• Journal of the Korean Wood Science and Technology
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• 제15권3호
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• pp.44-55
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• 1987

In order to study the effect of sawdustboard combined with plastic chips, 0.5mm($T_1$), 1mm($T_2$), 1.4mm($T_3$) thick nylon fiber. polypropylene rope fiber(RP), and 0.23mm thick moth-proof polypropylene net fiber(NP) were cut into 0.5, 1, 2cm long plastic chips. Thereafter, sawdustboard combined with plastic chips prepared as the above and plastic non-combined sawdustboard(control) were manufactured into 3 types of one-, two-, and three layer with 5 or 10% combination level. By the discussions and results at this study, the significant conclusions of mechanical and physical properties were summarized as follows: 1. The MORs were shown in the order of 3 layer> 2 layer> 1 layer among plastic non-combined boards, and $T_3$ < $T_2$ < $T_1$ < RP (NP(5%) < NP(l0%) among plastic combined boards. In 2cm long plastic chip in 1 layer board, the highest strength through all the composition was recognized. 1 layer board showing the lower strength with 0.5cm plastic chip rendered to the bending strength improvement by 2 or 3 layer board composition. On the other hand, 2 or 3 layer combined with 1, 2cm long polypropylene net fiber chips incurred MOR's conspicuous decrease requiring optimum plastic chip combined level and consideration to combined type. 2. MOE in plastic non-combined 3 layer board exhibited sandwich construction effect by higher resin content application to surface layer in the order of 3layer>1layer>2layer with the highest stiffness of the board combined with polypropylene chip, while nylon chip-combined board had little difference from plastic non-combined board. In relevant to length and layer effect, 3 layer board combined with the 0.5cm long polypropylene net fiber chip in 5% and 10% combined level presented 34-43% and 44-76% stiffness increase against plastic non-combined board(control), respectively. Moreover, in 1 layer board, 30% stiffness increase with 10% against 5% combined level in the 1 and 2cm long polypropylene net fiber chip was obtained. 3. Stress at proportional limit(Spl) showing the fiber relationship (r: 0.81-0.97) between MOR presented in the order of 1 layer<2 layer<3 layer in plastic non-combined board. Correspondingly, combined effect by layer and plastic chip length was similar to MOR's. 4. Differently from previous properties(MOR, MOE, Spl). work to maximum load(Wml) of 2 layer board approached to that of 3 layer board. Conforming the above phenomenon. 2 layer combined with 0.5cm long polypropylene net fiber chip kept the greater work than 1 layer. The polypropylene combined board superior to nylon -and plastic non - combined board seemed to have greater anti - failing capacity. 5. Internal bond strength(IB), in contrast to MOR's tendency. showed in the order of T1

• Proceedings of the Korean Society of Precision Engineering Conference
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1140-1144
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• 2005

A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 한국전자파학회 2003년도 종합학술발표회 논문집 Vol.13 No.1
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• pp.532-535
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• 2003

In this paper, we made study for plastic chip antenna, the plastic is Formax with the circle of PVC and its electric characteristics are dielectric constant 1.9, surface current $10{\Omega}$. The proposed antenna same as the conventional antenna are usually constructed with ceramic chip, which are not fragile in nature and don't tend to break easily. Therefore the proposed antenna with its advantage are attractive for application in mobile antenna. We study the dual-band plastic chip antenna resonated at 800Mhz and 1800Mhz. From this study results, we feel confident of application for mobile phone antenna.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제18권2호
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• pp.130-135
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• 2005

In this papers, we made study for plastic chip antenna, the plastic is Foamex with the circle of PVC and its electric characteristics are dielectric constant 1.9, insulation intensity 112 KV/cm. The proposed antenna is same as the conventional antennas are usually constructed with ceramic chip, which are not fragile in nature and don't tend to break easily. Therefore the proposed antenna with its advantage is attractive for application in mobile antenna. In order to valid the proposed papers, it is implemented the antennas of four types and experimented. From the results, we conformed that the antennas are operated at the dual band which is cellular band and Korea-PCS band. And the gain of the antennas has about above -2 dB and the pattern is same as conventional antennas. From this papers, the realized antennas using Foamex material will be application for mobile phone antenna.

• Journal of the Korean Society of Industry Convergence
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• 제2권2호
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• pp.131-137
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• 1999

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the energy release rate criterion. The package crack formation depend on various parameters such as chip set, chip size, package thickness, package width, material properties and the moisture content etc. The effects of chip set and the other parameters were estimated during the analysis of package cracks which were located in the edge of the upper interface of the chip and the lower interlace of the die pad. From the results, it could be obtained that the more significant parameters to effect the chip set are chip width.

• Journal of the Korea Institute of Information and Communication Engineering
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• 제11권12호
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• pp.2210-2216
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• 2007

In this paper, triple-band plastic chip antennas for mobile terminal are investigated. Plastic chip antenna is composed of Foamex material with circle of PVC(Polyvilyl chloride). For its electric characteristics, the dielectric constant is 1.9, the insulation intensity is 112KV/cm. Plastic chip antennas are don't tend to break easily against to external shock, have more gain and efficiency than ceramic chip antennas. Triple-band plastic chip antennas of four type are implemented and experimented. From the experiments results, the antenna resonate at the triple-band, the gain of the antennas has about above -2dB, the pattern is ommidirectional the same as the conventional antennas. So, the antennas realized with Foamex material will be application for mobile phone antenna operated at the triple band which is cellular band and Korea-PCS band and ISM band or the antenna for other wireless communication system.

• Journal of the Korean Society for Precision Engineering
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• 제12권9호
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• pp.148-155
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• 1995

The object of this study is to achieve a gteater understanding of meterial removal process and its mechanism. In this study, some applications of finite element techniques are applied to analyze the chip formation and cutting heat generation mechanism of metal cutting. To know the effect of cutting parameters, simulations employed some independent cutting variables change, such as constitutive deformation laws of workpiece and tool material, frictional coefficients and tool-chip contact interfaces, cutting speed, tool rake angles, depth of cut and this simulations also include large elastic-plastic defor- mation, adiabetic thermal analysis. Under a usual plane strain assumption, quasi-static, thermal-mechanical coupling analysis generate detailed informations about chip formation process and cutting heat generation mechanism Some cutting parameters are affected to cutting force, plastic deformation of chip, shear plane angle, chip thickness and tool-chip contact length and reaction force on tool, cutting temperature and thermal behavior. Several aspects of the metal cutting process predicted by the finite element analysis provide information about tool shape design and optimal cutting conditions.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1206-1209
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• 2005

In recent, injection molding process for features in sub-micron scale is under active development as patterning nano-scale features, which can provide the master or stamp for molding, and becomes available around the world. Injection molding has been one of the most efficient processes for mass production of the plastic product, and this process is already applied to nano-technology products successfully such as optical storage media like DVD or BD which is a large area plastic thin substrate with nano-scale features on its surface. Bio chip for like DNA sequencing may be another application of this plastic substrate. The DNA can be sequenced using order of 100 nm pore structure when making the DNA flow through the pore structure. Agarose gel and silicon based chip have been used to sequence the DNA, but injection molded plastic chip may have benefit in terms of cost. This plastic DNA sequencing chip has plenty of pillars in order of 100 nm in diameter on the substrate. When the usual features in case of DVD or BD have very low aspect ratio, even less than 0.5, but the DNA chip will have relatively high aspect ratio of about 2. It is not easy to injection mold the large area thin substrate with sub-micron features on its surface due to the characteristics of the molding process and it becomes much more difficult when the aspect ratio of the features becomes high. We investigated the effect of the molding parameters for injection molding with high aspect ratio nano-scale features and injection molded some plastic DNA sequencing chips. We also fabricated PR masters and Ni stamps of the DNA chip to be used for molding

• Journal of the Microelectronics and Packaging Society
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• 제6권4호
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• pp.61-71
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• 1999

The recent trend toward higher frequencies, miniaturization and lower-cost in wireless communication equipment is demanding high density packaging technologies such flip chip interconnection and multichip module(MCM) as a substitute of conventional plastic package. With analyzing the recently reported research results of the RF flip chip, this paper presents the technical issues and advantages of RF flip chip and suggest the flip chip technologies suitable for the development stage. At first, most of RF flip chips are designed in a coplanar waveguide line instead of microstrip in order to achieve better electrical performance and to avoid the interaction with a substrate. Secondly, eliminating wafer back-side grinding, via formation, and back-side metallization enables the manufacturing cost to be reduced. Finally, the electrical performance of flip chip bonding is much better than that of plastic package and the flip chip interconnection is more suitable for Transmit/Receiver modules at higher frequency. However, the characterization of CPW designed RF flip chip must be thoroughly studied and the Au stud bump bonding shall be suggested at the earlier stage of RF flip chip development.

• Maxillofacial Plastic and Reconstructive Surgery
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• 제30권1호
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• pp.108-113
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• 2008

It would be desirable to regenerate bone vertically in a predictable way; such a technique would allow for more favorable implant - crown ratio and better esthetics for implant placement. Traditionally, several techniques has been proposed for this purpose including GBR with particulated bone and block bone graft using mandible or illium however, the efficacy of these techniques has not been firmly established because they have some week points or complications each other that it is difficult to draw firm conclusion for superiority. In recent years, We have treated 11-cases of vertical deficiency of alveolar bone using thin block and chip bone graft technique and the postoperative results showed good prognosis with few complications. So we report the results of its treatment and cases with review of literature.