• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1463-1465
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• 2008

We report all-ink-jet printed inorganic/organic hybrid TFTs on plastic substrates. We have investigated the optimal printing conditions to make uniform patterned layers of gate electrode, dielectrics, source/drain electrodes, and semiconductor as a coplanar type TFT in a successive manner. All ink-jet printed devices have good mechanical flexibility and current modulation characteristic even when bent.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.223-226
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• 2003

We have developed flexible MIM LCDs by using plastic film substrate. MIM array and cells were fabricated with low temperature process and material technology. As an insulator of MIM, SiNx was introduced at the low temperature allowable for plastic substrate. The fabricated MIM devices show high electrical performance for LC driving. We discuss its process and characteristics.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.506-509
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• 2004

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with in-situ photoalignment method on polyimide (PI) surfaces using thin plastic substrates. The LC aligning capabilities and pretilt angle of the thin plastic substrates by in-situ photoalignment method were better than that of the glass substrate by general photoalignment. Also, the LC pretilt angle increased with increasing heating temperature and exposure time. And EO characteristics of photoaligned TN-LCDs using in-situ photodissociation method on glass substrate and on plastic substrate are also excellent.

• Journal of the Korean Ceramic Society
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• v.34 no.12
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• pp.1268-1274
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• 1997

Effect of elastic/plastic mismatch on the fracture of Si3N4 coating in Si3N4/Si3N4 -BN bilayer was investigated by Hertzian indentation testing. A different amount of mismatch between two layers was induced by different BN addition in the substrate layer, and Hertizian cracks were induced by using WC ball indenter. As a result, as the elastic/plastic mismatch between coating and substrate layer increased, the coating fracture easily occurred. A bending stress induced by different elastic/plastic mismatch was main reason to cause the fracture of coating.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.05a
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• pp.202-205
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• 2004

We investigated the electro-optical(EO) performances of the super twisted nematic liquid crystal display(STN-LCD) on the polyimide(PI) surface using polymer film. The NLC pretilt angles generated are about $18^{\circ}$ by the rubbing alignment method on thin plastic substrates. However, the pretilt angle are at about $13^{\circ}$ lower on the glass substrate than on thin plastic substrate. Monodomain alignment of the plastic STN-LCD can be observed. A stable voltage-transmittance(V-T) curve of the plastic STN-LCD was observed on the polyimide(PI) surfaces using polymer film. Also, a faster response time for the plastic STN-LCD on the polyimide(PI) surfaces using polymer film can be achieved.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.10
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• pp.1095-1099
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• 2004

We investigated the electro-optica](EO) performances of the super twisted nematic liquid crystal display(STN-LCD) on the polyimide(PI) surface using polymer film. The NLC(Nematic Liquid Crystal) pretilt angles generated are about 18$^{\circ}$by the rubbing alignment method on thin plastic substrates. However, the pretilt angle are at about 13$^{\circ}$ lower on the glass substrate than on thin plastic substrate. Monodomain alignment of the plastic STN-LCD can be observed. A stable voltage-transmittance(V-T) curve of the plastic STN-LCD was observed on the polyimide(PI) surfaces using polymer film. Also, a faster response time for the plastic STN-LCD on the polyimide(PI) surfaces using polymer film can be achieved.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.655-656
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• 2005

In the future, plastic based system will play a crucial role in modem life, for examples, transparent display or disposable electronics and so on. In this paper, we introduced a new method to fabricate the metal line on the plastic substrate. Metal lines were fabricated by hot embossing and CMP process on PMMA (polymethylmethacrylate) substrates. A Si mold was made by wet etching process and a PMMA wafer was cut off from I mm thick PMMA sheet. A 100 nm thick Al was deposited on PMMA wafers. The Al deposited PMMA wafer and the Si mold carefully sandwiched which was directly imprinted by hot embossing. After imprinting process, a residual Al layer was removed by CMP process. Finally, we found the entire process may be very useful to fabricate the metal line on plastic substrates.

• Korean Journal of Optics and Photonics
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• v.18 no.2
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• pp.149-154
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• 2007

Bragg reflecting waveguide devices have been fabricated on a flexible polymer substrate utilizing a post lift-off process which could Provide excellent uniformity of grating Patterns on Plastic film. The 510 m Period Bragg grating pattern is made by two methods. In the first sample the grating is fabricated by exposing the laser interference pattern on a photoresist, and then it is inscribed by $O_2$ plasma etching. The grating pattern of the second sample is formed by a PDMS soft mold imprinting process. The selective adhesion property of SU-8 material for Au and Si surfaces is utilized to prepare a 100-mm thick plastic substrate. Single mode waveguide is fabricated on the plastic substrate using polymer materials with refractive indices of 1.540 and 1.430 for the core and the cladding layers, respectively. The Bragg grating on Plastic substrate does not show any degradation in its spectral response compared to the reference sample made on a silicon wafer.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.633-636
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• 2006

GE has developed a plastic substrate technology comprised of a superior high-heat polycarbonate substrate film and a unique transparent coating package that provides the ultrahigh barrier to moisture and oxygen, and chemical resistance to solvents used in device fabrication. This contribution will update recent progresses made at GEFlexible Ultra-high Gas Barrier Substrate for Organic Electronics on ultra-high barrier coated plastic substrate, both in batch mode and in roll-to-roll mode

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.886-888
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• 2009

We fabricated flexible electronic paper display(EPD) by using toner particles on plastic (PC) substrate. We observed the relationship between contrast ratio and changes of rib structures. One is a fabrication of ribs on bottom substrate. The display with ribs on bottom substrate had higher contrast ratio about 46% than display with ribs on top substrate. The other is a change of density of rib. The less density of ribs fabricated, the higher the contrast ratio become.