• Title/Summary/Keyword: Pin-up

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A Reconfigurable Circularly Polarized Microstrip Antenna on a Cross-Shape Slotted Ground (십자형 접지면 슬롯을 이용한 재구성 가능한 원형 편파 마이크로스트립 안테나)

  • Yoon, Won-Sang;Han, Sang-Min;Lee, Dong-Hyo;Lee, Kyoung-Joo;Pyo, Seong-Min;Kim, Young-Sik
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.21 no.1
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    • pp.46-52
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    • 2010
  • A compact circular microstrip patch antenna with a switchable circular polarization(CP) is proposed at 2.4 GHz. An unequal cross-shaped slot on a ground plane is utilized as a perturbation. By switching pin diodes mounted on the slot, the CP sense of each antenna can be simply switched from left-handed(LH) CP to right-handed(RH) CP vice versa. Since the perturbation can be made on the ground plane and no bias circuit is required on the patch side, the bias circuit has not effect on the main beam radiation. From the experimental results, the impedance bandwidth and CP bandwidth of the proposed antenna have shown up to 150 MHz and 35 MHz, respectively. The peak gain of the proposed antenna is 1.7 dBi for both CP senses.

THREE-DIMENSIONAL FLOW PHENOMENA IN A WIRE-WRAPPED 37-PIN FUEL BUNDLE FOR SFR

  • JEONG, JAE-HO;YOO, JIN;LEE, KWI-LIM;HA, KWI-SEOK
    • Nuclear Engineering and Technology
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    • v.47 no.5
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    • pp.523-533
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    • 2015
  • Three-dimensional flow phenomena in a wire-wrapped 37-pin fuel assembly mock-up of a Japanese loop-type sodium-cooled fast reactor, Monju, were investigated with a numerical analysis using a general-purpose commercial computational fluid dynamics code, CFX. Complicated and vortical flow phenomena in the wire-wrapped 37-pin fuel assembly were captured by a Reynolds-averaged Navier-Stokes flow simulation using a shear stress transport turbulence model. The main purpose of the current study is to understand the three-dimensional complex flow phenomena in a wire-wrapped fuel assembly to support the license issue for the core design. Computational fluid dynamics results show good agreement with friction factor correlation models. The secondary flow in the corner and edge subchannels is much stronger than that in an interior subchannel. The axial velocity averaged in the corner and edge subchannels is higher than that averaged in the interior subchannels. Three-dimensional multiscale vortex structures start to be formed by an interaction between secondary flows around each wire-wrapped pin. Behavior of the large-scale vortex structures in the corner and edge subchannels is closely related to the relative position between the hexagonal duct wall and the helically wrapped wire spacer. The small-scale vortex is axially developed in the interior subchannels. Furthermore, a driving force on each wire spacer surface is closely related to the relative position between the hexagonal duct wall and the wire spacer.

Strength of Stainless Steel Pin-reinforced Composite Single-lap Joints (금속 핀으로 보강된 복합재 단일겹침 체결부의 강도 연구)

  • Lee, Byeong-Hee;Park, Yong-Bin;Kweon, Jin-Hwe;Choi, Jin-Ho;Choi, Ik-Hyeon;Chang, Sung-Tae
    • Composites Research
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    • v.25 no.3
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    • pp.65-69
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    • 2012
  • The main objective of this study is to investigate the effect of metal z-pinning on the failure behavior of cocured composite single-lap joints. Three different pin diameters (0.3, 0.5, and 0.7 mm) and three pin areal densities (0.5, 2.0, and 4.0%) were examined. The specimens were fabricated by T700-12K-31E#2510 unidirectional prepreg from Toray. Stainless steel pins were used for z-pinning. Test results showed that except one case with extremely low pin density of 0.5%, all other z-pinned joints exhibited lower initial crack stresses than those of the unpinned joint. However the ultimate strength of the z-pinned joint increased up to 45% at most. Furthermore, even after the complete failure of the joint, the z-pins sustained the carried load to a certain degree experiencing large deformation and provided the stable fracture behavior for the composite joint.

Damage Pattern and Operation Characteristics of a Thermal Magnetic Type MCCB according to Thermal Stress (열동전자식 MCCB의 열적 스트레스에 따른 소손 패턴 및 작동 특성)

  • Lee, Jae-Hyuk;Choi, Chung-Seog
    • Journal of the Korean Society of Safety
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    • v.28 no.3
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    • pp.69-73
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    • 2013
  • The purpose of this paper is to analyze the carbonization pattern and operation characteristics of an MCCB. The MCCB is consisted of the actuator lever, actuator mechanism, bimetallic strip, contacts, up and down operator, arc divider or extinguisher, metal operation pin, terminal part, etc. When the actuator lever of the MCCB is at the top or the internal metal operation pin is in contact with the front part, the MCCB is turned on or off. It means trip state if the actuator lever or the internal metal operation pin moves to back side. In the UL 94 vertical combustion test, white smoke occurred from the MCCB when an average of 17~24 seconds elapsed after the MCCB was ignited and black smoke occurred when an average of 45~50 seconds elapsed. It took 5~6 minutes for the MCCB surface to be half burnt and took an average of 8~9 minutes for the MCCB surface to be entirely burnt. In the UL 94 test, the MCCB trip device operated when an average 7~8 minutes elapsed. If the MCCB trip has occurred, it may have been caused by an electrical problem such as a short-circuit, overcurrent, etc., as well as fire heat. From the entire part combustion test according to KS C 3004, it was found that the metal operation pin could be moved to the MCCB trip position without any electrical problems.

Formation Mechanisms of Sn Oxide Films on Probe Pins Contacted with Pb-Free Solder Bumps (무연솔더 범프 접촉 탐침 핀의 Sn 산화막 형성 기제)

  • Bae, Kyoo-Sik
    • Korean Journal of Materials Research
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    • v.22 no.10
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    • pp.545-551
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    • 2012
  • In semiconductor manufacturing, the circuit integrity of packaged BGA devices is tested by measuring electrical resistance using test sockets. Test sockets have been reported to often fail earlier than the expected life-time due to high contact resistance. This has been attributed to the formation of Sn oxide films on the Au coating layer of the probe pins loaded on the socket. Similar to contact failure, and known as "fretting", this process widely occurs between two conductive surfaces due to the continual rupture and accumulation of oxide films. However, the failure mechanism at the probe pin differs from fretting. In this study, the microstructural processes and formation mechanisms of Sn oxide films developed on the probe pin surface were investigated. Failure analysis was conducted mainly by FIB-FESEM observations, along with EDX, AES, and XRD analyses. Soft and fresh Sn was found to be transferred repeatedly from the solder bump to the Au surface of the probe pins; it was then instantly oxidized to SnO. The $SnO_2$ phase is a more stable natural oxide, but SnO has been proved to grow on Sn thin film at low temperature (< $150^{\circ}C$). Further oxidation to $SnO_2$ is thought to be limited to 30%. The SnO film grew layer by layer up to 571 nm after testing of 50,500 cycles (1 nm/100 cycle). This resulted in the increase of contact resistance and thus of signal delay between the probe pin and the solder bump.

Reconfigurable Circularly Polarized Microstrip Antenna on a Slotted Ground

  • Yoon, Won-Sang;Han, Sang-Min;Pyo, Seong-Min;Lee, Jae-Hoon;Shin, In-Chul;Kim, Young-Sik
    • ETRI Journal
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    • v.32 no.3
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    • pp.468-471
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    • 2010
  • A compact square patch antenna with reconfigurable circular polarization (CP) at 2.4 GHz is proposed. Circular polarization is generated by an arc-shaped slot on the ground plane. In order to switch the CP orientation, the current flow direction of the patch is reconfigured via the PIN diodes mounted on the slot. As the slot and bias circuit are not placed on the patch side, the proposed antenna radiates a CP wave without alteration in the main beam direction. From the experimental results, the impedance and CP bandwidths of the proposed antenna have been demonstrated for up to 80 MHz and 25 MHz, respectively.

Transferrable single-crystal silicon nanomembranes and their application to flexible microwave systems

  • Seo, Jung-Hun;Yuan, Hao-Chih;Sun, Lei;Zhou, Weidong;Ma, Zhenqiang
    • Journal of Information Display
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    • v.12 no.2
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    • pp.109-113
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    • 2011
  • This paper summarizes the recent fabrication and characterizations of flexible high-speed radio frequency (RF) transistors, PIN-diode single-pole single-throw switches, as well as flexible inductors and capacitors, based on single-crystalline Si nanomembranes transferred on polyethylene terephthalate substrates. Flexible thin-film transistors (TFTs) on plastic substrates have reached RF operation speed with a record cut-off/maximum oscillation frequency ($f_T/f_{max}$) values of 3.8/12 GHz. PIN diode switches exhibit excellent ON/OFF behaviors at high RF frequencies. Flexible inductors and capacitors compatible with high-speed TFT fabrication show resonance frequencies ($f_{res}$) up to 9.1 and 13.5 GHz, respectively. Robust mechanical characteristics were also demonstrated with these high-frequency passives components.

Sliding Wear and Corrosion Resistance of Copper-based Overhead Catenary for Traction Systems

  • Kwok, C.T.;Wong, P.K.;Man, H.C.;Cheng, F.T.
    • International Journal of Railway
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    • v.3 no.1
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    • pp.19-27
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    • 2010
  • In the present study, the electrical sliding wear and corrosion resistance of pure copper (Cu) and six age-hardened copper alloys (CuCr, CuZr, CuCrZr, CuNiSiCr, CuBe and CuBeNi) were investigated by a pin-on-disc tribometer and electrochemical measurement. Various copper-based alloys in the form of cylindrical pin were forced to slide against a counterface stainless steel disc in air under unlubricated condition at a sliding velocity of 31 km/h under normal load up to 20 N with and without electric current. The worn surface of and wear debris from the specimens were studied by scanning electron microscopy. Both mechanical wear and electrical arc erosion were the wear mechanisms for the alloys worn at 50 A. Owing to its good electrical conductivity, high wear and corrosion resistance, CuCrZr is a promising candidate as the overhead catenary material for electric traction systems.

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$p^+-cap$ 구조를 갖는 실리콘 pin 다이오드의 설계와 제작

  • 장지근;황용운;조재욱;임용규
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2003.05a
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    • pp.68-70
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    • 2003
  • New Si pin photodiodes with $p^+-cap$ region have been designed and fabricated for the application in a PDIC of the optical pick-up system. The fabricated devices were designed with the incident optical window of $120\mu\textrm{m}$ and were classified into three structures according to <$p^+-cap$ dimensions. As the result of experiments, the devices with the $p^+$-cap dimension of $0\mu\textrm{m}$(no cap), $65\mu\textrm{m}$, and $120\mu\textrm{m}$ showed the sensitivity of 1.0 A/W, 0.86 A/W, and 0.6 A/W, respectively.

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CFD investigation of a JAEA 7-pin fuel assembly experiment with local blockage for SFR

  • Jeong, Jae-Ho;Song, Min-Seop
    • Nuclear Engineering and Technology
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    • v.53 no.10
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    • pp.3207-3216
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    • 2021
  • Three-dimensional structures of a vortical flow field and heat transfer characteristics in a partially blocked 7-pin fuel assembly mock-up of sodium-cooled fast reactor have been investigated through a numerical analysis using a commercial computational fluid dynamics code, ANSYS CFX. The simulation with the SST turbulence model agrees well with the experimental data of outlet and cladding wall temperatures. From the analysis on the limiting streamline at the wall, multi-scale vortexes developed in axial direction were found around the blockage. The vortex core has a high cladding wall temperature, and the attachment line has a low cladding wall temperature. The small-scale vortex structures significantly enhance the convective heat transfer because it increases the turbulent mixing and the turbulence kinetic energy. The large-scale vortex structures supply thermal energy near the heated cladding wall surface. It is expected that control of the vortex structures in the fuel assembly plays a significant role in the convective heat transfer enhancement. Furthermore, the blockage plate and grid spacer increase the pressure drop to about 36% compared to the bare case.