• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.421-424
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• 2003

An AP plasma technology has been developed for the application of dry cleaner, PR ashing and PI rework in the large glass size. The technology is cost effective, environment friendly, and best fits for coming generation LCD production since the design is easily scalable to bigger size glasses. Surface cleaning results based on the contact angle study has been presented for $5^{th}$ generation LCD bare glass. PR ashing results and various parametric studies have been also presented.

• 한국전산유체공학회지
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• 제19권4호
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• pp.68-74
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• 2014

This computational study features the transient compressible and inviscid flow analysis on a metallic plasma discharge from the opposing composite electrodes which is subjected to pulsed electric power. The computations have been performed using the flux corrected transport algorithm on the axisymmetric two-dimensional domain of electrode gap and outer space along with the calculation of plasma compositions and thermophysical properties such as plasma electrical conductivity. The mass ablation from aluminum electrode surfaces are modeled with radiative flux from plasma column experiencing intense Joule heating. The computational results shows the highly ionized and highly under-expanded supersonic plasma discharge with strong shock structure of Mach disk and blast wave propagation, which is very similar to muzzle blast or axial plasma jet flows. Also, the geometrical effects of composite electrodes are investigated to compare the amount of mass ablation and penetration depth of plasma discharge.

• 한국세라믹학회지
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• 제39권4호
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• pp.409-412
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• 2002

대기압 하에서 정상적으로 저온 플라스마가 발생 가능한 장치를 개발했다. 개발한 장치는 접지전극을 유전체로 피복한 용량결합형 전극구조로 되어 있다. rf(13.56 M Hz)을 여기 원으로서 사용한 아르곤(Ar) 또는 헬륨(He)은 플라스마 가스로서 사용했다. 발생한 플라스마는 발광분광법, 플로브 진단법에 의해 특성을 검토했다. 그 결과 전자온도>여기온도>가스온도 관계에 있는 비평형 상태의 플라스마였다. 본 장치를 사용하여 발생한 플라스마에 반응가스(CF4)을 첨가해서 대기 개방 계에서 Si(100)식각($1.5{\mu}m$/min)에 적용하여 높은 처리속도를 실현했다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1835-1837
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• 1996

Characteristics of Discharge and nonthermal plasma generation in a micro-air gap spacing between a micro-dielectric barrier and a electrode have been investigated experimentally to chert the potential to be used as a micro-scale nonthermal plasma generator. It is found that the output ozone concentration, as a nonthermal plasma intensity parameter, of the micro-air gnp nonthermal plasma generator depended greatly upon the air gap spacing and thickness of the dielectric barrier. As a result, there is a optimal air gap sparing in the same micro dielectric barrier to generate ozone effectively. And the higher ozone concentration was generated from the thinner micro-barrier.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.49.1-49.1
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• 2010

The particle generation during the plasma enhanced process is highly considered as serious problem in the semiconductor manufacturing industry. The material for the plasma processing chamber requires the plasma etching characteristics which are homogeneously etched surface and low plasma etching depth for preventing particulate contamination and high durability. We found that the materials without grain boundaries can prevent the particle generation. Therefore, the amorphous material with the low plasma etching rate may be the best candidate for the plasma processing chamber instead of the polycrystalline materials such as yttria and alumina. Three glasses based on $SiO_2$ and $Al_2O_3$ were prepared with various rare-earth elements (Gd, Y and La) which are same content in the glass. The glasses were plasma etched in the same condition and their plasma etching rate was compared including reference materials such as Si-wafer, quartz, yttria and alumina. The mechanical and thermal properties of the glasses were highly related with cationic field strength (CFS) of the rare-earth elements. We assumed that the plasma etching resistance may highly contributed by the thermal properties of the fluorine byproducts generated during the plasma exposure and it is expected that the Gd containing glass may have the highest plasma etching resistance due to the highest sublimation temperature of $GdF_3$ among three rare-earth elements (Gd, Y and La). However, it is found that the plasma etching results is highly related with the mechanical property of the glasses which indicates the cationic field strength. From the result, we conclude that the glass structure should be analyzed and the plasma etching test should be conducted with different condition in the future to understand the plasma etching behavior of the glasses perfectly.

• 한국전기전자재료학회논문지
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• 제19권6호
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• pp.591-598
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• 2006

The research was tried to investigate the hydrogen generation from water by the pulsed power plasma process. Hydrogen was generated by way of the electrical pulse power discharge process with the ultrasonic wave. The yield on the hydrogen generation was also studied with and without operating the ultrasonic generator, in which the applied high voltage was varied from 10 kV to 15 kV. Nitrogen and argon gases were used as working gases. As the results, the generation yield using the pure nitrogen gas is better than argon and mixed gases such as argon and nitrogen. Hydrogen concentration are significantly increased when the ultrasonic generator was operated with the electrical discharge simultaneously. It is increased with increasing the applied ultrasonic level as well.

• 전기학회논문지
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• 제56권3호
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• pp.583-587
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• 2007

Corona discharge and ozone generation characteristics of a slit dielectric barrier discharge type wire-plate plasma reactor with a third electrode have been investigated. When a third electrode is installed on a slit of the slit barrier, where an intense corona discharge occurs, it is found that a significantly increased ozone output could be obtained. This, however, indicates that the third electrode can activate the corona discharges both of the discharge wire and the slit of the slit barrier in the plasma reactor. As a result, a thin stainless wire, used as the third electrode has a strong effect to influence the corona discharge of the slit and corona wire, especially to the negative corona discharge. Higher amounts of the output ozone and ozone yield, about 1.27 and 1.29 times for the negative corona discharge, can be obtained with the third electrode, which reveals the effectiveness of the third electrode.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 방전 플라즈마 유기절연재료 초전도 자성체연구회
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• pp.115-119
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• 2004

This paper is investigated about the effect of vibration of the water surface for hydrogen gas generation by non-thermal plasma. The vibration of the water surface is more powerful with increasing applied voltage. In this experimental reactor which is made of multi-needle and plate, the maximum acquired hydrogen production rate is about 6.8[ml/sec]. Although the generation of hydrogen gas is increased with elevating time, it is saturated after specific time due to the volume of reactor and the saturation of taylor cone.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 춘계학술발표대회
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• pp.38.1-38.1
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• 2009

Plasma etching is an essential process for electronic device industries and the particulate contamination during plasma etching has been interested as a big issue for the yield of productivity. The oxynitride glasses have a merit to prevent particulate contamination due to their amorphous structure and plasma etching resistance. The YSiAlON oxynitride glasses with increasing nitrogen content were manufactured. Each oxynitride glasses were fluorine-plasma etched and their plasma etching rate and surface roughness were compared with reference materials such as sapphire, alumina and quartz. The reinforcement mechanism of plasma etching resistance of the YSiAlON glasses studied by depth profiling at plasma etched surface using electron spectroscopy for chemical analysis. The plasma etching rate decreased with nitrogen content and there was no selective etching at the plasma etched surface of the oxynitride glasses. The concentration of silicon was very low due to the generation of SiF4 very volatile byproduct and the concentration of aluminum and yttrium was relatively constant. The elimination of silicon atoms during plasma etching was reduced with increasing nitrogen content because the content of the nitrogen was constant. And besides, the concentration of oxygen was very low on the plasma etched surface. From the study, the plasma etching resistance of the glasses may be improved by the generation of nitrogen related structural groups and those are proved by chemical composition analysis at plasma etched surface of the YSiAlON oxynitride glasses.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2003년도 제24회 학술발표회 초록집
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• pp.205-205
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• 2003