• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.630-637
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• 2003

In this paper, a DBM(double balanced mixer) of 2 GHz is implemented on FR4(h=1.6mm, ${\epsilon}_r=4.6$) substrate. The structure of double balanced mixer requires, in general, two talons and a quad diode. For balun, a novel planar balun using microstrip to CPS(Coplanar Strip) is suggested and designed. The suggested balun shows the phase imbalance of $180^{\circ}{\pm}1.5^{\circ}$ and the amplitude imbalance of ${\pm}0.2 dB$ for 1.5 to 2.5 GHz. Using the balun, DBM is successfully implemented, and the measured conversion loss of up/down converter show about 6 dB over the bandwidth. The balun may be applicable for MMIC(Monolithic Microwave Integrated Circuit) DBM with the process supporting backside via though more study.

• Journal of Electrical Engineering and Technology
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• v.10 no.3
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• pp.1154-1161
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• 2015

This paper presents a semi-lumped balun transformer using conventional PCB process and its design theory and geometry for the maximally flat response and wide bandwidth using magnetically coupled LC resonators. The proposed balun is comprised of two pairs of coupled resonators which share one among three LC resonators. It provides an identical magnitude and phase difference of 180° between two balanced ports with DC isolation and an impedance transformation characteristic. Theoretical design and analysis were performed to optimize the inductance and capacitance values of proposed balun device for obtaining the wide bandwidth and maximally flat response in its pass-band. Three balun transformers with a center frequency of 500 MHz were demonstrated for proving the concept of design proposed. They were fabricated by using lumped chip capacitors and planar inductors embedded into a conventional 4-layered PCB substrate. They exhibited a maximum magnitude difference of 0.8 dB and phase difference within 2.4 degrees.

• Journal of Navigation and Port Research
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• v.28 no.4
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• pp.293-297
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• 2004

In this papers, an S-band oscillator of the low phase noise property using a miniaturized micro-strip hairpin shaped ring resonator is presented The substrate has a dielectric constant $\epsilon_\gamma$＝3.5, a thickness h＝0.508 mm, and loss tangent $tan\delta$＝0.002. A designed and fabricated oscillator shows low phase noise performance of 99. 71 dBc/Hz at 100 KHz offset frequency and of output power 19.584 dBm at center frequency 2.450 GHz. This circuit was fabricated with hybrid technique, but can be fully compatible with the MMIC due to its entirely planar structure.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.10a
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• pp.570-572
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• 2012

In this paper, a three-dimensional (3-D) low-loss and wide-band BPF based on low-temperature co-fired ceramic (LTCC) has been presented for mm-wave wireless communication applications. The proposed BPF is designed in a 6-layer LTCC substrate. The double patch resonators are fully integrated into the LTCC dielectrics and vertical via and planar CPW transitions are designed for interconnection between embedded resonators and in/output ports and MMICs, respectively. The designed BPF was fabricated in a 6-layer LTCC dielectric. The fabricated BPF shows a centre frequency (fc) of 53.23 GHz and a 3dB bandwidth of 14.01 % from 49.5 to 56.9 GHz (7.46 GHz). An insertion loss of -1.56 dB at fc and return losses below -10 dB are achieved. Its whole size is $4.7{\times}1.7{\times}0.684mm^3$.

• Journal of the Korean institute of surface engineering
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• v.41 no.6
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• pp.279-286
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• 2008

Numerical analysis is done to investigate which would be the most influencing process parameter in determining the uniformity of deposition thickness in TiN ICP-CVD(inductively coupled plasma chemical vapor deposition). Two configurations of ICP antenna are modeled; side and top planar. Side and top gas inlets are considered with each ICP antenna geometries. Precursor for TiN deposition was TDMAT(Tetrakis Diethyl Methyl Amido Titanium). Two step volume dissociation of TDMAT is used and absorption, desorption and deposition surface reactions are included. Most influencing factors are H and N concentration dissociated by electron impact collisions in plasma volume which depends on the relative positions of gas inlet and ICP antenna generated hot plasma region. Low surface recombination of N shows hollow type concentration, but H gives a bell type distribution. Film thickness at substrate edges is sensitive to gas flow rate and at high pressures getting more dependent on flow characteristics.

• Applied Science and Convergence Technology
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• v.24 no.6
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• pp.262-267
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• 2015

We demonstrate the growth of single-walled carbon nanotubes (SWNTs) using ethylene-based chemical vapor deposition (CVD) and ferritin-induced catalytic particles toward growth temperature reduction. We first optimized the gas composition of $H_2$ and $C_2H_4$ at 500 and 30 sccm, respectively. On a planar $SiO_2$ substrate, high density SWNTs were grown at a minimum temperature of $760^{\circ}C$. In the case of growth using nanoporous templates, many suspended SWNTs were also observed from the samples grown at $760^{\circ}C$; low values of $I_D/I_G$ in the Raman spectra were also obtained. This means that the temperature of $760^{\circ}C$ is sufficient for SWNT growth in ethylene-based CVD and that ethylene is more effective that methane for low temperature growth. Our results provide a recipe for low temperature growth of SWNT; such growth is crucial for SWNT-based applications.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.132-132
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• 2011

The sheet resistance (Rs) of undoped GaN films on AlN/c-plane sapphire substrate was investigated in which the AlN films were grown by R. F. magetron sputtering method. The Rs was strongly dependent on the AlN layer thickness and semi-insulating behavior was observed. To clarify the effect of crystalline property on Rs, the crystal structure of the GaN films has been studied using x-ray scattering and transmission electron microscopy. A compressive strain was introduced by the presence of AlN nucleation layer (NL) and was gradually relaxed as increasing AlN NL thickness. This relaxation produced more threading dislocations (TD) of edge-type. Moreover, the surface morphology of the GaN film was changed at thicker AlN layer condition, which was originated by the crossover from planar to island grains of AlN. Thus, rough surface might produce more dislocations. The edge and mixed dislocations propagating from the interface between the GaN film and the AlN buffer layer affected the electric resistance of GaN film.

• Electrical & Electronic Materials
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• v.10 no.8
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• pp.813-818
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• 1997

In this study the thin film air core and magnetic core inductors consisting of planar coil and/or CoNbZr amorphous magnetic layers on a Si substrate were fabricated as spiral type by using rf magnetron sputtering and wet etching methods. The etchant solution was achieved by iron chloride solution(17.5 mol%) mixed with HF (20 mol%) during 150 sec which etched Cu films and CoNbZr/Cu/CoNbZr multi-layer films. They were about 10${\mu}{\textrm}{m}$ of thickness and 10$\times$10 mm$^2$of size. The properties of thin film magnetic core inductor were 400 nH of Q value at 10 MHz and the resonance frequency was about 300 MHz.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.6
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• pp.412-419
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• 2001

In accordance with the PON(passive optical network) could be setup, effective connections with light sources, optical detectors, and optical fibers are the best sensitive points to represent the efficiency of network. Therefore, in this paper we designed and fabricated optical transceiver connection chip that was consisted of channel waveguide, Y-branch, and CWDM on the 2" BK7 glass substrate. This chip can be used for 1.31/1.55${\mu}{\textrm}{m}$ CWDM network and 1.55${\mu}{\textrm}{m}$ region dense WDM network.work.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.43 no.3
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• pp.478-484
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• 1994

Facing target dc sputtering system developed by Hoshi et al. has simple configuration and high deposition rate under moderate substrate temperature in the range of pressure 5x10S0-4T - 1x10S0-2T torr. In this system, magnetic field should be applied perpendicular to the target surface in order to confine high energy secondary electrons between two targets. Because of this magnetic field, the glow discharge characteristics are very different from dc planar diode system showing some unstable discharge region. In this paper, the glow discharge characteristics of this system have been studied under the condition of Ti targets with Ar-NS12T(10%) as working gas. It is found that this system has stable discharge region under the discharge current density of 15-30(mA/cmS02T). The plasma density and electron temperature are in the range of 10S010Y - 10S011T(CMS0-3T) and 2.5-5(eV), respectively.