• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.10 no.6
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• pp.959-967
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• 1999

In this paper, we propose a Linear Prediction Method(LPM) in conjunction with signal enhancement for solving the direction-of-arrival estimation problem of multiple incoherent plane waves incident on a uniform linear array. The basic idea of signal enhancement is that of finding the covariance matrix of given rank that lies closest to a given estimated matrix in Frobenius norm sense. It is well known that LPM has a high-resolution performance in general applications, while it provides a lower statistical performance in lower SNR environment. To solve this problem, the LPM combined with signal enhancement approach is herein proposed. Simulation results are illustrated to demonstrate the better performance of the proposed method than conventional LPM.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.148-149
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• 2008

As infrared light is radiated, the CMOS Readout IC (ROIC) for the microbolometer type infrared sensor detects voltage or current when the resistance value in the bolometer sensor varies. One of the serious problems in designing the ROIC is that resistances in the bolometer and reference resistor have process variation. This means that each pixel does not have the same resistance, causing serious fixed pattern noise problems in sensor operations. In this paper, Reference resistor compensation technique was proposed. This technique is to compensate the reference resistance considering the process variation, and it has the same reference resistance value as a bolometer cell resistance by using a comparator and a cross coupled latch.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.8
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• pp.921-926
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• 2014

In this paper, the characteristics of inset fed microstrip antenna loaded with CSLR(complementary single loop resonator) are studied. Effective permeability parameters of the SLR unit cell is retrieved from simulated scattering parameters, and structure parameters of the SLR unit cell are selected so that effective permeability is negative value at the operating frequency. The optimized inset fed microstrip antenna loaded with SLR for a $3{\times}3$ array in the ground plane of a conventional patch antenna is designed and simulation results of return loss and radiation pattern are shown. At resonant frequency 2.82 GHz, the overall dimension of the proposed antenna is reduced by approximately 56.8% compared to the conventional inset fed antenna. Simulation results are obtained by 3D FEM solver(Ansoft's HFSS).

• Journal of the Korean Society for Precision Engineering
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• v.21 no.1
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• pp.181-188
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• 2004

Structural analysis for materials containing regularly spaced in-homogeneities is usually executed by using averaged material properties. For the homogenization process, a unit cell is defined and loaded somehow, and its response is investigated to evaluate the properties. The imposed loading conditions should accord to the behavior of unit cell immersed in the macroscopic structure in order to guarantee the accuracy of the effective properties. Each unit cell shows periodic variation of strain if the material is loaded uniformly, and in this study, direct implementation of this characteristic behavior is attempted on FE models of unit cell. Conventional finite element analysis tool can be used without any modification, and the boundary of unit cell is constrained in a way that the periodicity is satisfied. The proposed method is applicable to skew arrayed in-homogeneity problems. The flexibility matrix relating tonsorial stress and strain components in skewed rectilinear coordinate system is transformed so that the required engineering constants can be evaluated. Effective properties are computed for the materials with square and skew arrayed circular holes, and its accuracy is examined.

• Journal of Sensor Science and Technology
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• v.27 no.5
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• Journal of Sensor Science and Technology
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• v.16 no.6
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• pp.475-483
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• 2007

This paper proposes a readout integrated circuit (ROIC) for $32{\times}32$ infrared focal plane array (IRFPA) detector, which consist of reference resistor, detector resistor, reset switch, integrated capacitor and operational amplifier. Proposed ROIC is designed using $0.35{\;}{\mu}m$ 2P-4M (double poly four metal) n-well CMOS process parameters. Low noise folded cascode operational amplifier which is a key element in the ROIC showed 12.8 MHz unity-gain bandwidth and open-gain 89 dB, phase margin $67^{\circ}$, SNR 82 dB. From proposed circuit, we gained output voltage variation ${\Delta}17{\};mV/^{\circ}C$ when the detector resistor varied according to the temperature.

• Korean Journal of Optics and Photonics
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• v.7 no.1
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• pp.1-8
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• 1996

Charge-coupled device(CCD) array detectors are widely used in real time modulation transfer function(MTF) measurement systems. This paper presents the characteristics of two-dimensional CCDs used in a real time MTF measurement system for copy lenses. The MTF characteristics of a copy lens measured by this equipment show different results according to the direction of shift register, shutter speed and the amplifier gain of CCDs. An object generator is fabricated to reduce the variation of MTF values for the irradiance nonuniformity in on-axis and off-axis image plane and this MTF equipment is calibrated by using a standard lens.

• Journal of radiological science and technology
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• v.36 no.2
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• pp.157-163
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• 2013

Multileaf collimators whose Pb leaves are moving in two-dimensional directions have been used. We propose a different concept three-dimensional (3D) collimator with 3D shape that is automatically changeable to modulate the radiation dose even for complex tumors in real time. A voxel collimator, including a hinged Pb plane and a 3D assembly of many voxel collimators, was used. In each frame rotation axis, a motor, which was controlled by a circuit with field-programmable gate array (FPGA) board connected with computer, was operated according to a predetermined plan. Simulations of that, which are generally used for planning, were performed and compared with experimental results.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.218-224
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• 2003

This paper describes a novel MEMS integration technique on a CMOS chip. MEMS integration on CMOS circuit has many advantages in view of manufacturing cost and reliability. The surface topography of a CMOS chip from a commercial foundry has 0.9 ${\mu}{\textrm}{m}$ bumps due to the conformal coating on aluminum interconnect patterns, which are used for addressing each MEMS element individually. Therefore, it is necessary to achieve a flat mirror-like CMOS chip fer the microelectromechanical system (MEMS) such as micro mirror array. Such CMOS chip needs an additional thickness of the dielectric passivation layer to ease the subsequent planarization process. To overcome a temperature limit from the aluminum thermal degradation, this study uses RF sputtering of silicon nitride at low temperature and then polishes the CMOS chip together with the surrounding dummy pieces to define a polishing plane. Planarization reduces 0.9 ${\mu}{\textrm}{m}$ of the bumps to less than 25 nm.

• Journal of the Korean Institute of Intelligent Systems
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• v.20 no.3
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• pp.400-405
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• 2010

This paper deals with implementation of intelligent head up display for vehicle safety system. The Implanted new intelligent transport system offer the potential for improved vehicle to driver communication. The most commonly viewed information in a vehicle is from the Head up display, where speed, tachometer, engine RPM, navigation, engine temperature, fuel gauge, turn indicators and warning lights provide the driver with an array of fundamental information. TFT LCD, LCD Back light led, plane mirror, lens and controllers parts were designed to head up display system. Finally, In this paper, we analyze intelligent head up display system for vehicle of driver safety.