-Ju
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.4 s.97
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    • pp.163-177
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    • 1999
  • Polishing work for a curved surface die demands simple and repetitive operations and requires much time while it demands also high precision. Therefore it is operated by a skilled worker in handiwork. However the workers avoid gradually a polishing work because of the poor environmental conditions such as dust and noise. In order to reduce the polishing time and to alleviate the problem of shortage of skilled workers, an automatic polishing robot system which is composed of a polishing robot with two degrees of freedom motion and pneumatic system is developed, and it is attached to machining center with three degrees of freedom. The system keeps the polishing tool vertically on the surface of die and maintains constant pneumatic pressure. The polishing robot with DSP(digital signal processor) controller is controlled by sliding mode control. A synchronization between machining center and polishing robot is accomplished by using M code of machining center. A performance experiment for polishing work is executed by the developed automatic polishing robot system. The result shows that the developed automatic polishing robot has a good performance and well polished workpiece surface is obtained.

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Effects of W CMP Process on PAD Characterization (패드 특성이 W CMP 공정에 미치는 영향)

  • Kim, Sang-Yong;Seo, Yong-Jin;Chung, Hun-Sang;Kim, Chang-Il;Chang, Eui-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.11a
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    • pp.178-181
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    • 2002
  • We studied the characteristics of polishing pad, which can apply W CMP process for global planarization of multilevel interconnection structure. Also we investigated the effects of different sets of polishing pad. The purpose of this experiment is the cost reduction by the increase of pad life time and decrease of cycle time and slurry usage with new pad. Especially we studied the effect of polishing pad for CMP process by this experiment of polishing pad that is consumables material during CMP process. We expecting the increase of process throughput and improvement of device manufacturing yield because we can choose optimum polishing pad through this result.

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A Study on Characterization and Modeling of Shallow Trench Isolation in Oxide Chemical Mechanical Polishing

  • Kim, Sang-Yong;Chung, Hun-Sang
    • Transactions on Electrical and Electronic Materials
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    • v.2 no.3
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    • pp.24-27
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    • 2001
  • The end point of oxide chemical mechanical polishing (CMP) have determined by polishing time calculated from removal rate and target thickness of oxide. This study is about control of oxide removal amounts on the shallow trench isolation (STI) patterned wafers using removal rate and thickness of blanket (non-patterned) wafers. At first, it was investigated the removal properties of PETEOS blanket wafers, and then it was compared with the removal properties and the planarization (step height) as a function of polishing time of the specific STI patterned wafers. We found that there is a relationship between the oxide removal amounts of blanket and patterned wafers. We analyzed this relationship, and the post CMP thickness of patterned wafers could be controlled by removal rate and removal target thickness of blanket wafers. As the result of correlation analysis, we confirmed that there was the strong correlation between patterned and blanket wafer (correlation factor: 0.7109). So, we could confirm the repeatability as applying for STI CMP process from the obtained linear formula. As the result of repeatability test, the differences of calculated polishing time and actual polishing time was about 3.48 seconds. If this time is converted into the thickness, then it is from 104 $\AA$ to 167 $\AA$. It is possible to be ignored because process margin is about 1800 $\AA$.

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Development of User Friendly Integrated Program and Teaching System for Automatic Polishing Robot System (자동 연마 시스템의 사용자 지향형 통합 프로그램 및 자동 교시 시스템 개발)

  • 고석조;이민철;이만형;안중환;김성한;이돈진
    • 제어로봇시스템학회:학술대회논문집
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    • 2000.10a
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    • pp.123-123
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    • 2000
  • Polishing a die that has free-form surfaces is a time-consuming and tedious job, and requires a considerable amount of high-precision skill. In order to reduce the polishing time and cope with the shortage of skilled workers, a user-friendly automatic polishing system was developed in this research. The polishing system with five degrees of freedom is able to keep the polishing tool normal to the die surface. The polishing system is controlled by a PC-NC controller. And, to easily onerate the developed polishing system, this stud)r developed a integrated program in the Windows environment. This program consists of 4 modules: polishing module, a graphic simulator, a polishing data generation module, and a teaching. Also, the automatic teaching system was developed to easily obtain a teaching data. The developed teaching system consists of a three dimensional joystick and a proximity sensor. In order to evaluate stability of the driving program and the leaching system, polishing experiments of the die of saddle shape were carried out.

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Development of an Active Ultra-precision Polishing Machine (능동형 초정밀 폴리싱가공기 개발)

  • 최진경;한성종;박경환;김태형
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.10a
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    • pp.74-78
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    • 2002
  • Ultra-Precision CNC polishing system including on-machine measurement system, a corrective polishing algorithm is developed. The unit removal profiles for various polishing tools and analyzed and tested and dwell time distributions and residual errors for a target removal shape are calculated. The corrective polishing algorithm is tested with various workpieces. This result will be used for the software development of the CNC polishing system.

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