• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.12
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• pp.2179-2183
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• 2007

In this paper, to produce sheet plasma with high density for ion plating, we designed magnetic circuit of ion plating device consisting of solenoid coil and rectangular permanent magnet. And, we analyzed the effects of the magnetic field distribution using FEM (Finite Element Methode). Additionally, we made a sputtering system including ion plating technique on the basis of the design and verified the possibility of the sheet plasma application for advanced sputter system.

• Journal of the Korean Electrochemical Society
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• v.2 no.3
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• pp.138-143
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• 1999

Recently, miniaturization of large scale integrated circuits (LSI) and printed circuit board (PCB) have become essential with the downsizing of electronic devices. Gold electroplating is applied of conductivity wiring or terminals for improvement of conductivity and corrosion resistance. However, electroplating is not applicable since the circuits are becoming finer and denser. Accordingly, electroless plating is recently highly attractive method because of the simplicity of the operation requiring no external source of current and no elaborate equipment. In this work, we tried to develop a plating technique on electroless Ni/Au plating. First, the electroless Ni plating was deposited on the PCB with agitation in the bath at $85^{\circ}C$. Then the Au layer was deposited on the Ni layer surface by same method at $90^{\circ}C$. The bonderability were tested in order to evaluate the stability of the electroless Ni/Au by gold wire or solder ball test.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.1-7
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• 2012

Electroplating technology is widely used in semiconductor microelectronic industry. With the development of semiconductor integrated circuit to high density and light-small scale, Extremely high quality and plated uniformity of the deposited metals are needed. Simulation technique can help to obtain better plating results. Although a few plating simulation softwares have been commercialized, plating simulation is not widely prevalent in Korea. In this paper, principle of electroplating and mathematical modeling of plating simulation are discussed. Also introduced are some cases enhancing plating thickness uniformity on leadframe, PCB and wafer by using plating simulation.

• Journal of Electrochemical Science and Technology
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• v.4 no.2
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• pp.57-60
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• 2013

Nickel is a good electrocatalytic metal and nickel electrodes find many applications in different electrochemical fields. The nickel plated electrodes were prepared by electro-deposition technique on mild steel surface modified with in-situ deposition of nickel titanate. The SEM images shows that the nickel plating on nickel titanate modified mild steel shows better adherence than the nickel plating on bare mild steel surfaces. The extent of polarization of the nickel plating on mild steel with nickel titanate was lower than that of nickel plating on mild steel. The incorporation of nickel titanate on mild steel surface before nickel plating enhances physical, chemical and electrochemical properties of the plating film.

• Corrosion Science and Technology
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• v.18 no.5
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• pp.190-195
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• 2019

SA508 low-alloy steel for a reactor vessel was exposed to primary water in a pressurized water reactor (PWR) plant because the cladding layer of type 309 stainless steel for the RPV was removed, due to an accident in which the detachment of the thermal sleeve occurred. The major advantage of the electrochemical deposition (ECD) Ni plating technique is that the reactor pressure vessel can be repaired without significant thermal effects, and Ni has solid corrosion resistance that can withstand boric acid. The corrosion rate assessment of the damaged part was performed, and its trend was analyzed. Essential variables of the Ni plating for repair of the damaged part were derived. These conditions are applicable variables for the repair plating device, and have been carefully adjusted using the repair plating device. The process for establishing ASME technical standards called Code Case N-840 is described. The process of developing Ni-plating devices, and the electroplating procedure specification (EPS) are described.

• Journal of Ceramic Processing Research
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• v.19 no.6
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• pp.455-460
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• 2018

Chromium plating is a common surface treatment technique extensively applied in industry due its excellent properties which include substantial hardness, abrasion resistance, corrosion resistance, surface color, and luster. In this study, the effect of PTFE on corrosion behavior of Cr-P plating, low carbon steel substrates are electroplated in Cr(III) baths without and with PTFE. Trivalent chromium carbon plating was electroplated from trivalent chromium sulfate-based baths with different PTFE dispersion contents. The study focused on the microstructure, PTFE content, roughness, and corrosion resistance of the Cr-P-PTFE composite plating. Scanning electron microscopy and atomic force microscopy images showed a smoother plating and a decrease in the surface roughness of the electrodeposited. The results demonstrate that PTFE eliminates the cracks within plating by reducing internal stress. Therefore, the corrosion resistance of Cr-P-PTFE composite platings were better than that of Cr-P alloy platings.

• Progress in Superconductivity and Cryogenics
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• v.23 no.3
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• pp.37-40
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• 2021

Nickel (Ni) is a kind of the rare earth resources. Since Ni-containing waste is drained after several plating operations in the factories, the effective recycling technique has been expected to be introduced. An actual magnetic separation technique using HTS bulk magnet generating the strong magnetic field has succeeded in collecting the paramagnetic slurry containing Ni-sulphate coarse crystals which were fabricated from the Ni-plating waste. The Ni compound in the collected slurry was identified as NiSO₄/6H₂O, showing slight differences in the particle size and magnetic susceptibility between the samples attracted and not-attract to the magnetic pole. This preferential extraction suggests us a novel recycling method of Ni resource because the compound is capable of recycling back to the plating processes as a raw material.

• Korean Journal of Metals and Materials
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• v.47 no.2
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• pp.79-90
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• 2009

A study has been made about the effects of powder content, reaction temperature, reaction time, and stirring speed on the preparation of the stainless steel(STS) 304L powders plating with copper by an electroless plating method. The behavior of corrosion resistance of the sintered STS-Cu composite powders was also investigated by the salt spraying test The electroless plating technique was an effective method to manufactur the copper-uniform plating composite powders, the corrosion resistance of this sintered specimen was improved bysuppressing Cr precipitates on grain boundaries in the sintered compacts of composite powders.

• Journal of the Korean institute of surface engineering
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• v.43 no.4
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• pp.165-169
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• 2010

$Ni-Al_2O_3$ nanocomposite coatings were fabricated by conventional electrodeposition technique using nickel sulfamate bath. Effect of plating parameters on electrodeposition of $Ni-Al_2O_3$ nanocomposite were studied. The properties of the nano composite were investigated by using SEM, XRD, and Vicker's microhardness test. The results demonstrated that $Al_2O_3$ incorporation in the composite coatings was found to be increased by increasing stir rate and $Al_2O_3$ content in plating bath. Microhardness of the composite coatings was also increased with increasing content of the nano particles in the plating bath. The surface morphologies of the nanocomposite coatings were found to be varied with varying pH, current densities as well as alumina content in the plating bath.

• Journal of the Korean Graphic Arts Communication Society
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• v.18 no.2
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• pp.133-141
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• 2000

Enhanced the value of badge good with the gold plating of emblem, sports pictogram, mascot in 2002 Asian Game and World Cup, applying the plating and coating technique to screen printing. In addition, tourist and characteristic goods were of great value and image of visual communication displayed outside. After the screen printing in the surface of stainless steel, it obtained the plate coloring of beautiful a black glossy with a black Ru plating. At the identical surface, it did that the electrodeposition coating process in order to making a conductor state of image areas and a nonconductor state of nonimage areas. After the electrodeposition process, it removed the printing ink of image areas with solvent. A manufacturing process, it removed the printing ink of image areas with solvent. A manufacturing process completed with copper, nickel and gold plating at bared metal surface.