• Applied Chemistry for Engineering
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• v.19 no.2
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• pp.228-235
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• 2008

Nickel plating thickness increased with the electric current density, and the augmentation was more thick in $6{\sim}10A/dm^2$ than low current. Hull-cell analysis was tested to evaluate the current density. Optimum thickness was obtained at a temperature of $60^{\circ}C$, and the pH fluctuation of 3.5~4.0. Over the Nickel ion concentration of 300 g/L, plating thickness increased with the current density. The rate of decrease in nickel ion concentration was increased with the current density. The quantity of plating electro-deposition was increased at the anode surface, which was correlated with the increase of plating thickness. The plating thickness was increased because of the quick plating speed. However, the condition of the plating surface becomes irregular and the minuteness of nickel plating layer was reduced with the plating rate. After the corrosion test of 25 h, it was resulted in that maintaining low electric current density is desirable for the excellent corrosion resistance in lustered nickel plating. According to the program simulation, the thickness of diffusion layer was increased and the concentration of anode surface was lowered for the higher current densities. The concentration profile showed the regular distribution at low electric current density. The field plating process was controlled by the electric current density and the plating thickness instead of plating time for the productivity. The surface physical property of plating structure or corrosion resistance was excellent in the case of low electric current density.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.139-140
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• 2002

This paper discusses the effect of plating condition on the mechanical property of electroplated Cu film. Current density, the amount of the organic additives was found to affect the residual stress of electroplated copper film. The result show that, in the case of residual stress, the copper film deposited at higher additive result in lower residual stress and plating current by $15mA/cm^2$ induced a better result than any other ones.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.1
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• pp.49-55
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• 2006

The effect of coating temperature with regard to surface properties of TiN-coated layer on hard metal(WC-Co) are experimentally investigated. Hardness, surface roughness, TiN coating thickness and adsorption force were measured in order to evaluate the effect of coating temperature. The two-way ANOVA method is used in order to evaluate the experimental data. In AIP processing, It is concluded that the furnace temperature in the range of $400^{\circ}C\~500^{\circ}C$ affected to a little increasing the number of production with the coating temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.621-624
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• 1999

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed boards(PCR) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor meta1s, such as Al and Cu and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure. wear resistance, corrosion protection and thermal stability In this study fundamental aspects of electroless nickel deposition were studied with effort of complexeing agents of different kinds. Then the property of electroless deposit are controlled by the composition of the deposition solution the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2000.11a
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• pp.83-84
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• 2000

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.25.2-25.2
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• 2011

Recently, thin film capacitors used for vehicle inverters are small size, high capacitance, fast response, and large capacitance. But its applications were made up of liquid as electrolyte, so its capacitors are limited to low operating temperature range and the polarity. This research proposes using Ni-P alloys by electroless plating as the electrode instead of liquid electrode. Our substrate has a high aspect ratio and complicated shape because of anodic aluminum oxide (AAO). We used AAO because film thickness and effective surface area are depended on for high capacitance. As the metal electrode instead of electrolyte is injected into AAO, the film capacitor has advantages high voltage, wide operating temperature, and excellent frequency property. However, thin film capacitor made by electroless-plated Ni on AAO for full-filling into etched tunnel was limited from optimizing the deposition process so as to prevent open-through pore structures at the electroless plating owing to complicated morphological structure. In this paper, the electroless plating parameters are controlled by temperature in electroless Ni plating for reducing reaction rate. The Electrical properties with I-V and capacitance density were measured. By using nickel electrode, the capacitance density for the etched and Ni electroless plated films was 100 nFcm-2 while that for a film without any etch tunnel was 12.5 nFcm-2. Breakdown voltage and leakage current are improved, as the properties of metal deposition by electroless plating. The synthesized final nanostructures were characterized by scanning electron microscopy (SEM).

• Journal of the Korean institute of surface engineering
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• v.47 no.3
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• pp.128-136
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• 2014

In the present study, we successfully developed an eco-friendly chemical etching solution and proper condition for plating on ABS material. The mechanism of forming Ni plating layer on ABS substrate is known as following. In general, the etching solution used for the etching process is a solution of chromic acid and sulfuric acid. The etching solution is given to the surface resulting in elution of butadiene group, so-called anchor effect. Such a rough surface can easily adsorb catalyst resulting in the increase of adhesion between ABS substrate and Ni plating layer. However a use of chromic acid is harmful to environment. It is, therefore, essential to develop a new alternative solution. In the present study, we proposed an eco-friendly etching solution composed of potassium permanganate, sulfuric acid and phosphoric acid. This solution was testified to observe the surface microstructure and the pore size of electrical Ni plating layer, and the adhesive correlation between deposited layers fabricated by electro Ni plating was confirmed. The result of the present study, the newly developed, eco-friendly etching solution, which is a mixture of potassium permanganate 25 g/L, sulfuric acid 650ml/L and phosphoric acid 250ml/L, has a similar etching effect and adhesion property, compared with the commercially used chromium acid solution in the condition at $70^{\circ}C$ for 5 min.

• Transactions of Materials Processing
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• v.15 no.5 s.86
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• pp.366-372
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• 2006

The effect of coating time in arc ion plating on surface properties of the TiN-coated high speed steel(SKH51) is presented in this paper. Surface roughness, micro-hardness, coated thickness, atomic distribution of TiN and adhesion strength are measured for various coating times. It has been shown that the coating time has a deep influence on the micro-hardness, the coated thickness, the atomic distribution of Ti and the adhesion strength of the SKH51 steels but that it has little influence on the surface roughness.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.308-313
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• 2006

The effect of coating time on surface properties of the TiN-coated high speed steel(SKH51) by arc ion plating is and presented in this paper. Surface roughness, micro-hardness, coated thickness, atomic distribution of TiN and adhesion strength are measured for various coating times. It has been shown that the coating time has a deep influence more than 60 minites on the micro-hardness, coated thickness, atomic distribution of Ti and adhesion strength of the SKH51 steels, but that the coating time has little influence on the surface roughness.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.7
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• pp.124-130
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• 2008

The effect of nitrogen gas pressure in arc ion plating on surface properties of the TiN-coated high speed steel(SKH51) is presented in this paper. The surface roughness, micro-particle, micro-hardness, coated thickness, atomic distribution of TiN, and adhesion strength are measured fur various nitrogen gas pressures. It has been shown that the nitrogen gas pressure has a considerable effect on the surface roughness, adhesion strength, atomic distribution of TiN, and surface deposition of TiN of the high speed steels but that it has little influence on the micro-hardness and coated thickness.