• 한국원자력학회:학술대회논문집
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• 한국원자력학회 2004년도 추계학술발표회 발표논문집
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• pp.785-786
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• 2004

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 춘계학술발표강연 및 논문개요집
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• pp.58-58
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• 2003

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 1998년도 학술발표회논문집
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• pp.134-137
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• 1998

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2006년도 추계학술발표회 초록집
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• pp.16-16
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• 2006

• 반도체디스플레이기술학회지
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• 제7권2호
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• pp.59-62
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• 2008

The Lifetime of OLEDs by ITO/glass substrates cleaning method and cathode deposition method were investigated in the fabrication of green light emitting OLEDs with $Alq_3$-C545T fluorescent system. In our experiments, the optimum cleaning method was obtained at last processing of boiling IPA(isopropyl alcohol). And the optimum deposition methode was obtained at 3 steps deposition rate of Al. The deposition rate of 3 steps progressed changing from $0.5\AA$/sec to $3\AA$/ sec. The green light emitting OLED with plasma treatment at 150W for 2 minutes showed the highest luminance and efficiency of 20000 cd/$m^2$ and 16 lm/W. On the contrary, the OLED device without plasma treatment showed much lower performance with the luminance and efficiency of 3500 cd/$m^2$ and 2 lm/W.

• 마이크로전자및패키징학회지
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• 제11권1호
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• pp.1-6
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• 2004

자동차 전장품의 시험환경 조건이 엄격해짐에 따라, 전장품 개발 기술자들은 이에 부합하는 성능, 신뢰성, 비용 등을 고려한 보다 효과적인 제품 설계를 위해 노력하고 있다. 본 논문에서는 ECM 알루미나 기판의 플라즈마 세척 영향과 리플로우 후 Sn-37wt%Pb 솔더와 패드 접합부 계면에서 형성되는 금속간 화합물을 관찰하였다. 기판의 플라즈마 세척은 계면 접착력을 저해하였던 C에 의한 유기 잔류물 층이 제거되어 계면 접착력을 향상시키는 효과가 있다. 또한 AFM 분석 결과 도체 패드의 표면 거칠기는 304 nm에서 330 m로 증가하였다. 리플로우 과정에서 솔더와 TiWN/Cu 패드 계면에서 형성된 $Cu_6/Sn_5$는 리플로우 횟수가 증가할 수록 결정립의 크기도 조대화되었다. 솔더와 Ag-Pd 도체패드 계면에서는 세포질 형태의 $Ag_3Sn$화합물이 관찰되었다. $Ag_3Sn$은 지름이 약 0.1∼0.6 $\mu\textrm{m}$이며, 솔더 내부에서는 침상 모양도 관찰되었다.

• 공업화학
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• 제19권6호
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• pp.640-644
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• 2008

저온 플라스마 공정을 이용하여 알루미늄 표면에 묻은 윤활유를 세정하였다. 아르곤이 혼합된 산소 플라스마를 사용하였으며, 아르곤의 혼합비, 방전전력, negative DC potential 등의 공정변수를 변화시키면서 실험을 수행하였다. 저온 플라스마 세정 후 케이스의 표면을 FTIR과 EDX를 사용하여 분석한 결과 순수 윤활유의 경우 대부분이 20 min 안에 제거되었다. 제거효율은 저온 플라스마 공정조건에 따라 크게 달라졌으며, 산소에 아르곤이 약 30% 혼합된 기체를 사용하여 케이스에 -500 V 이상의 negative DC potential을 걸어주고 300 W로 처리할 때 가장 높은 효율을 보였다. 하지만, 무기물이 함유된 윤활유의 경우에는 어떤 조건에서도 60% 이상의 제거효율을 얻을 수 없었다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제53권12호
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• pp.596-600
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• 2004

In this study, the surface properties of PET film were analyzed after plasma surface treatment. After plasma treatment of surface roughness and XPS were evaluated to analyze the chemical property, while the surface potential decay and surface resistance rate was measured to analyze the electric관 characteristic. When plasma discharge treatment was conducted for less than 10 minutes, the electrical insulating property was improved by evaporation of low molecular weight materials and cleaning of surface. However, when the treatment was conducted for more than 10 minutes, the insulating property was decreased due to excessive discharge energy. Analyses of chemical characteristics showed that 10-minute treatment resulted in increase of C-O and O=C-O bonds. However, when treated for more than 10 minutes. they were relatively decreased.

• 한국표면공학회지
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• 제26권2호
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• pp.71-81
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• 1993

Thed effects of Ar or Oxygen RF plasma treatment on the adhesion behavior of Cr films to polyimide sub-strates have been investigated by using SEM, XRD, AES, and $90^{\circ}$peel test. By applying RF plasma treatment of the polyimide surface prior to metal deposition, the peel adhesion strength of Cu/Cr films sputtered onto the fully cured BPDA-PDA polyimide was highly increased from about 3g/mm to 90 ~ 100g/mm. Improved peel adhesion strength of Cr/polyimide interfaces due to RF plasma treatment was attributed to the contributions from surface cleaning, Cr-polyimide bonding at the interface, and force required for plastic deformation of the film. While the surface topology change of the polyimide caused by RF plasma treatment makes a little contri-bution to the improved adhesion.

• 반도체디스플레이기술학회지
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• 제8권2호
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• pp.15-21
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• 2009

Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.