• Title/Summary/Keyword: Plastic IC

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Fracture toughness and AE Characteristics of Engineering plastic according to thickness (두께변화에 따른 엔지니어링 플라스틱의 파괴인성과 AE특성)

  • 남기우;김선진;안병현
    • Journal of Ocean Engineering and Technology
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    • v.10 no.4
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    • pp.51-57
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    • 1996
  • A standard method for the evalution of the fracture toughness of the high polymer materials has not been fully developed in comparison with that for metallic materials, and has not yet established. In this paper, fracture toughness tests using polycarbonate specimens were carried out. The fracture thughness tests using polycabonate specimens were carried out. The fracture toughness of commercial polycarbonate were dependent on the specimen thickness. The specimen thickness is necessary above 8mm to obtain the valid $K_{IC}$. A cumulative counts were slightly dependent on specimen thickness.

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Transient Characteristic of a Metal-Oxide Semiconductor Field Effect Transistor in an Automotive Regulator in High Temperature Surroundings

  • Kang, Chae-Dong;Shin, Kye-Soo
    • Transactions on Electrical and Electronic Materials
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    • v.11 no.4
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    • pp.178-181
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    • 2010
  • An automotive IC voltage regulator which consists of one-chip based on a metal-oxide semiconductor field effect transistor (MOSFET) is investigated experimentally with three types of packaging. The closed type is filled with thermal silicone gel and covered with a plastic lid on the MOSFET. The half-closed type is covered with a plastic case but without thermal silicone gel on the MOSFET. Opened type is no lid without thermal silicone gel. In order to simulate the high temperature condition in engine bay, the operating circuit of the MOSFET is constructed and the surrounding temperature is maintained at $100^{\circ}C$. In the overshoot the maximum was mainly found at the half-closed packaging and the magnitude is dependent on the packaging type and the surrounding temperature. Also the impressed current decreased exponentially during the MOSFET operation.

Reliability Issue in LOC Packages

  • Lee, Seong-Min
    • Proceedings of the Materials Research Society of Korea Conference
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    • 1995.11a
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    • pp.3-3
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    • 1995
  • Plastic IC encapsulation utilizing lead on chip(LOC) die attach technique allows higher device density per unit package area, and faster current speed and easter leadframe design. Nevertheless, since the top surface of the chip is directly attached to the area of the leadframe with a double-sided adhesive tape in the LOC package, it tends to be easily damaged by the leadframe, leading to limitation in its utilization. In this work, it is detailed how the damage of the chip surface occurs, and it is influenced and improved by the LOC construct.

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A Study on the Safety Evaluation of Design for Piping Materials (I) (배관용재료의 설계시 안전성 평가에 관한 연구(I))

  • 김복기
    • Journal of the Korean Society of Safety
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    • v.10 no.2
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    • pp.3-9
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    • 1995
  • Several piping material test methods have been developed as a result of advances in elastic-plastic fracture mechanics. It's known that, crack propagation of the materials strongly governed by the $J_{Ic}$ value. But the value is still difficult to be obtained because of it's complicate and troble-some determination process. In this paper, to prove the validity of the developed test procedure a series of tests were peformed at various temperatures and for different material directions. directions.

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Fracture Toughness Measurement of the Semiconductor Encapsulant EMC and It's Application to Package (반도체 봉지수지의 파괴 인성치 측정 및 패키지 적용)

  • 김경섭;신영의;장의구
    • Electrical & Electronic Materials
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    • v.10 no.6
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    • pp.519-527
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    • 1997
  • The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

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Elasto-Plastic Analysis for J-integral Evaluation of Unstable Fracture in Cracked Ductile Materials (균열재(龜裂材)의 불안정연성파괴(不安定延性破壞)에 대한 J 적분(J積分) 평가(評價)를 위한 탄소성해석(彈塑性解析))

  • Chang, Dong Il;Jung, Kyoung Sup
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.7 no.1
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    • pp.75-82
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    • 1987
  • It is the objective of this study to estimate J-integral by numerical analysis, in which J-integral as aparameters in fracture mechanics can be used to evaluate unstable ductile fracture which is a important problem with respect to structural stability when the scope is beyond small scale yielding criteria. For this, 8-node isoparametric singular element as crack tip element of a cracked material was used to solve plastic blunting phenomenon at crack tip, and crack opening was forced to start when J-value was exceeding fracture toughness $J_{IC}$ of the material. And crack propagation behaviour was treated by using crack opening angle. From this study, it was shown that crack opening, stable propagation and unstable opening point of the cracked material found by using J-value obtained from this study were accord with the other study, so think, J-value obtained from this study can be directly used as a parameter in fracture mechanics to deal with the problem of stable propagation of crack and unstable ductile fracture.

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Physico-chemical Properties of Disturbed Plastic Film House Soils under Cucumber and Grape Cultivation as Affected by Artificial Accumulation History

  • Han, Kyung-Hwa;Ibrahim, Muhammad;Zhang, Yong-Seon;Jung, Kang-Ho;Cho, Hee-Rae;Hur, Seung-Oh;Sonn, Yeon-Kyu
    • Korean Journal of Soil Science and Fertilizer
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    • v.48 no.2
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    • pp.105-118
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    • 2015
  • This study was carried out to investigate the effects of profile disturbance with different artificial accumulation history on physico-chemical properties of soil under plastic film house. The investigations included soil profile description using soil column cylinder auger F10cm x h110cm, in situ and laboratory measurements of soil properties at five sites each at the cucumber (Site Ic ~ Vc) and grape (Site Ig ~ Vg) plastic film houses with artificial soil accumulation. The sites except sites Ic, IVc, IVg and Vg, belong to ex-paddy area. The types of accumulates around root zone included sandy loam soil for 3 sites, loam soil for 1 site, saprolite for 2 sites, and multi-layer with different accumulates for 3 sites. Especially, Site IIg has mixed plow zone (Ap horizon) with original soil and saprolite, whereas disturbed soil layers of the other sites are composed of only external accumulates. The soil depth disturbed by artificial accumulation ranged from 20 cm, for Site IIg, to whole measured depth of 110 cm, for Site IVc, Vc, and Site IVg. Elapsed time from artificially accumulation to investigation time ranged from 3 months, Site IIc, to more than 20 years, Site Vg, paddy-soil covering over well-drained upland soil during land leveling in 1980s. Disturbed top layer in all sites except Site Vg had no structure, indicating low structural stability. In situ infiltration rate had no correlation with texture or organic matter content, but highest value with highest variability in Site IIIc, the shortest elapsed time since sandy loam soil accumulation. Relatively low infiltration rate was observed in sites accumulated by saprolite with coarse texture, presumably because its low structural stability in the way of weathering process could result in relatively high compaction in agro-machine work or irrigation. In all cucumber sites, there were water-transport limited zone with very low permeable or impermeability within 50 cm under soil surface, but Site IIg, IIIg, and Vg, with relatively weak disturbance or structured soil, were the reverse. We observed the big change in texture and re-increase of organic matter content, available phosphate, and exchangeable cations between disturbed layer and original soil layer. This study, therefore, suggest that the accumulation of coarse material such as saprolite for cultivating cash crop under plastic film house might not improve soil drainage and structural stability, inversely showing weaker disturbance of original soil profile with higher drainage.

Fast Neutron Beam Dosimetry (속중성자선의 선량분포에 관한 연구)

  • 지영훈;이동한;류성렬;권수일;신동오;박성용
    • Progress in Medical Physics
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    • v.8 no.2
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    • pp.45-57
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    • 1997
  • It is mandatory to measure accurately the dose distribution and the total absorbed dose of fast neutron for putting it to the clinical use. At present the methods of measurement of fast neutron are proposed largely by American Associations of Physicists in Medicine, European Clinical Neutron Dosimetry Group, and International Commission on Radiation Units and Measurements. The complexity of measurement, however, induces the methodological differences between them. In our study, therefore, we tried to establish a unique technique of measurement by means of measuring the emitted doses and the dose distribution of fast neutron beam from neutron therapy machine, and to invent a standard method of measurement adequate to our situation. For measuring the absorbed doses and the dose distribution of fast neutron beam, we used IC-17 and IC-18 ion chambers manufactured by A-150 plastic(tissue-equivalent material), IC-17M ion chamber manufactured by magnesium, TE gas and Ar gas, and RDM 2A electrometer. The magnitude of gamma-contamination intermingled with fast neutron beam was about 13% at 5cm depth of standard irradiated field, and increased as the depth was increased. At the central axis the maximum dose depth and 50% dose depth were 1.32cm and 14.8cm, respectively. The surface dose rate was 41.6-54.1% throughout the entire irradiated fields and increased as the irradiated fields were increased. Beam profile was that the horn effect of about 7.5% appeared at 2.5cm depth and the flattest at 10cm depth.

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A Study of on Minimizing the Number of V\ulcorner/V\ulcorner Pins in Simultaneous Switching Environment (동시 스위칭 환경에서 V\ulcorner/V\ulcorner Pin 수의 최소화를 위한 연구)

  • Bae, Yun-Jeong;Lee, Yun-Ok;Kim, Jae-Ha;Kim, Byeong-Gi
    • The Transactions of the Korea Information Processing Society
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    • v.7 no.7
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    • pp.2179-2187
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    • 2000
  • This paper provides a heuristic analysis technique which determines an optimal number of V\ulcorner/V\ulcorner pads meeting allowable Simultaneous Switching Noise(SN) budget, early in the design phase. Until now, in determining the number of V\ulcorner/V\ulcorner pads, designers had to simulate packaging models case by case in the design phase or roughly allocate the power/ground pins in an inaccurate way according to typical design rules. However, due to the high density and frequency trends of IC technologies, the V\ulcorner/V\ulcorner pads allocation method can affect an adverse effect on IC operations, which requires more accurate and efficient methods be devised. Thus, this paper proposes an analytic V\ulcorner/V\ulcorner pads calculation method that gives a practical help for packaging designs early in the design phase. The proposed method is applied to a design example of a 1/8x208 pin plastic quad flat package (PQFP) and the results are verified through simulation using HSPICE.

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A study on the crack initiation of SCM 4 (SCM4 의 크랙開始点 에 관한 硏究)

  • 옹장우;박찬국;김재훈
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.9 no.2
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    • pp.135-139
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    • 1985
  • A J$_{IC}$ test procedure by ultrasonic method performed to observe the crack opening behavior of fatigue precrack and detect the initiation of crack propagation of compact tension specimen in this paper. Pulse-echo method with 5 MHz transducer was used on the Cr-Mo steel quenched and tempered at 593.deg. C. We obtained the following results in the elastic-plastic fracture toughness test by ultrasonic method. Echo height is a little increased linearly and rapidly at the early stage of loading . Then it is decreased considerably, finally at the unstable crack growth stage, it is rapidly increased at an unpredictable rae. The initiation of crack propagation is supposed to be at the stage deviated from linearly decreased region and then blunted. J$_{IC}$ value(10.15-12.15 Kgf/mm) by ultrasonic method is lower than that(12.2 Kgf/mm) by R-curve method. But, it is required that the research for the more exact evaluation about correlation between echo height and the crack opening behavior of precrack tip will be continued. continued.ued.