• 제목/요약/키워드: Plating technique

검색결과 152건 처리시간 0.019초

이온 플레이팅 응용 스퍼터링 장치에 관한 연구 (A Study on the Sputtering System Using Ion Plating Technique)

  • 정연호;최영욱
    • 전기학회논문지
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    • 제56권12호
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    • pp.2179-2183
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    • 2007
  • In this paper, to produce sheet plasma with high density for ion plating, we designed magnetic circuit of ion plating device consisting of solenoid coil and rectangular permanent magnet. And, we analyzed the effects of the magnetic field distribution using FEM (Finite Element Methode). Additionally, we made a sputtering system including ion plating technique on the basis of the design and verified the possibility of the sheet plasma application for advanced sputter system.

무전해 니켈/금도금 기술 개발에 관한 연구 (The Study on Development of Plating Technique on Electroless Ni/Au)

  • 박수길;박종은;정승준;엄재석;전세호;이주성
    • 전기화학회지
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    • 제2권3호
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    • pp.138-143
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    • 1999
  • 최근 large scale integrated circuits(LSI) 및 printed circuit board(PCB)의 세밀화가 전자기기의 소형화로 인하여 필수 불가결하게 되었다. 전해 도금은 LSI및 PCB의 전도도 및 부식저항을 향상시키기 위해서 전도성 라인의 말단에 적용되고 있다. 그러나 회로 기판의 소형화 및 고직접화로 인하여 적용되지 못하고 있다. 따라서 최근 무전해 도금은 복잡한 장치와 외부에서 전원을 필요치 않는 작동의 간편함 때문에 매우 각광 받고 있는 방법 중의 하나이다. 본 연구는 무전해 니켈/금도금의 도금 기술 개발을 위해 시험하였다. 무전해 니켈 도금은 $85^{\circ}C$의 도금 욕에서 PCB기판 위에 침적 시켰고 그 다음 금층은 동일한 방법으로 $90^{\circ}C$에서 니켈 층위에 침적 시켰다. Bonderbility는 무전해 니켈/금도금의 안정성을 평가하기 위해 gold wire 또는 solder ball 테스트로 실험하였다.

PCB 및 패키징 공정에서의 도금 시뮬레이션 기술 적용 (Application of Plating Simulation for PCB and Pakaging Process)

  • 이규환
    • 마이크로전자및패키징학회지
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    • 제19권3호
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    • pp.1-7
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    • 2012
  • Electroplating technology is widely used in semiconductor microelectronic industry. With the development of semiconductor integrated circuit to high density and light-small scale, Extremely high quality and plated uniformity of the deposited metals are needed. Simulation technique can help to obtain better plating results. Although a few plating simulation softwares have been commercialized, plating simulation is not widely prevalent in Korea. In this paper, principle of electroplating and mathematical modeling of plating simulation are discussed. Also introduced are some cases enhancing plating thickness uniformity on leadframe, PCB and wafer by using plating simulation.

Electroplating of Nickel on Nickel Titanate Modified Mild Steel Surface

  • Beenakumari, K.S.
    • Journal of Electrochemical Science and Technology
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    • 제4권2호
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    • pp.57-60
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    • 2013
  • Nickel is a good electrocatalytic metal and nickel electrodes find many applications in different electrochemical fields. The nickel plated electrodes were prepared by electro-deposition technique on mild steel surface modified with in-situ deposition of nickel titanate. The SEM images shows that the nickel plating on nickel titanate modified mild steel shows better adherence than the nickel plating on bare mild steel surfaces. The extent of polarization of the nickel plating on mild steel with nickel titanate was lower than that of nickel plating on mild steel. The incorporation of nickel titanate on mild steel surface before nickel plating enhances physical, chemical and electrochemical properties of the plating film.

Ni Plating Technology for PWR Reactor Vessel Cladding Repair

  • Hwang, Seong Sik;Kim, Dong Jin
    • Corrosion Science and Technology
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    • 제18권5호
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    • pp.190-195
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    • 2019
  • SA508 low-alloy steel for a reactor vessel was exposed to primary water in a pressurized water reactor (PWR) plant because the cladding layer of type 309 stainless steel for the RPV was removed, due to an accident in which the detachment of the thermal sleeve occurred. The major advantage of the electrochemical deposition (ECD) Ni plating technique is that the reactor pressure vessel can be repaired without significant thermal effects, and Ni has solid corrosion resistance that can withstand boric acid. The corrosion rate assessment of the damaged part was performed, and its trend was analyzed. Essential variables of the Ni plating for repair of the damaged part were derived. These conditions are applicable variables for the repair plating device, and have been carefully adjusted using the repair plating device. The process for establishing ASME technical standards called Code Case N-840 is described. The process of developing Ni-plating devices, and the electroplating procedure specification (EPS) are described.

Characterizations of Cr-P-PTFE composite coatings electroplated from trivalent chromium-based bath

  • Park, Jong-Kyu;Byoun, Young-Min;Seo, Sun-Kyo;Park, Su-Young;Choi, Sun-Woo
    • Journal of Ceramic Processing Research
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    • 제19권6호
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    • pp.455-460
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    • 2018
  • Chromium plating is a common surface treatment technique extensively applied in industry due its excellent properties which include substantial hardness, abrasion resistance, corrosion resistance, surface color, and luster. In this study, the effect of PTFE on corrosion behavior of Cr-P plating, low carbon steel substrates are electroplated in Cr(III) baths without and with PTFE. Trivalent chromium carbon plating was electroplated from trivalent chromium sulfate-based baths with different PTFE dispersion contents. The study focused on the microstructure, PTFE content, roughness, and corrosion resistance of the Cr-P-PTFE composite plating. Scanning electron microscopy and atomic force microscopy images showed a smoother plating and a decrease in the surface roughness of the electrodeposited. The results demonstrate that PTFE eliminates the cracks within plating by reducing internal stress. Therefore, the corrosion resistance of Cr-P-PTFE composite platings were better than that of Cr-P alloy platings.

Feasible waste liquid treatment from electroless nickel-plating by intense magnetic field of HTS bulk magnets

  • Oka, T.;Furusawa, M.;Sudo, K.;Dadiel, L.;Sakai, N.;Seki, H.;Miryala, M.;Murakami, M.;Nakano, T.;Ooizumi, M.;Yokoyama, K.;Tsujimura, M.
    • 한국초전도ㆍ저온공학회논문지
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    • 제23권3호
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    • pp.37-40
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    • 2021
  • Nickel (Ni) is a kind of the rare earth resources. Since Ni-containing waste is drained after several plating operations in the factories, the effective recycling technique has been expected to be introduced. An actual magnetic separation technique using HTS bulk magnet generating the strong magnetic field has succeeded in collecting the paramagnetic slurry containing Ni-sulphate coarse crystals which were fabricated from the Ni-plating waste. The Ni compound in the collected slurry was identified as NiSO4/6H2O, showing slight differences in the particle size and magnetic susceptibility between the samples attracted and not-attract to the magnetic pole. This preferential extraction suggests us a novel recycling method of Ni resource because the compound is capable of recycling back to the plating processes as a raw material.

304L 스테인리스강 분말의 내식성 개선을 위한 무전해 구리 도금과 분말 소결체의 내식성 조사 연구 (Electroless Copper Plating on 304L Stainless Steel Powders and Corrosion Resistance of the Sintered Compacts of Composite Powders)

  • 안재우;이재훈
    • 대한금속재료학회지
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    • 제47권2호
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    • pp.79-90
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    • 2009
  • A study has been made about the effects of powder content, reaction temperature, reaction time, and stirring speed on the preparation of the stainless steel(STS) 304L powders plating with copper by an electroless plating method. The behavior of corrosion resistance of the sintered STS-Cu composite powders was also investigated by the salt spraying test The electroless plating technique was an effective method to manufactur the copper-uniform plating composite powders, the corrosion resistance of this sintered specimen was improved bysuppressing Cr precipitates on grain boundaries in the sintered compacts of composite powders.

Effect of Plating Parameters on the Electrodeposition of Ni-alumina Nanocomposite

  • Gyawalia, Gobinda;Woo, Dong-Jin;Lee, Soo-Wohn
    • 한국표면공학회지
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    • 제43권4호
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    • pp.165-169
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    • 2010
  • $Ni-Al_2O_3$ nanocomposite coatings were fabricated by conventional electrodeposition technique using nickel sulfamate bath. Effect of plating parameters on electrodeposition of $Ni-Al_2O_3$ nanocomposite were studied. The properties of the nano composite were investigated by using SEM, XRD, and Vicker's microhardness test. The results demonstrated that $Al_2O_3$ incorporation in the composite coatings was found to be increased by increasing stir rate and $Al_2O_3$ content in plating bath. Microhardness of the composite coatings was also increased with increasing content of the nano particles in the plating bath. The surface morphologies of the nanocomposite coatings were found to be varied with varying pH, current densities as well as alumina content in the plating bath.

스크린 인쇄와 전해 도금의 응용에 관한 연구 (A Study on Applying an Electrolytic Plating to a Screen Printing)

  • 강봉근
    • 한국인쇄학회지
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    • 제18권2호
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    • pp.133-141
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    • 2000
  • Enhanced the value of badge good with the gold plating of emblem, sports pictogram, mascot in 2002 Asian Game and World Cup, applying the plating and coating technique to screen printing. In addition, tourist and characteristic goods were of great value and image of visual communication displayed outside. After the screen printing in the surface of stainless steel, it obtained the plate coloring of beautiful a black glossy with a black Ru plating. At the identical surface, it did that the electrodeposition coating process in order to making a conductor state of image areas and a nonconductor state of nonimage areas. After the electrodeposition process, it removed the printing ink of image areas with solvent. A manufacturing process, it removed the printing ink of image areas with solvent. A manufacturing process completed with copper, nickel and gold plating at bared metal surface.

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