• 제목/요약/키워드: Polishing System

검색결과 329건 처리시간 0.034초

최소 이송 기구를 갖는 PC-NC 기반의 비구면 렌즈 연마 장치에 관한 연구 (A Study on PC-NC Based Aspherical Lens Polishing System with Minimum Translation Mechanism)

  • 양민양;이호철
    • 한국정밀공학회지
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    • 제18권7호
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    • pp.65-71
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    • 2001
  • The development process of the polishing system for the aspherical lens mold for opto-electronics industry is described. The system uses the method that polishing tool is scanned on the surface under PC-NC control for the aspherical lens mold. The two axes interpolation of the minimum translation mechanism is applied to give uniform working condition by motion analysis. An aspherical surface is divided into multiple sections and each dwell time is calculated from the polishing rate model based on the Preston equation. As result of form error compensation experiment, initial form error is decreased about 25% while an average value of surface roughness is also reduced successfully from 180nm to 19nm.

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MAGIC 숫돌 구성요소의 배합율이 연마면 조도에 미치는 영향 (Influence of Wheel Elements Composition Rate on Polished Surface Roughness)

  • 김남우;백종흔;이상태;정윤교
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2002년도 추계학술대회 논문집
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    • pp.319-323
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    • 2002
  • Recently, new polishing system which was made by magnetic intelligent compound (MAGIC) was invented and, the study is going on for practical use the analysis of factors, that is, the kind of polishing grain, composition ratio of wheel elements, machining frequency, polishing pressure, which the main influence for polishing efficiency are the first step. In this study, analyzed influence of wheel raw material composition ratio on surface roughness.

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머시닝센터 장착형 연마 로봇의 성능 향상에 관한 연구 (A study on the improvement of performance of polishing robot attached to machining center)

  • 조영길;이민철;전차수
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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    • pp.1275-1278
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    • 1997
  • Cutting process has been automated by progress of CNC and CAD/CAM, but polishing process has been depended on only experiential knowledge of expert. To automate the polishing pricess polishing robot with 2 degrees of freedom which is attached to a machining center with 3 degrees of freedom has been developed. this automatic polishing robot is able to keep the polishing tool normal on the curved surface of die to improve a performance of polishing. Polishing task for a curved surface die demands repetitive operation and high precision, but conventional control algorithm can not cope with the problem of disturbance such as a change of load. In this research, we develop robust controller using real time sliding mode algorithm. To obtain gain parameters of sliding model control input, the signal compression method is used to identify polishing robot system. To obtain an effect of 5 degrees of freedom motion, 5 axes NC data for polishing are divided into data of two types for 3 axis machining center and 2 axis polishing are divided into data of two types for 3 axis machining center and 2 axis polishing robot. To find an efficient polishing condition to obtain high quality, various experiments are carried out.

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The effect of various polishing systems on surface roughness and phase transformation of monolithic zirconia

  • Caglar, Ipek;Ates, Sabit Melih;Duymus, Zeynep Yesil
    • The Journal of Advanced Prosthodontics
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    • 제10권2호
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    • pp.132-137
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    • 2018
  • PURPOSE. The purpose of this study was to evaluate and compare three polishing systems on the surface roughness and phase transformation of monolithic zirconia. MATERIALS AND METHODS. 100 disk shaped specimens (10 mm diameter, 3 mm thickness) were fabricated from monolithic zirconia blocks. 20 specimens were left as a control group and remaining specimens were grinded by diamond bur to simulate the occlusal adjustments. Grinded specimens were randomly divided into 4 groups: group G (no polishing), group M (Meisinger, zirconia polishing kit), group E (EVE Diacera, zirconia polishing kit), and group P (EVE Diapol, porcelain polishing kit). Surface roughness was measured with profilometer and surface topography was observed with SEM. XRD analysis was performed to investigate the phase transformation. Statistical analysis was performed with one-way ANOVA and Tukey's post hoc tests at a significance level of P=.05. RESULTS. All polishing groups showed a smoother surface than group G. Among 3 polishing systems, group M and group E exhibited a smoother surface than the group P. However, no significant differences were observed between group M and group E (P>.05). Grinding and polishing did not cause phase transformations in zirconia specimens. CONCLUSION. Zirconia polishing systems created a smoother surface on zirconia than the porcelain polishing system. Phase transformation did not occur during the polishing procedure.

MR Fluid Jet Polishing 시스템에 의한 Fused Silica Glass 연마특성 고찰 (Investigation of Polishing Characteristics of Fused Silica Glass Using MR Fluid Jet Polishing)

  • 이정원;조용규;조명우
    • 한국생산제조학회지
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    • 제21권5호
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    • pp.761-766
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    • 2012
  • Abrasive fluid jet polishing processes have been used for the polishing of optical surfaces with complex shapes. However, unstable and unpredictable polishing spots can be generated due to the fundamental property of an abrasive fluid jet that it begins to lose its coherence as the jet exits a nozzle. To solve such problems, MR fluid jet polishing has been suggested using a mixture of abrasives and MR fluid whose flow properties can be readily changed according to imposed magnetic field intensity. The MR fluid jet can be stabilized by imposed magnetic fields, thus it can remain collimated and coherent before it impinges upon the workpiece surface. In this study, MR fluid jet polishing characteristics of fused silica glass were investigated according to injection time and magnetic field intensity variations. Material removal rates and 3D profiles of the generated polishing spots were investigated. From the results, it can be confirmed that the developed MR fluid polishing system can be applied for stable and predictable precise polishing of optical parts.

요동형 공구와 AE센서를 이용한 연마면 향상에 관한 연구 (A study on the improvement of polishing surface using Oscillation-type tool and AE sensor)

  • 김정욱;김성렬;안중환
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.1682-1687
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    • 2003
  • Die polishing technology is very critical to determine quality and performance of the final products. Generally, the rotation-type tool is used most widely in the polishing process. However it is difficult to make the mirror surface, because the method using the rotation-type tool causes a lot of tiny scratch on the polished surface. This paper proposes a new method using the oscillation-type tool that reduces the scratch and improves the surface roughness. As result. the mirror surface was able to obtain by using the oscillation-type tool. AE is known to be closely related to material removal rate(MRR). As the surface is rougher, MRR gets larger and AE increase. The surface roughness can be indirectly estimated using the AE signal measured during automatic die polishing process. In this study. an AE sensor based monitoring system was developed to investigate the relation the level of AE RMS with the surface roughness during polishing process.

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AE신호 분석을 통한 비자성체의 자기연마 모니터링에 관한 연구 (A Study on Monitoring of the MAP for Non-magnetic Material by AE Signal Analysis)

  • 이성호;김상오;곽재섭
    • 한국생산제조학회지
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    • 제20권3호
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    • pp.304-309
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    • 2011
  • A monitoring system for magnetic abrasive polishing process is necessary to ensure the polishing products the high quality and integrity. Acoustic emission (AE) signal is known to reflect the material removal phenomena in other machining processes. In a case of the magnetic abrasive polishing of non-magnetic materials, application of AE method is very difficult because of lower machining force on the surface of workpiece and the level of AE signal is extremely lower. In this study, AE sensor-based monitoring system is applied to the magnetic abrasive polishing. The relation between the level of the AE RMS and the surface roughness during the magnetic abrasive polishing of magnesium alloy steel is investigated.

초음파 폴리싱 시스템의 개발 및 특성 (The Polishing Characteristics and Development of Ultrasonic Polishing System)

  • 문홍현;박병규;김성청;이찬호
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 춘계학술대회
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    • pp.1014-1020
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    • 2003
  • We have developed the ultrasonic polishing system to get super finishing that consist of machine part that can rotate and travel the main shaft with power 1.5kW, ultrasonic generator with frequency 20kHz. By using this system we were investigated the characteristics of ultrasonic polishing and deduced the major facters which affect the surface roughness by the experimental plans for three different materials such as ceramic, glass, and wafer, and so could be obtained following results. We could be obtained the excellent surface for hard-to-difficult cutting materials. The rotating speed could be found to be major factor influencing the surface roughness. In the case of ceramic and wafer, we were able to obtain good surface roughness when the feed rate and ultrasonic output is higher. In the case of glass, the surface roughness becames worse when ultrasonic output is higher because of increasing of load affacting on the particles in slurry.

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탈이온수의 압력과 정제된 $N_2$가스가 ILD-CMP 공정에 미치는 영향 (Influence of DI Water Pressure and Purified $N_2$Gas on the Inter Level Dielectric-Chemical Mechanical Polishing Process)

  • 김상용;이우선;서용진;김창일;장의구
    • 한국전기전자재료학회논문지
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    • 제13권10호
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    • pp.812-816
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    • 2000
  • It is very important to understand the correlation of between inter dielectric(ILD) CMP process and various facility factors supplied to equipment to equipment system. In this paper, the correlation between the various facility factors supplied to CMP equipment system and ILD-CMP process was studied. To prevent the partial over-polishing(edge hot-spot) generated in the wafer edge area during polishing, we analyze various facilities supplied at supply system. With facility shortage of D.I water(DIW) pressure, we introduced an adding purified $N_2$(P$N_2$)gas in polishing head cleaning station for increasing a cleaning effect. DIW pressure and P$N_2$gas factors were not related with removal rate, but edge hot-spot of patterned wafer had a serious relation. We estimated two factors (DIW pressure and P$N_2$gas) for the improvement of CMP process. Especially, we obtained a uniform planarity in patterned wafer and prohibited more than 90% wafer edge over-polishing. In this study, we acknowledged that facility factors supplied to equipment system played an important role in ILD-CMP process.

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