• Title/Summary/Keyword: Polishing method

Search Result 430, Processing Time 0.024 seconds

Machining Accuracy for Large Optical Mirror using On-Machine Spherical Surface ]Referenced Shack-Hartmann System (On-Machine 구면기준 Shack-Hartmann 장치를 이용한 대형 반사경의 가공 정밀도 연구)

  • Hong Jong Hui;Oh Chang Jin;Lee Eung Suk;Kim Ock Hyn
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.29 no.5 s.236
    • /
    • pp.726-733
    • /
    • 2005
  • A spherical surface referenced Shack-Hartmann method is studied for inspecting machining accuracy of large concave mirror This method is so strong to the vibration environment for using as an on-machine inspection system during polishing process of large optics comparing with the interferometry. The measuring uncertainty of the system is shown as less than p-v 150 m. On-machine measured surface profile data with this method is used for feed back control of the polishing time or depth to improve the surface profile accuracy of large concave mirror. Also, the spherical surface referenced Shack-Hartmann method is useful for measuring aspheric such as parabolic or hyperbolic surface profile, comparing that the interferomehy needs a special null lens, which is to be a reference and difficult to fabricate.

Development of Finishing Panel using Surface Treatment Method (표면처리공법을 활용한 마감 패널 개발)

  • Kim, Kang-Min;Yoon, Seob;Kwan, Hae-Won;Gong, Min-Ho
    • Proceedings of the Korean Institute of Building Construction Conference
    • /
    • 2019.05a
    • /
    • pp.57-58
    • /
    • 2019
  • Precast concrete finishing panels can be implemented in different colors, textures and designs relatively freely by different designers in different finishing materials. Therefore, we tried to develop a PC finishing panel that can be applied in the field by using various color pigment and concrete surface retardation method and polishing method.

  • PDF

Study of transmission of Candida albicans in denture by dental polishing lathe (의치에서 치과기공용 연마기를 통한 캔디다균의 전염성에 대한 연구)

  • Lee, Gi-Ho;Song, Young-Gyun
    • Journal of Dental Rehabilitation and Applied Science
    • /
    • v.30 no.3
    • /
    • pp.199-205
    • /
    • 2014
  • Purpose: The purpose of this study was to evaluate the transmission of candida in denture by dental polishing lathe. Materials and Methods: Maxillary complete dentures made from the same model were infected with Candida albicans. The infected dentures were polished by dental polishing lathe with sterile pumice and distilled water. And then sterile maxillary complete dentures were polished with same method. Polishing surface was wiped with a cotton swab and the sample was checked for Candida albicans. The polishing wheel at room temperature was checked for Candida albicans every 24 hours for 3 days. Results: A considerable number of Candida was found on the polished sterile dentures. And the Candida albicans in polishing wheel was detected at up to two days. Conclusion: An anti-infection measure is urgently needed when dental polishing lathe is used for denture polishing, because of the possibility of fungal infection.

Electrochemical polishing method using the point electrode tools(2nd) (점 전극을 이용한 전해연마 가공특성)

  • 이승훈;박규열;양순용
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
    • /
    • 1999.05a
    • /
    • pp.251-255
    • /
    • 1999
  • In last paper, it was suggested electrochemical polishing method using the point electrode tools. It was aimed that Machining rate in ECM using the point electrode method should be ultimately small and also high dimension accuracy and surface integrity should be fine. In this paper, the machining characteristics were investigated by using the several types of electrolyte.

  • PDF

Determination of Optimal Design Level for the Semiconductor Polishing Process by Taguchi Method (다구찌 기법을 활용한 반도체 연마 공정의 최적 설계수준 결정)

  • Sim, Hyun Su;Kim, Yong Soo
    • Journal of Korean Society for Quality Management
    • /
    • v.45 no.2
    • /
    • pp.293-306
    • /
    • 2017
  • Purpose: In this study, an optimal design level of influencing factors on semiconductor polishing process was determined to minimize flexion of both sides on wafers. Methods: First, significant interactions are determined by the stepwise regression method. ANOVA analysis on SN ratio and mean of dependent variable are performed to draw mean adjustment factors. In addition, the optimal levels of mean adjustment factors are decided by comparing means of each level of mean adjustment factors. Results: As a result of ANOVA, a mean adjustment factor was determined as a width of formed flexion on the plate. The mean of the difference has the nearest to 0 in the case when the width of formed flexion has level 2 (4mm). Conclusion: Optimal design levels of semiconductor polishing process are determined as follows; (i) load applied to the wafer carrier has a level 1 (3psi), (ii) load applied to the wafer has a level 1(3psi), (iii) the amount of slurry supplied during polishing has a level 3 (300 co/min), (iv) the width of formed flexion on the plate has level 2 (4mm).

A Study on a Hartmann Test of Optical Mirror for On-Machine Measurement of Polishing machine (광학면 연마기의 OMM을 위한 Hartmann Test 방법 연구)

  • 김옥현;이응석;오창진;김용관
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.21 no.1
    • /
    • pp.40-45
    • /
    • 2004
  • Recently, aspheric optical lenses and mirrors, which are harder to manufacture and measure than the conventional spherical ones, are widely used, particularly in electronic fabrication process. Generally, interferometric optical method is used for the measurement of spherical optical surface. However, the interferometric method for aspheric surface measurement is difficult because it needs a precise null corrector and strict environmental conditions such as constant temperature, humidity and vibrations. We have been studied on the manufacturing of aspheric optics to improve the surface profile accuracy and productivity using a corrective polishing process. For the corrective polishing, a practical method of On-Machine Measurement (OMM) is required. For this purpose, an optical OMM system has been studied using the Shach-Hartmann test, which is very robust to the practical polishing environment. The wavefront has been reconstructed from the measured data using the primary aberration polynomial function by the least squares fitting. The measured result of the OMM system shows that the maximum deviation is less than 200 nm for the one of commercial Fizeau interferometer Wyko 6000.

A Study on the Optimal Machining of 12 inch Wafer Polishing by Taguchi Method (다구찌 방법에 의한 12인치 웨이퍼 폴리싱의 가공특성에 관한 연구)

  • Choi, Woong-Kirl;Choi, Seung-Gun;Shin, Hyun-Jung;Lee, Eun-Sang
    • Journal of the Korean Society of Manufacturing Process Engineers
    • /
    • v.11 no.6
    • /
    • pp.48-54
    • /
    • 2012
  • In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon. However, for many companies, it is hard to produce 400mm or 450mm wafers, because of excesive funds for exchange the equipments. Therefore, it is necessary to investigate 300mm wafer to obtain a better efficiency and a good property rate. Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This research investigated the surface characteristics that apply variable machining conditions and Taguchi Method was used to obtain more flexible and optimal condition. In this study, the machining conditions have head speed, oscillation speed and polishing time. By using optimum condition, it achieves a ultra precision mirror like surface.

A Study on Magnetic Abrasive Using Sr-Ferrite (Sr-Ferrite를 이용한 자기 연마재에 관한 연구)

  • Kim, Hee-Nam;Kim, Dong-Wook
    • Journal of the Speleological Society of Korea
    • /
    • no.79
    • /
    • pp.77-81
    • /
    • 2007
  • In this paper deals with behavior of the magnetic abrasive using Sr-Ferrite on polishing charateristiccs in a internal finishing of staninless steel pipe a tying magnetic abrasive polishing. The magnetic polishing is the useful method to finish some machinery fabrications by using magnetic power. This method is one of the precision techniques and has in aim for clean technology in the transportation of the pure gas in the clean pipes. The magnetic abrasive polishing method is not so common in the field of machine that it is not known to widely. There are rarely researcher in this field because of non-effectiveness of magnetic abrasive. Therefore, in this paper we deals with the development of the magnetic abrasive with the use of Sr-Ferrite. In this development, abrasive grain SiC has been made by using the resin bond fabricated at low temperature. And magnetic abrasive powder was fabricated from the Sr-Ferrite which was crushed into 200 mesh. The XRD analysis result shows that only SiC abrasive and Sr-Ferrite crystal peaks were detected, explaining that resin bond was not any more to contribute chemical reaction. From MACRO analysis, we found that SiC abrasive and Sr-Ferrite were strongly bonding with each other.

Development of The Magnetic Abrasive Using Ba-Ferrite and GC, CBN (Ba-Ferrite와 GC, CBN을 이용한 자기 연마재 개발)

  • Kim, Hee-Nam;Yun, Yeo-Kwon
    • Journal of the Korean Society of Safety
    • /
    • v.23 no.5
    • /
    • pp.43-48
    • /
    • 2008
  • The magnetic polishing is the useful method to finish some machinery fabrications by using magnetic power. This method is one of the precision polishing techniques and has an aim for clean technology in the transportation of the pure gas in the clean pipes. The magnetic abrasive polishing method is not so common in the field of machine that it is not known to widely. There are only few researchers in this field because of non-effectiveness of magnetic abrasive. Therefore, in this paper deals with development of the magnetic abrasive using Ba-Ferrite. In this development, abrasive grain GC and CBN has been made by using the resin bond fabricated at low temperature. And magnetic abrasive powder was fabricated from the Ba-Ferrite which was crushed into 200 mesh. The XRD analysis result shows that only GC, CBN and Ba-Ferrite crystal peaks were detected, explaining that resin bond was not any more to contribute chemical reaction. From SEM analysis, we found that GC, CBN abrasive and Ba-Ferrite were strongly bonding with each other.

Effects of Polishing Methods on the Surface Characteristics of Composite Resins (연마방법에 따른 복합레진의 표면특성 평가)

  • Baik, Min-Kyung;Kim, Chong-Chul;Jang, Ki-Taeg
    • Journal of the korean academy of Pediatric Dentistry
    • /
    • v.43 no.3
    • /
    • pp.275-283
    • /
    • 2016
  • The aim of this study was to evaluate the surface characteristics of composite resins polished with two different polishing methods. 30 disk-shaped specimens were prepared with microhybrid (Filtek$^{TM}$ Z250) and nanofilled (Filtek$^{TM}$ Z350) resins respectively, and classified into three groups: not polished as controls, polished by an abrasive disk (Soflex), and polished by a polishing brush (Occlubrush). Surface roughness was increased after polishing. In terms of micro-roughness, there were no significant differences between the two polishing methods. But macro-roughness values were markedly increased in the Occlubrush group (p < 0.05). In the Sof-lex group, the matrix and fillers were polished together, resulting into a smoother and homogeneous surface. However, in the Occlubrush group, the matrix layer was torn off, with more heterogeneous surfaces and large scratches. In regards to micro-hardness, no significant differences were observed between the two polishing systems (p > 0.05). And the hardness value increased about 25% after polishing. In conclusion, the method of polishing should be chosen deliberately in view of the hardness characteristics of composite resins. Sof-lex is recommended to improve the surface characteristics of polished resins.