• Title/Summary/Keyword: Plasma surface modification

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Study on Two Step Plasma Treatment for Electroless Cu Plating of Fluoropolymer (불소수지의 무전해 동도금을 위한 단계적 플라즈마 전처리법에 관한 연구)

  • Shin, Seung-Han;Han, Sung-Ho;Kim, Young-Seok
    • Journal of the Korean institute of surface engineering
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    • v.38 no.3
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    • pp.118-125
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    • 2005
  • Low temperature plasma treatment with different gases and rf powers were performed to improve the adhesion strength between polytetrafluoroethylene(PTFE) and electroless deposited copper. According to the research, $H_2$ plasma having hydrogen radical was more effective in surface polarity modification than $O_2$ plasma due to the defluorination reaction. However, surface roughness of PTFE was more increased with $O_2$ than $H_2$ plasma. PTFE treated with $120W-O_2$ plasma and $250w-H_2$ plasma, consecutively showed rougher surface than single step $250w-H_2$ plasma treated one and more hydrophilic than single step $120W-O_2$ plasma treated one. And it showed 5B tape test grade, which is better adhesion property than 1B or 3B obtained by single step plasma treatment. In addition, adhesion strength between PTFE and Cu deposit is also deeply affected by residual water on its interface.

Surface Modification of Polydimethylsiloxane using Nd:YAG Laser (Nd:YAG 레이저를 이용한 PDMS 표면개질)

  • Shin Sung-Kwon;Song Hyun-Seung;Lee Cheon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.19 no.2
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    • pp.181-184
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    • 2006
  • Nd:YAG($\lambda$=266 nm, pulse) laser beam was irradiated on the PDMS surface to improve its chemical reaction, wettability, adhesive property. The various surface modification methods of PDMS were already studied using oxygen plasma, ozone and corona discharge. The surface modification using laser has the advantage of the simple experiment that only directly irradiated laser beam on the PDMS surface in the air. After the laser treatment, the PDMS surface was investigated using a contact angle measuring instrument. The contact angle was decreased with a increase of the surface oxygen content. In conclusion, the wettability of PDMS surface was improved by the laser treatment without changing of its bulk characteristics.

Characteristics of Machined Surface Roughness and Surface Layers of WC-Co Tools with Plasma Source Ion Implantation (WC-Co 공구의 이온 주입에 따른 표면층 및 가공된 표면거칠기 특성)

  • Kang, Seong-Ki;Kim, Yung-Kyu;Wang, Duck-Hyun;Chun, Young-Rok;Kim, Won-Il
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.9 no.1
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    • pp.106-113
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    • 2010
  • The most suitable condition for plasma source ion implantation(PSII) was found based on the study of the characteristics of PSIIed tool and machined surfaces. The depth analysis according to the chemical bonding state of elements and surface component elements through the XPS and SIMS, was conducted to find the improved property of the PSIIed surface. Due to the diffusion of PSII, the nitrogen was found up to a depth of about 150nm according to the supplied voltage and ion implanted time. The deep diffusion by nitrogen caused the surface modification, but the formation of oxide component was found due to the residual gas contamination on the surface. Statistical method of ANOVA was conducted to find the effects of spindle speed and feed rate in interaction for machined surface roughness with PSIIed tools. The surface modification was found largely occurred by the nitrogen implanted surface with 2 hours for 27kV, 35kV and 43kV.

Studies on the Surface Changes and Adhesion of EVA Foam by Plasma Treatment (플라즈마 처리에 의한 EVA Foam의 표면변화 및 접착특성에 관한 연구)

  • Choi, Myung Jin;Kim, Dong Ho;Kim, Gu Ni
    • Journal of Adhesion and Interface
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    • v.9 no.1
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    • pp.9-15
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    • 2008
  • EVA foam was treated by oxygen plasma under a various treatment time for surface modification. The effect of plasma treatment on surface properties of EVA foam was investigated in terms of FT-IR ATR, XPS, contact angle, and SEM analysis and the adhesion characteristic of the EVA foam was studied in peel strength. As a results, EVA foam treated by plasma led to an elimination of organic compound, an increase of oxygen content, and an increase of surface roughness, resulting in improving the adhesion properties of the EVA foam. As the plasma treatment time increased, the hydrophilicity and physical change of surface of the EVA foam were increased and showed maximum value at 180 s and 420 s, respectively. The maximum adhesion strength appeared at plasma treatment time of 420 s and therefore, in this study the physical change was thought to be a major factor for improving the adhesion of the EVA foam.

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Surface Modification of Polypropylene Meltblown(PPMB) Nonwovens by Plasma Treatment (초극세형 폴리프로필렌부직포의 플라즈마를 이용한 표면개질)

  • Lee, Youn-Eung;Joo, Chang-Whan
    • Textile Coloration and Finishing
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    • v.18 no.1
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    • pp.20-27
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    • 2006
  • On the purpose of surface modifications of polypropylene meltblown(PPMB) nonwovens, PPMB nonwovens were treated in the plasma system by oxygen atmosphere with different treatment time and discharge power. Dimensional change and physical properties of the treated nonwovens were evaluated. Contact angles onto PPMB nonwovens about water and methyleneiodide were measured and surface energies were calculated by Owen's method. As the results, microcraters were observed on the surface of treated nonwovens. Tenacity and breaking strain of PPMB nonwovens decreased with increasing treatment time and discharge power. Surface energy of PPMB nonwovens increased by plasma treatment. Meanwhile, the friction static voltage and dyeability of PPMB nonwovens have enhanced to some extent by oxygen plasma treatment due to the improvement of surface hydrophilicity.

Adhesion and Electrical Performance by Plasma Treatment of Semiconductive Silicone Rubber (반도전성 실리콘 고무의 플라즈마 표면처리에 따른 접착특성과 절연성능)

  • Hwang, Sun-Mook;Lee, Ki-Taek;Hong, Joo-Il;Huh, Chang-Su
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.5
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    • pp.450-456
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    • 2005
  • In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. The modifications produced on the silicone surface by oxygen plasma were accessed using ATR-FTIR, contact angle and Surface Roughness Tester. Adhesion was obtained from T-peel tests of semiconductive layer haying different treatment durations. In addition, ac breakdown test was carried out for elucidating the change of electrical property with duration of plasma treatment. From the results, the treatment in the oxygen plasma produced a noticeable increase in surface energy, which can be mainly ascribed to the creation of O-H and C=O. It is observed that adhesion performance was determined by surface energy and roughness level of silicone surface. It is found that at dielectric strength was increased with improving the adhesion between the semiconductive and insulating interface.

Helium/Oxygen Atmospheric Pressure Plasma Treatment on Poly(ethylene terephthalate) and Poly(trimethylene terephthalate) Knitted Fabrics: Comparison of Low-stress Mechanical/Surface Chemical Properties

  • Hwang Yoon Joong;McCord Marian G.;Kang Bok Choon
    • Fibers and Polymers
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    • v.6 no.2
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    • pp.113-120
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    • 2005
  • Helium-oxygen plasma treatments were conducted to modify poly(trimethylene terephthalate) (PIT) and poly(ethylene terephthalate) (PET) warp knitted fabrics under atmospheric pressure. Lubricant and contamination removals by plasma etching effect were examined by weight loss $(\%)$ measurements and scanning electron microscopy (SEM) analysis. Surface oxidation by plasma treatments was revealed by x-ray photoelectron spectroscopy (XPS) analyses, resulting in formation of hydrophilic groups and moisture regain $(\%)$ enhancement. Low-stress mechanical properties (evaluated by Kawabata evaluation system) and bulk properties (air permeability and bust strength) were enhanced by plasma treatment. Increasing interfiber and interyarn frictions might play important roles in enhancing surface property changes by plasma etching effect, and then changing low-stress mechanical properties and bulk properties for both fabrics.

Investigation on Suppression of Nickel-Silicide Formation By Fluorocarbon Reactive Ion Etch (RIE) and Plasma-Enhanced Deposition

  • Kim, Hyun Woo;Sun, Min-Chul;Lee, Jung Han;Park, Byung-Gook
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.13 no.1
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    • pp.22-27
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    • 2013
  • Detailed study on how the plasma process during the sidewall spacer formation suppresses the formation of silicide is done. In non-patterned wafer test, it is found that both fluorocarbon reactive ion etch (RIE) and TEOS plasma-enhanced deposition processes modify the Si surface so that the silicide reaction is chemically inhibited or suppressed. In order to investigate the cause of the chemical modification, we analyze the elements on the silicon surface through Auger Electron Spectroscopy (AES). From the AES result, it is found that the carbon induces chemical modification which blocks the reaction between silicon and nickel. Thus, protecting the surface from the carbon-containing plasma process prior to nickel deposition appears critical in successful silicide formation.