• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.1-6
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• 2012

The polishing of silicon wafers has an important role in semiconductor manufacturing. Generally, getting a flat surface such as a mirror is the purpose of the process. The wafer surface roughness is affected by many variables such as the characteristics of the carrier head unit, operation, speed, the pad and slurry temperature. Optimum process conditions for experimental temperature, pH value, down-force, slurry ratio are investigated, time is used as a fixed factor. This study carried out a series of experiments at varying platen, chuck rpm and oscillation cpm taking particular note of the difference between the rpm and the affect it has on the surface roughness. In this experiment determine the optimum conditions for polishing silicone wafers.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.59-64
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• 1998

We need to achieve th mass product through methods of higher efficient, higher precise manufacturing process than those of existing precision abrasive machining. Thus, this study is to develop mirror-like surface machining technique of outer diameter of the piston pin by the compound magneto-electrolytic abrasive polishing system. The procedure of machining is followed as first, fulfill the pre-processing by cylindrical grinder, second, complete mirror-like surface by the method of magneto-electrolytic abrasive polishing used CBN non-woven abrasive pads. In this study, it was found that the best suitable conditions of mirror-like surface polishing were that the electrode density was 0.1A/$\textrm{cm}^2$, the applied pressure 1.5kgf/$\textrm{cm}^2$, the feed rate 0.5mm/rev, and the rotoation velocity of workpiece 80rpm, and that the surface roughness was reduced in this conditions.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.1
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• pp.21-28
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• 2008

The final polishing process is based on slurry, pad, conditioner, equipment. Therefore, the concept of wafer final polishing is also necessary for repeatability of results between polished wafers. In this study, the machining conditions have a pressure, table speed, machining time and slurry ratio. This research investigated the surface characteristics that apply variable machining conditions and response surface methodology was used to obtain more flexible and optimumal condition base on Taguchi method. On the base of estimated response surface curvature from the equation and results of Taguchi method, combined design of experiment was considered to lead to optimumal condition. Finally, polished wafer was obtained mirror like surface.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.625-631
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• 2002

In the previous study, a polishing robot system was developed to automate the polishing process and to cope with the shortage of skilled workers. This polishing robot system has several advantages: reduced time for setting polishing work, decreased labor costs, effective operation, continuous polishing work without an operator, improved machine accuracy, and the ability to polish a free curved surface die. However, still the problem remains that a worker must stay to monitor the polishing process in the poor working conditions for a long time. Nowadays some advanced manufacturing companies need to find a way to check the performance of their production equipments and plants from remote sites. Thus, this study constructed the communication network and developed the monitoring programs (a servo program and a client program) to operate the polishing robot from remote sites. Using these programs, workers are able to monitor and control the polishing robot on the web page, in any place where internet service is possible. To guarantee a stable operation in spite of a variable computer operating environment, the monitoring system is implemented in Java. The experimental results showed that the developed monitoring programs provided a stable communication.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.1
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• pp.38-44
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• 2002

In manufacturing die and mold, polishing: is important as it takes as much as 50% of the production cost. In this research, an attachable type polishing device to a WC machining center was developed. experiments were done with a special1y designed rotation type polishing device. Also an ultra-sonic (vibration type) waving device was introduced to acquire finer surface finishes. From the constructed data base based on the experimental results, it is shown that optimal polishing conditions are generated by the combined use of the rotation type tool and the vibration type tool.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.10a
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• pp.324-328
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• 2003

The Magnetoeheological fluid has the properties that it's viscosity has dramastic changed under some magnetic fields therefore, Magnetorhlogical fluids has been used for micro polishing of the micro part( for example, a aspherical surface in a micro lens). The polishing process may appears as follows. A part rotating on the spindle is brought into contact with an Magnetorhological finshing(MRF) fluids which is set in motion by the moving wall. In the region where the part and the MRF fulid ate brought into contact, the applied magnetic field creates the conditions necessary for the material removal from the part surface. The material removal takes place in a certain region contacting the surface of the part which can be called the polishing spot or zone. The polishing mechanism of the material removal in the contact zone is considered as a process governed by the particularities of the Bingham flow in the contact zone. Resonable calculated and experimental magnitudes of the material removal rate f3r glass polishing lends support the validity of the approach.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1840-1843
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• 2003

The Magnetorheological fluid has the properties that its viscosity has drastic changed under some magnetic fields therefore, Magnetorheological fluids has been used for micro polishing of the micro part( for example, a aspherical surface in a micro lens). The polishing process may appears as follows. A part rotating on the spindle is brought into contact with an Magnetorheological finishing(MRF) fluids which is set in motion by the moving wall. In the region where the part and the MRF fluid ate brought into contact, the applied magnetic field creates the conditions necessary for the material removal from the part surface. The material removal takes place in a certain region contacting the surface of the part which can be called the polishing spot or zone. The polishing mechanism of the material removal in the contact zone is considered as a process governed by the particularities of the Bingham flow in the contact zone. Resonable calculated and experimental magnitudes of the material removal rate for glass polishing lends support the validity of the approach.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1873-1876
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• 2003

Magneto-rheological polishing is a new technology used in precision polishing. It utilizes magneto-rheological fluid. nonmagnetic polishing abrasive, aqueous carrier fluids in magnetic field to remove material from a part surface. Silicon micro channel as work piece is fixed in the slurry which is made of MR fluid and CeO$_2$(10 vol%) abrasive particles. And permanent magnet rotate in the slurry to transfers magnetic force to abrasive particles by increasing yield strength of MR fluid. so, the obtained bottom surface roughness of micro channel by experiment reduced to Ra 0.010 $\mu\textrm{m}$ Rmax 0.103 $\mu\textrm{m}$ and finwall surface roughness of micro channel reduced to Ra 0.018 $\mu\textrm{m}$ Rmax 0.468 $\mu\textrm{m}$. At optimum conditions of variables, the workpiece as silicon micro channel have about 24 times smaller surface roughness than before polishing.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.4
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• pp.455-461
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• 2010

Automated magnetic abrasive polishing which can be applied after machining of the mold on a machine tool without unloading is very effective for finishing a complicated injection mold surface. This study aims to realize one step polishing of free form surface with the same machine tool. For this purpose, magnetic flux density according to the change of curvature radii was simulated for selecting polishing conditions and experimental verification was performed with a complicated mold of aluminum alloy. As a result, it was seen by the simulation that the magnetic flux density at a gradual curvature of the mold was higher than at a steep curvature and the higher magnetic flux density produced the better surface roughness in the experimentation. The deviation for the surface roughness of the mold decreased on the whole and the uniform mold surface was obtained after the automated magnetic abrasive polishing.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.7
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• pp.46-52
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• 2004

The Magnetorheological fluid has the properties that its viscosity has drastic changed under some magnetic fields therefore, Magnetorheological fluids has been used fur micro polishing of the micro part(for example, a spherical surface in a micro lens). The polishing process may appears as follows. A part rotating on the spindle is brought into contact with an Magnetorheological finishing(MRF) fluids which is set in motion by the moving wall. In the region where the part and the MRF fluid are brought into contact, the applied magnetic field creates the conditions necessary for the material removal from the part surface. The material removal takes place in a certain region contacting the surface of the part which can be called the polishing spot or zone. The polishing mechanism of the material removal in the contact zone is considered as a process governed by the particularities of the Bingham flow in the contact zone. Resonable calculated and experimental magnitudes of the material removal rate for glass polishing lends support the validity of the approach.