• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.9
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• pp.1013-1018
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• 2014

Magnetic Abrasive Polishing (MAP) process is a nontraditional method for polishing the surface of workpiece by using the flexibility of tool. At present, a mixture of polishing abrasives and ferrous particles is used as the tool in the MAP process. Previously, an experiment was conducted with different sizes of polishing abrasives with an aim to improve the polishing accuracy. However, the sizes of ferrous particles are also expected to have a dominant effect on the process, warranting a study on the effect of the size of ferrous iron particles. In this study, an experiment was conducted using three different sizes of ferrous particles. Iron powder of average diameters 8, 78 and $250{\mu}m$ was used as ferrous particles. The effect of each ferrous particle size was evaluated by comparing the improvements in surface roughness. The particle size of a ferrous iron was found to play a significant role in MAP and particles of $78{\mu}m$ facilitated the best improvement in surface roughness.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.38-42
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• 2002

In the recent, electro-rheological fluid has been used for micro polishing of the 3-dimensional micro-aspherical lens and some sectional parts with defects on the wide flat wafer. The ER fluid has the properties that its viscosity has drastic changed under some electric fields. Therefore, ER fluid can be applicable to the micro polishing fur some parts using these properties. In this paper, the experimental device has been constructed using the precision milling machine in order to micro polishing far some sectional parts of a 4 inches wafer It is consisted of a small steel electrode, a wafer fixture, DC10mA and 5KV power supply unit, and a controller unit. Using the ER experimental device, possibility of amending for wide flat wafer and micro polishing of some micro part has been analyzed.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.10a
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• pp.324-328
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• 2003

The Magnetoeheological fluid has the properties that it's viscosity has dramastic changed under some magnetic fields therefore, Magnetorhlogical fluids has been used for micro polishing of the micro part( for example, a aspherical surface in a micro lens). The polishing process may appears as follows. A part rotating on the spindle is brought into contact with an Magnetorhological finshing(MRF) fluids which is set in motion by the moving wall. In the region where the part and the MRF fulid ate brought into contact, the applied magnetic field creates the conditions necessary for the material removal from the part surface. The material removal takes place in a certain region contacting the surface of the part which can be called the polishing spot or zone. The polishing mechanism of the material removal in the contact zone is considered as a process governed by the particularities of the Bingham flow in the contact zone. Resonable calculated and experimental magnitudes of the material removal rate f3r glass polishing lends support the validity of the approach.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.9
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• pp.179-190
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• 1999

To automate the polishing process, a polishing robot with two axes which is attached to a machining center with three axes has been developed by our previous research. This automatic polishing robot is able to keep the polishing tool normal to the curved surface of die and is able to maintain a constant pneumatic pressure. Therefore, in the case of a curved surface die, the surface roughness to be polished by the system with five axes is improved superior than the surface by a three-axis machining center. However, because the polishing robot was big and heavy, a polishing workspace was limited and then it was difficult to attach the robot to machining center. In this study, the smaller and lighter polishing robot than the previous has been designed to improve defects due to the magnitude and weight of the robot. And the sliding mode control ins applied to polishing robot to improve the tracking performance. To obtain switching parameters of sliding mode control, the signal compression method is used. Code separation program to separate the date for a three-axis machining center and a two-axis polishing robot from a five-axis NC data is improved for users to check conveniently the separated trajectory and to handle many data by using the graphic user interface. To evaluate the polishing performance of the developed robot, the polishing experiment for shadow mask was carried out. The result shows the automatic polishing robot has a good trajectory tracking performance and obtains a good polished workpiece efficiently under recommended polishing conditions.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.625-631
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• 2002

In the previous study, a polishing robot system was developed to automate the polishing process and to cope with the shortage of skilled workers. This polishing robot system has several advantages: reduced time for setting polishing work, decreased labor costs, effective operation, continuous polishing work without an operator, improved machine accuracy, and the ability to polish a free curved surface die. However, still the problem remains that a worker must stay to monitor the polishing process in the poor working conditions for a long time. Nowadays some advanced manufacturing companies need to find a way to check the performance of their production equipments and plants from remote sites. Thus, this study constructed the communication network and developed the monitoring programs (a servo program and a client program) to operate the polishing robot from remote sites. Using these programs, workers are able to monitor and control the polishing robot on the web page, in any place where internet service is possible. To guarantee a stable operation in spite of a variable computer operating environment, the monitoring system is implemented in Java. The experimental results showed that the developed monitoring programs provided a stable communication.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.12
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• pp.1027-1033
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• 2007

In this research, the polishing pad for W CMP has been analyzed to understand stabilization of polishing performance. For stabilization of process, the polishing pad condition is one of important factors. The polishing pad plays a key role in polishing process, because it contact with reacted surface of wafer[1]. The physical property of pad surface is ruled by conditioning tool which makes roughness and profile of pad surface. Pad surface affects on polishing performance such as RR(Removal Rate) and uniformity in CMP. The stabilized pad surface has stable roughness. And its surface has high level of wettability which can increase the probability of abrasive adhesion on pad. The result of this research is that the reduction of break-in and dummy polishing process were achieved by artificial machining to make stable pad surface. In this research, urethane polishing pad which is named IC pad(Nitta-Haas Inc.) and has micro pore structure, is studied. Because, this type of pad is the most conventional type.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.1
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• pp.92-99
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• 2014

An aspherical lens, which resolves several problems with a spherical lens,typically serves asa key part of an optical system. Generally, an aspherical lens is fabricated using a diamond turning machine or by mean of injection molding. However, residual stress and/or tool marks can arise when using a commercial fabricating method such as DTM or injection molding. A polishing process, thus, is commonly used to obtain a high-precision aspherical lens. In this study, a polishing method using MR fluid was applied to minimize several problems, in this case residual stress and the creation of tool marks, during the cutting process. The MR polishing system was developed to polish aspherical lenses. A series of experiments were performed to obtain a very fine surface roughness. PMMA (the lens material for molding) was used as a workpiece, and the gap size, magnetic field intensity, wheel speed and feed rate were selected as the parameters in this study. Finally, a very fine surface roughness of Ra=2.12nm was obtained after MR polishing.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1996.03a
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• pp.137-142
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• 1996

Magnetic-electrolytic-abrasive polishing system(MEAPS) was developed for machining national standard electrode and its finishing characteristics was analyzed. The paper describes the operational principle of MEAP system by experimental results. The finishing characteristics and optimal finishing condition for national standard electrodes were experimented and analyzed. As a result, MEAPS can improve straightness as well as surface roughness.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.12
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• pp.134-141
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• 2002

The ER fluid can be one of efficient materials in ultraprecision polishing for optics, ceramics and semiconductors because of electrically controllable apparent viscosity. To finish small 3 dimensional structures such as the aspherical surface in optical elements, the possible arrangement of a tool, workpiece and auxiliary electrode is described. We examined the influence of the addition of a few abrasive particles on the performance of the ER fluid by measuring yield stress, and observed the behavior of abrasive particles in the ER fluid by a CCD camera, which is also theoretically predicted from the electromechanical principles of particles. On the basis of the above results, the steady flow analysis around the rotating micro tool is worked out considering the non-uniform electric field. Finally, Pyrex glass is polished using the mixture of the ER fluid and abrasive particles, and the effect of the electric field strength is evaluated.

• International Journal of Control, Automation, and Systems
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• v.6 no.3
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• pp.386-393
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• 2008

A position control method for interpolating aspherical grinding and polishing tool path was reviewed and experimented in a nano precision machine. The position-base algorithm was reformed from the time-base algorithm, proposed in the previous study. The characteristics of the algorithm were in the velocity control loop with position feedback. The aspherical surface was divided by an interval at which each velocity and acceleration were calculated. The theoretical velocity was corrected by position error during processing. In the experiment, a machine was constructed and nano-scale linear encoders were installed at each axis. Relation between process parameters and the variation of position error was monitored and discussed. The best result from optimized parameters showed that the accuracy was 150nm and improved from the previous report.