• Korean Journal of Materials Research
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• v.20 no.10
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• pp.555-558
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• 2010

This study examined the effect of current density on the surface morphology and physical properties of copper plated on a polyimide (PI) film. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity was controlled using current density. Large particles were observed on the surface of the copper layer electroplated onto a current density of 25 mA/$cm^2$. However, a uniform surface and lower resistivity were obtained with a current density of 10 mA/$cm^2$. One of the important properties of FCCL is the flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density rather than a high current density. Moreover, a reasonable current density is 20 mA/$cm^2$ considering the productivity and mechanical properties of copper foil.

• Korean Journal of Materials Research
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• v.16 no.7
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• pp.430-434
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• 2006

Au/Ni coatings are widely used in the electrical interconnect system, such as connectors, sockets and wire crimps. But due to repeated mechanical contacts, fretting corrosion occurs and causes a rapid increase in resistance. As an attempt to resolve these problem, application of Ni-P-PTFE to replace Ni undercoats was proposed, for which basic materials properties of Ni-P-PTFE coatings for preventing fretting corrosion was examined in this study. The Ni-P-PTFE coatings were formed by electroless Ni plating and PTFE coating followed by the heat-treatment. PTFE particles were found to be uniformly distributed in the Ni-P matrix. The Ni-P-PTFE coatings showed the excellent anti-adherent property with the contact angle of $104.3^{\circ}$, microhardness of 144.3 Hv comparable to that of Ni-P, and electric conductivity equivalent to that of Ni-P.

• Journal of Technologic Dentistry
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• v.35 no.4
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• pp.343-352
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• 2013

Purpose: The purpose of this study was to investigate to effect of the ZrN coated on corrosion resistance and physical property of dental Co-Cr alloys using various instruments. Methods: The specimens were used, respectively, for experiment, Arc Ion plating was carried out for dental casting alloys using ZrN coated materials with nitrogen gas. ZrN coated surface of each specimen was observed with field emission scanning electron microscopy (FE-SEM), energy dispersive X-ray spectroscopy (EDS), vickers hardness tester, and electrochemical tester. Results: The current density of ZrN coated specimen was smaller than that of non-coated specimen in 0.9% NaCl solution. Pit nucleated at scratch of specimen. The pitting corrosion resistant |$E_{max}-E_{rep}$| increased in order of ZrN coated (110 mV), and non-coated wire (100 mV). Conclusion: The corrosion potential of the ZrN coated specimen was comparatively high. the surface of ZrN coated specimen was more smooth than that of other kinds of non-coated specimen. ZrN coated surface showed higher hardness than that of non-coated surface.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2008.11a
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• pp.153-154
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• 2008

High velocity oxy-fuel (HVOF) thermal spraying coating has been used widely throughout the last 60 years mainly in defense, aerospace, and power plants. Recently this coating technique is considered as a promising candidate for the replacement of the traditional electrolytic hard chrome plating (EHC) which pollutes the environment and causes lung cancer by toxic hexa-valent $Cr^{6+}$. In this study, two kinds of cermet coatings, WC-CoCr and WC-CrC-Ni, are formed by HVOF spraying. The wear properties of coatings are evaluated comparatively by reciprocating sliding wear tests at $25^{\circ}C$, $250^{\circ}C$ and $450^{\circ}C$ respectively. Wear rates show that WC-CoCr coatings have better sliding wear resistance than WC-CrC-Ni coatings regardless of temperature due to more, compact and homogeneously distributed WC particles, less metal content, Co, Cr rich metallic bindermatrix with higher fracture strength and better adhesive strength with WC particles.

• Journal of the Korean institute of surface engineering
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• v.38 no.3
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• pp.118-125
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• 2005

Low temperature plasma treatment with different gases and rf powers were performed to improve the adhesion strength between polytetrafluoroethylene(PTFE) and electroless deposited copper. According to the research, $H_2$ plasma having hydrogen radical was more effective in surface polarity modification than $O_2$ plasma due to the defluorination reaction. However, surface roughness of PTFE was more increased with $O_2$ than $H_2$ plasma. PTFE treated with $120W-O_2$ plasma and $250w-H_2$ plasma, consecutively showed rougher surface than single step $250w-H_2$ plasma treated one and more hydrophilic than single step $120W-O_2$ plasma treated one. And it showed 5B tape test grade, which is better adhesion property than 1B or 3B obtained by single step plasma treatment. In addition, adhesion strength between PTFE and Cu deposit is also deeply affected by residual water on its interface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.339-339
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• 2007

Metal coating on ceramic powder has long been attracting interest for various applications such as superconductor where the brittle nature of high temperature ceramic superconductor was complemented by silver coating and metalloceramics where mechanical property improvement was achieved via electroless plating. More recently it has become of great interest in embedded passive device applications since metal coating on ceramic particles may result in the enhancement of the dielectric properties of ceramic-polymer composite capacitors. In our study, nickel ion-containing solution was used for coating commercial capacitor-grade $BaTiO_3$ powder. After filtering process, the powder was dried and heat-treated in 5% forming gas at $900^{\circ}C$. XRD and TEM were utilized for the observation of crystallization behavior and morphology of the particles. It was found that the nickel coating characteristics were strongly dependent on the several parameters and processing variables, such as starting $BaTiO_3$ particle size, nickel source, solution chemistry, coating temperature and time. In this paper, the effects of these variables on the coating characteristics will be presented in some detail.

• Korean Journal of Metals and Materials
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• v.50 no.8
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• pp.549-556
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• 2012

The tribological behavior of CrMoN films with respect to surface chemistry was investigated by using X-ray photoelectron spectroscopy (XPS). All of the films were prepared from a hybrid PVD system consisting of DC unbalanced magnetron (UBM) sputtering and arc ion plating (AIP) sources. The tribological property of the films was evaluated by a friction coefficient using a Ball-on-disk type tribometer. The chemistry of wear track was analyzed by energy dispersive spectroscopy (EDS) and XPS. The friction coefficient was measured to be 0.4 for the CrMoN film, which is lower than that of a monolithic CrN film. EDS and XPS results imply the formation of an oxide layer on the coating surface, which was identified as molybdenum oxide phases, known to be a solid lubricant during the wear test.

• Journal of the Korean Magnetics Society
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• v.17 no.3
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• pp.133-136
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• 2007

We investigated the changes of the magnetic properties in electroplated Permalloy thin films by a few organic additives added to the plating electrolytes. Under identical electroplating conditions, the crystalline orientations and the surface roughness of the plated thin films were different from those prepared with a pure electrolyte. These property changes reduced the coercivity and increased the magnetoimpedance ratio (MIR) up to 20%.

• Korean Journal of Metals and Materials
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• v.48 no.2
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• pp.101-108
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• 2010

The local structural states of amorphous alloys have been depicted previously via short-range orders (SROs). However, the concept of SROs alone is inadequate and sometimes insufficient to explain the structure-property relation of the amorphous alloys. In this study, we propose new types of medium-range building structures that affect the mechanical properties, plasticity in particular. Using a combination of molecular dynamics simulations and the Voronoi tessellation method, we demonstrate a three-dimensional configuration of icosahedral medium-range orders (I-MROs) and elucidate how these icosahedral orders evolve by the application of shear deformation. It was observed that the structural stability of the icosahedral orders relies largely on how they are linked via percolation and this linking is explained in detail.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.229-229
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• 2010

With the scaling down of ultra large integrated circuits (ULSI) to the sub-50 nm technology node, the need for an ultra-thin, continuous and conformal diffusion barrier and Cu seed layer is increasing. However, diffusion barrier and Cu seed layer formation with a physical vapor deposition (PVD) method has become difficult as the technology node is reduced to 30 nm and beyond. Recent work on self-forming barrier processes using PVD Cu alloys have attracted great attention due to the capability of conformal ultra-thin barrier formation using a simple technique. However, as in the case of the conventional barrier and Cu seed layer, PVD of the Cu alloy seed layer will eventually encounter the difficulty in conformal deposition in narrow line trenches and via holes. Atomic layer deposition (ALD) has been known for its good step coverage and precise thickness control, and is a candidate technique for the formation of a thin conformal barrier layer and Cu seed layer. Conformal Cu-Mn seed layers were deposited by plasma enhanced atomic layer deposition (PEALD) at low temperature ($120^{\circ}C$), and the Mn content in the Cu-Mn alloys were controlled form 0 to approximately 10 atomic percent with various Mn precursor feeding times. Resistivity of the Cu-Mn alloy films decreased by annealing due to out-diffusion of Mn atoms. Out-diffused Mn atoms were segregated to the surface of the film and interface between a Cu-Mn alloy and $SiO_2$, resulting in self-formed $MnO_x$ and $MnSi_xO_y$, respectively. No inter-diffusion was observed between Cu and $SiO_2$ after annealing at $500^{\circ}C$ for 12 h, indicating an excellent diffusion barrier property of the $MnSi_xO_y$. The adhesion between Cu and $SiO_2$ was enhanced by the formation of $MnSi_xO_y$. Continuous and conductive Cu-Mn seed layers were deposited with PEALD into 32 nm $SiO_2$ trench, enabling a low temperature process, and the trench was perfectly filled using electrochemical plating (ECD) under conventional conditions. Thus, it is the resultant self-forming barrier process with PEALD Cu-Mn alloy film as a seed layer for plating Cu that has further potential to meet the requirement of the smaller than 30 nm node.