• Journal of Korean Society on Water Environment
• /
• v.23 no.5
• /
• pp.642-649
• /
• 2007

The effectiveness of add-on tertiary treatment processes for the polishing of the effluent of a biological nutrient removal (BNR) system from a modified $A^2/O$ process has been examined under the field condition with pilot-scale plants. The add-on treatment processes of 1) combined biofilm anoxic reactor and sand filtration, and 2) two-stage denitrification filter had been operated with various operating conditions. The experimental results indicated that two-stage denitrification filter could produced a better polished tertiary effluent. Filtration rate of $150m^3/m^2{\cdot}d$ for the 2-stage denitrifying filter could decrease the nitrate removal probably due to shorter detention time that caused insufficient reaction for denitrification. Two stage denitrification filter operated with M/N ratio of 3.0 and filtration rate of $100m^3/m^2{\cdot}d$ produced the tertiary effluent with nitrate and SS concentraitons of 2.8 mg/L and 2.3 mg/L, respectively. When the operating temperature reduced $30^{\circ}C$ to $18^{\circ}C$, $NO_3{^-}-N$ removal efficiency decreased from 73% to 68%.

• Transactions on Electrical and Electronic Materials
• /
• v.8 no.1
• /
• pp.5-10
• /
• 2007

Using a reference slurry, ammonium dodecyl sulfate (ADS), an anionic and environmentally friendly surfactant, was investigated as an alternative to BTA for its inhibition and lubrication characteristics. Results demonstrated that the inhibition efficiency of ADS was superior to that of BTA. Coefficient of friction (COF) was the lowest when the slurry contained ADS. This suggested that adsorbed ADS on the surface provided lubricating action thereby reducing the wear between the contacting surfaces. Temperature results were consistent with the COF and removal rate data. ADS showed the lowest temperature rise again confirming the softening effect of the adsorbed surfactant layer and less energy dissipation due to friction. Spectral analysis of shear force showed that increasing the pad-wafer sliding velocity at constant wafer pressure shifted the high frequency spectral peaks to lower frequencies while increasing the variance of the frictional force. Addition of ADS reduced the fluctuating component of the shear force and the extent of the pre-existing stick-slip phenomena caused by the kinematics of the process and collision event between pad asperities with the wafer. By contrast, in the case of BTA, there were no such observed benefits but instead undesirable effects were seen at some polishing conditions. This work underscored the importance of real-time force spectroscopy in elucidating the adsorption, lubrication and inhibition of additives in slurries in CMP.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.111-111
• /
• 2008

태양전지는 태양에너지를 직접 전기에너지로 변환시켜주는 광전 소자로서 구조적으로 단순하고 제조 공정도 비교적 간단하지만, 실용화를 위해서는 비용적인 측면이 많은 걸림돌이 되고 있다. 기존의 실리콘 태양전지는 낮은 광흡수율, 고비용임에도 불구하고 가장 많이 활용되고 있는 태양전지 기술이다. 그러나 태양전지의 경제성 향상과 실용화를 위해서는 기존의 실리콘 태양전지 보다 고효율 및 고신뢰도의 박막형 태양전지의 개발이 필요하다. 박막헝 태양전지의 재료로는 비정질 실리콘, 다결정 실리콘. CIGS, CdTe 등이 있다. 그 중에서도 박막형 태양전지에 광흡수층 물질로는 밴드갭 에너지 (l.4eV 부근), 변환 효율, 경제성 등을 고려했을 때 II-VI족 화합물인 CdTe가 가장 적합한 것으로 각광받고 있다. 하지만 아직까지 실리콘 태양전지에 비해 효율이 많이 떨어지는 단점을 가지고 있기 때문에 효율을 더 끌어올리기 위한 연구가 활발히 진행되고 있는 실정이다. 또한 CMP(chemical mechanical polishing) 공정은 반도체 박막 분야뿐만 아니라 물리, 화학 반응의 기초 연구에도 널리 응용이 되는 기술로써, 시료와 연마 패드 사이의 회전마찰에 의한 기계적 연마와 연마제 (abrasive) 에 의한 화학적 에칭으로 박막 표면을 평탄화하는 기술이다. 본 연구에서는 sputtering 법에 의해 증착된 CdTe 박막에 CMP 공정을 적용하여 표면 특성을 개선한 뒤 태양전지 변환 효율과 직접적인 연관성을 가지고 있는 표면 및 광특성의 변화를 CMP 공정 전과 후로 비교하였다. 표면의 변화를 관찰하기 위해서 AFM(atomic forced microscope) 과 SEM(scanning electron microscopy) 을 이용하였으며, 광특성의 비교를 위해서 흡수율과 PL특성을 측정하였다.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.34 no.9
• /
• pp.1311-1316
• /
• 2010

In this study, straight slot welding was carried out using a 316L stainless steel test block, and numerical simulation of the slot weld process was performed using finite element analysis. Data on the residual stress were obtained at equally spaced points on the top surface of the test block along directions parallel and perpendicular to the welding direction. After electrolytic polishing of the top surface of the block, the residual stress was measured by the X-ray diffraction method. The calculated weld residual stresses were compared with the measured data, and they were in good agreement with the data. The weld residual stress distribution inside the plate was determined from the results of finite element analysis, and the characteristics of the distribution were discussed in detail in this paper.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.07a
• /
• pp.382-385
• /
• 2003

Chemical mechanical polishing(CMP) is an essential process in the production of copper-based chips. On this work, the stability of Hydrogen Peroxide($H_2O_2$) as oxidizer of Cu CMP slurry has been investigated. $H_2O_2$ is known as the most common oxidizer in Cu CMP slurry. Copper slowly dissolves in $H_2O_2$ solutions and the interaction of $H_2O_2$ with copper surface had been studied in the literature. Because hydrogen peroxide is a weak acid in aqueous solutions, a passivation-type slurry chemistry could be achieved only with pH buffered solution.[1] Moreover, $H_2O_2$ is so unstable that its stabilization is needed using as oxidizer. As adding KOH as pH buffering agent, stability of $H_2O_2$ decreased. However, stability went up with putting in small amount of BTA as film forming agent. There was no difference of $H_2O_2$ stability between KOH and TMAH at same pH. On the other hand, $H_2O_2$ dispersion of TMAH is lower than that of KOH. Furthermore, adding $H_2O_2$ in slurry in advance of bead milling lead to better stability than adding after bead milling. Generally, various solutions of phosphoric acids result in a higher stability. Using Alumina C as abrasive was good at stabilizing for $H_2O_2$; moreover, better stability was gotten by adding $H_3PO_4$.

• Journal of the Korean Society of Industry Convergence
• /
• v.12 no.2
• /
• pp.99-105
• /
• 2009

Among a few items with world wide competitiveness are the semiconductor and the LCD. Grinding/polishing is the most significant process in manufacturing semiconductor wafers and LCD panels, the most critical quality of which is the precision rate of the machined surfaces. It is well known that the control of the vibrations is the major factor in maintaining superb machined surfaces. In this paper the dynamic properties of a grinding machine have been investigated through the frequency analysis test and the computer simulation to deduce ideas of design modifications for improved stability. The alterations have been applied to the simulation model, which is supposed to have identical dynamic property with the original structure, to identify the effects and to finally achieve the satisfactory level of stability. The result shows that the machine can have much improved stability with relatively simple design changes, and also can improve the surface quality of the products.

• Journal of the Korean Ceramic Society
• /
• v.40 no.1
• /
• pp.77-80
• /
• 2003

Adsorption of glycine on$Si_3N_4$powder surface has been investigated, which is supposed to enhance the formation of passive layer inhibiting oxidation in aqueous solution. In the basic solution, multinuclear surface complexing between Si and dissociated ligands was responsible for the saturated adsorption of glycine. In addition, $CeO_2$-based CMP slurry containing glycine was manufactured and then applied to planarize$SiO_2$and$Si_3N_4$thin film. Owing to the passivation by glycine, the removal rates, Rh, were decreased, however, the selectivities, RE(SiO$_2$)/RR($Si_3N_4$), increased and showed maximum at pH=12. The suppressed oxidation and dissolution by adsorbate were correlated with the dissociation behavior of glycine at different pH and subsequent chemical adsorption.

• 한국문화재보존과학회:학술대회논문집
• /
• 2004.10a
• /
• pp.43-54
• /
• 2004

In the course of examining the metallic structure of Iron chisel and Iron arrowhead, a relics of the 16th or 17th of Chosun Dynasty unearthed at near Gangsun-tower, Chengpyeong temple, we collected un-eroded samples from the relics and looked into the metallic structure through mounting, grinding and polishing, and etching, while analyzing non-metallic inclusion via SEM and EDS. The research metallic structure and SEM-SDS analysis, found that Iron chisel and Iron arrowhead had been produced from sponge iron close to pure Iron made by solid low heat reducing and then increased in rate of carbon by carburizing, It also found that Iron chisel had been hardened through the repetitive process of quench hardening and heat treatment, after being increased in amount of carbon to a certain level. Up to now, there have been a number of studies in the domestic academia which were made primarily of the structure of metallic relics of three countries the period or tile era before that. Although this research was limited in type and number of the relics, it turned out to be Interesting in that it revealed the 16thor 17th century way of processing iron, even in fragments. It is thought to be fruitful that we found iron had been made even in the Chosun Dynasty from sponge iron. It is recommended that researches be made on the relics later to be excavated and originally made in $Kory\breve{o}$ or Chosun Dynasty, because they are important in history of metal technology.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2016.11a
• /
• pp.153-153
• /
• 2016

Aluminum alloys have poor corrosion resistance compared to the pure aluminum due to the additive elements. Thus, anodizing technology artificially generating thick oxide films are widely applied nowadays in order to improve corrosion resistance. Anodizing is one of the surface modification techniques, which is commercially applicable to a large surface at a low price. However, most studies up to now have focused on its commercialization with hardly any research on the assessment and improvement of the physical characteristics of the anodized films. Therefore, this study aims to select the optimum temperature of sulfuric electrolyte to perform excellent corrosion resistance in the harsh marine environment through electrochemical experiment in the sea water upon generating porous films by variating the temperatures of sulfuric electrolyte. To fabricate uniform porous film of 5083 aluminum alloy, we conducted electro-polishing under the 25 V at $5^{\circ}C$ condition for three minutes using mixed solution of ethanol (95 %) and perchloric (70 %) acid with volume ratio of 4:1. Afterward, the first step surface modification was performed using sulfuric acid as an electrolyte where the electrolyte concentration was maintained at 10 vol.% by using a jacketed beaker. For anode, 5083 aluminum alloy with thickness of 5 mm and size of $2cm{\times}2cm$ was used, while platinum electrode was used for cathode. The distance between the two was maintained at 3 cm. Afterward, the irregular oxide film that was created in the first step surface modification was removed. For the second step surface modification process (identical to the step 1), etching was performed using mixture of chromic acid (1.8 wt.%) and phosphoric acid (6 wt.%) at $60^{\circ}C$ temperature for 30 minutes. Anodic polarization test was performed at scan rate of 2 mV/s up to +3.0 V vs open circuit potential in natural seawater. Surface morphology was compared using 3D analysis microscope to observe the damage behavior. As a result, the case of surface modification presented a significantly lower corrosion current density than that without modification, indicating excellent corrosion resistance.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.23 no.2
• /
• pp.101-107
• /
• 2013

Cerium compounds such as Cerium hydroxide ($Ce(OH)_3$), Cerium chloride ($CeCl_3{\cdot}nH_2O$), Cerium carbonate hydrate ($Ce_2(CO_3)_3{\cdot}8H_2O$), Cerium oxide ($CeO_2$) were synthesized using recycled Ce precursor. Cerium(IV) oxide of nanoparticles were obtained by Ultra-sonication. Cerium-sodium- sulfate compound was synthesized through acid-leaching and addition of sodium sulfate from 99 wt% purity of Ce precursor as a starting material that was recycled from the waste polishing slurry. Moreover Cerium hydroxide was obtained from Cerium-sodium-sulfate compound by adding to sodium hydroxide solution. Then Cerium chloride was synthesized by adding of hydrochloric acid to Cerium hydroxide. Needle-shaped Cerium carbonate hydrate was synthesized in the continuous process and Cerium(IV) oxide with 30~40 nm size was subsequently obtained by the calcinations and dispersion.