• 설비공학논문집
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• 제19권5호
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• pp.418-425
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• 2007

The power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Therefore, suitable heat dissipation has become one of the primary limiting factors to ensure the guaranteed performance and reliable operation of the electronic devices. A pin-fin array which may be considered as a porous medium could be used as an alterative cooling system of the electronic equipment. The aim of the present study is to investigate the forced-convective heat transfer characteristics of pin-fin heat exchangers. Convective heat transfer through the pin~fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristic is investigated and compared with the Previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• 융복합기술연구소 논문집
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• 제5권1호
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• pp.27-31
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• 2015

A Pin-fin array is widely used to enhance the heat transfer in the internal cooling passage. The heat transfer distribution around the pin-fin is varied by the horseshoe vortex and flow separation. The difference of heat transfer coefficient induces the large thermal stress, which is one of the major reasons to break of hot components. So, it is required to enhance the heat transfer on the back side of pin-fin to solve the thermal stress problem. This study suggests the pin-fin with inclined jet hole and complex pin-fin/dimple array to enhance the heat transfer on the back side of pin-fin. The heat transfer coefficient is predicted by the numerical analysis, which is performed by CFX 14.0. The numerical results are obtained at Reynolds number, 10,000. The results show that the heat transfer on the back side of pin-fin is increased in both cases. Beside, the wake, which comes from dimple and jet, helps to develop the horseshoe vortex and increase the heat transfer on the next row pin-fin.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2408-2413
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• 2007

Since the heat generation in a chip increases as the components are miniaturized and the computing speed becomes faster, suitable heat dissipation has become one of the primary limiting factors to ensure the reliable operation of the electronic devices. A pin-fin array could be used as an alterative cooling system of the electronic equipment. In this study, convective heat transfer through the pin-fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristics is investigated and compared with the previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.31-36
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• 2003

Recently, the power consumption and heat generation in an electronic equipment increase as the components are miniaturized and the computing speed becomes faster. Effective cooling method is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the cooling characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer characteristics. The results are compared with the experimental data or correlations of several researchers for the channel flow with pin-fin arrays.

• 설비공학논문집
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• 제16권7호
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• pp.623-629
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• 2004

Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices, which result in more heat generation by the electronic system. Present cooling technology may not be adequate for the thermal management in the current state-of-the-art electronic equipment. Forced convective heat transfer in a channel filled with pin-fin array is studied experimentally in this paper as an alternative cool-ing scheme for a high heat-dissipating equipment. Various configurations of the pin-fin array are selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. In the low porosity region, interfacial heat transfer and pressure drop seem to show different trend compared to the conventional heat transfer process.

• 한국추진공학회지
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• 제24권5호
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• pp.43-55
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• 2020

가스터빈 블레이드의 핀-휜 배열의 냉각 성능을 향상시키기 위하여 분절핀을 설치하여 효과를 분석하였다. 분절핀의 위치에 따른 유동 및 열전달 특성 변화를 수치해석을 통해 분석하였다. 분절핀이 설치되지 않은 엇갈림 핀-휜 배열인 기존형상 와 분절핀이 X₂/D_p=1.25 간격 떨어진 분절핀적용형상 1과 X₃/D_p=1.75 간격 떨어진 분절핀적용형상 2 를 비교하였다. 해석 결과 분절핀의 설치로 인해 핀-휜 배열 전단부에서 발생하는 말발굽와류의 세기가 강화되는 것을 확인하였다. 또한 핀-휜 배열 후단부에서 발생하는 멤돌이 와류의 세기가 약해지는 것을 확인하였다. 이로 인해 바닥면의 열전달 분포가 크게 상승하는 것을 확인 하였다. 반면 분절핀의 설치로 인해 압력손실은 증가하였으나, 열성능계수는 분절핀 적용형상 2 에서 최대 23.8% 가량 증가하는 것을 확인하였다. 이를 통해 향후 가스터빈 핀-휜 냉각 유로 설계 시 분절핀을 설치하면 냉각 성능이 증대 될 것으로 판단된다.

• 청정기술
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• 제14권4호
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• pp.265-270
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• 2008

본 연구는 전자기기 모듈의 공기 냉각용 정렬 배열된 핀-휜 열교환기에서 휜 형상의 변화가 유동 및 열전달에 미치는 영향을 수치적으로 해석하였다. 휜 단면의 기하학적 형상은 세 가지로서 원형, 타원형, 그리고 날개형이었다. 취급된 모든 휜의 단면적과 높이는 서로 동일하지만, 그 표면적만은 서로 달랐다. 그 결과, 휜의 표면적, 열전달계수, 그리고 열전달 성능은 휜의 형상에 크게 의존하였다. 적절한 형상을 갖는 휜의 열전달 성능은 세 가지 형태의 핀-휜 중에서 날개형 핀-휜이 가장 우수하였다. 이러한 결과로부터 공기의 유량증가측은 휜의 밀도증가 없이 적절한 핀-휜의 형상변화만으로도 핀-휜 열교환기의 냉각성능을 크게 향상 시킬 수 있음을 알 수 있었다.

• 대한기계학회논문집B
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• 제41권6호
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• pp.381-387
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• 2017

수소화붕소나트륨은 안정적으로 수소가 저장된 물질이며, 촉매반응으로 수소를 용이하게 분리할 수 있다. 본 연구에서는 탈수소 반응률을 높이기 위해 비표면적이 큰 마이크로 pin fin 화학반응기를 제작하여 수소화붕소나트륨 수용액의 압력강하 및 탈수소 화학반응 실험을 수행하였다. 나노공정을 이용하여 실리콘웨이퍼에 높이 $300{\mu}m$, 직경 $50{\mu}m$의 pin fin을 축간격 1.3, 횡간격 1.5으로 엇갈림 배열하였다. 수소화붕소나트륨 수용액은 5~20 wt.% 농도로 Re수 1~60으로 공급되었으며, 초고속카메라를 이용하여 탈수소반응 유동양상을 관찰하였다. 실험 결과 마이크로 pin fin 화학반응기는 동일 수력학적직경을 가지는 직관 마이크로채널 화학반응기보다 화학반응 성능이 2.45배 우수한 반면, 압력강하는 1.5배 증가하였다.

• 설비공학논문집
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• 제18권6호
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• pp.459-467
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• 2006

Rapid development of electronic technology requires small size, high density packaging and high power in the electronic devices, which results in more heat generation. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the current state-of-the-art electronic equipment. The aim of the present study is to find out the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices through the analysis and experiment. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. Experimental results are compared with the analyses and correlations of several researchers. Finally, the design guide are provided for the required pressure drop and/or the heat transfer characteristics of the heat exchanger.

• 설비공학논문집
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• 제9권3호
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• pp.259-267
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• 1997

Average heat transfer coefficients and friction coefficients have been measured from staggered short pin-fin arrays to investigate the effect of fin shapes. Flow entering into the test section is a fully developed duct flow and the Reynolds number ranges from 5,000 to 25,000 based on fin diameter and average approaching velocity. The fin has three different shapes; uniform-diameter circular fin, two stepped-diameter circular fins. Average heat transfer rates change slightly with the fin shapes. However, friction loss(pressure loss) for the stepped-diameter fins is significantly less than that for the uniform-diameter fin. This results indicate that the stepped-diameter fin arrays in duct flow enhance heat transfer rates largely based on unit pumping power.