• Journal of Welding and Joining
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• v.17 no.2
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• pp.61-65
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• 1999

Because of the need for packages which accommodate high pin count, high density and high speed device, PBGA(plastic ball grid array) package gets more spotlight. But the substrate material which is used for PBGA package is in nature susceptible to moisture penetration. The objective of the study is to find out the path of delamination in the stacked structure of substrate. To increase the adhesion between the cooper laminate and PSR(photo solder resist) which is the weakest part, experiments were performed by changing parameters of printing pre-treatment and post-treatment process. As a result of experiments, the factor effects on the adhesion between the cooper laminate and PSR is caused by all of the pre-treatment and post-treatment condition. A considerable change was observed depending on the amount of UV irradiation after thermal cure which is typical of printing post-treatment condition rather than pre-treatment condition.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.69-77
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• 2024

Due to the miniaturization and multifunctionality of electronic devices, a surface mount technology in the form of molded interconnect devices (MID), which directly forms electrodes and circuits on the plastic injection parts and mounts components and parts on them, is being introduced to overcome the limitations in the mounting area of electronic components. However, when using plastic injection parts with low thermal stability, there are difficulties in mounting components through the conventional reflow process. In this study, we developed a process that utilizes induction heating, which can selectively heat specific areas or materials, to melt solder and mount components without causing any thermal damage to the plastic. We designed the shape of an induction heating Cu coil that can concentrate the magnetic flux on the area to be heated, and verified the concentration of the magnetic flux and the degree of heating on the pad part through finite element method (FEM). LEDs, capacitors, resistors, and connectors were mounted on a polycarbonate substrate using induction heating to verify the mounting process, and their functionality was confirmed. We presented the applicability of a selective heating process through magnetic induction that can overcome the limitations of the reflow method.

• Proceedings of the KWS Conference
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• 2004.05a
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• pp.314-315
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• 2004

As environmental issue threatens to be aggravated, applications of bio-degradable plastic (Polybutylene Succinate:PBS) tend to be increased. However, improvement of mechanical characteristics of PBS is indispensable for further widespread actual applications. Therefore, in order to produce further functional P8S with improved mechanical characteristics, TiO$_2$ coatings on PBS substrate were prepared under various spraying conditions using plasma and HVOF spraying techniques. The effects of thermal spraying methods and spraying parameters on coating properties could be confirmed. Moreover, wear behavior for TiO$_2$ coatings on PBS substrate has been also reviewed and characterized.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.171-173
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• 2005

To evaluate the applicability of dissimilar metal friction stir welding in automobile manufacturing process, friction stir welding trials were carried out for typical 5000 and 6000 series aluminum alloy sheets with 2mm thickness. The sound joints of A15052 and A16061-T6 alloys were successfully formed under a wide range of welding condition. Excellent weld ability has been obtained at a condition of rotating speed 2000rpm and travel speed 100mm/min, while a radiographic test also confirmed defect free joint for this condition. Through the Erichsen cup test, the plastic formability of the FSWelded joints was found to be about 83% of base metal.

• Proceedings of the KWS Conference
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• 1997.05a
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• pp.107-111
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• 1997

In this paper distribution of welding residual stress on the double fillet welded joint which exits and not exits root gap, i.e. full penetration and partial penetration is investigated by two dimensional cunduct and thermal elasto-plastic analysis. And stress distribution on notch-tip of the structure where welding residual stress regarded as initial stress and then external load is added is also investigated.

• Proceedings of the KWS Conference
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• 2000.04a
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• pp.264-266
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• 2000

In this study, analysis of creep-fatigue behavior of low alloy steel weld was performed. An interface was employed along the crack plane to simulate the interface between base metal and weld metal. A trapezoidal waveshapes was loaded cyclically and analysis result was compared with that of monotonic load. The material was assumed as elastic-plastic-secondary creeping material. Because the isotropic hardening plasticity model used in the last study cannot simulate the behavior of material under cyclic load, the linear kinematic hardening plasticity model was used. The behavior of strain field and $C_{t}$ parameter was obtained.d.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.18-19
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• 2006

The purpose of this study is to evaluate the behavior of residual stress at the weldment of pressure vessel by local Post Weld Heat Treatment(PWHT). In order to do it, residual stress were measured before and after local PWHT by XRD on the test piece first. And then, the results of finite element(FE) analysis based on thermal-elasto-plastic-creep theories were verified by comparing with the measured results.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.280-282
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• 2006

Prediction and control of the thermal distortion is particularly important for the design and manufacture of welded thin plate panel. In this study, experiments and computations are peformed to analyze how hole configuration and the size of the specimen effect on distortion. In addition, this study aims to develop a thermal elasto-plastic simulation using finite element method to predict distortion, with particular emphasis on buckling deformation generated in attachments welded around hole.

• Proceedings of the KWS Conference
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• 2008.05a
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• pp.28-28
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• 2008

• Proceedings of the KWS Conference
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• 2008.05a
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• pp.33-33
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• 2008